X-On Electronics has gained recognition as a prominent supplier of conga-PA3/HSP-B Heat Sinks across the USA, India, Europe, Australia, and various other global locations. conga-PA3/HSP-B Heat Sinks are a product manufactured by Congatec. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

conga-PA3/HSP-B Congatec

conga-PA3/HSP-B electronic component of Congatec
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Part No.conga-PA3/HSP-B
Manufacturer: Congatec
Category: Heat Sinks
Description: Heat Sinks Heatspreader solution for conga-PA3. All standoffs are with 2.7 mm bore hole.
Datasheet: conga-PA3/HSP-B Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 41.3437 ea
Line Total: USD 41.34 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 41.3437
5 : USD 41.3437
10 : USD 40.7077
25 : USD 38.1634

   
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RoHS - XON
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We are delighted to provide the conga-PA3/HSP-B from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the conga-PA3/HSP-B and other electronic components in the Heat Sinks category and beyond.

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INDUSTRIAL PICO-ITX conga-PA3 - Compact and complete for small Industry 4.0 rd - 3 Generation Intel Atom / Celeron Processor - Low Power 5 to 10 Watt TDP - Enhanced Intel HD Graphics Generation 7 - Long life components for 24/7 embedded use - Smallest SBC computing and connecting device - Extended Temperature Formfactor pico-ITX Singleboard Computer 100x72 mm CPU Intel Atom E3845 1.91 GHz Quad Core 2 MB L2 Cache 10W TDP Intel Atom E3826 1.46 GHz Dual Core 1 MB L2 Cache 7W TDP Other Variants by request DRAM Memory Single Channel up to 4GB onboard DDR3L with 1333 MHz Chipset Integrated in SoC Ethernet LAN Gbit / 100 Mbit / 10 Mbit Intel Gigabit Ethernet i211 controller (i210 for industrial temperature) Sound High Definition Audio Interface* Realtek ALC 888S-VD 7.1-channel Graphics Next Generation Intel HD Graphics Graphic Interfaces 1x 24-bit Dual Channel LVDS Interface (via eDP to LVDS converter PTN3460) 1x DisplayPort DP++ resolution up 1920x1200 with 60Hz Internal Connectors 1x mPCIe Half Size 1x mPCIe Half Size shared with mSATA 1x SATA (3G) (no SATA power) 2x USB 2.0 1x LVDS* 2x24bit 1x Backlight power connector 1x Line Out 1xMic In 1x S/PDIF Out 1x Power In (+12V) 1x COM (RS-232) 1x Fan Connector 1x Feature Connector micro SD Card MIPI-CSI 2.0 External Connectors 1x DisplayPort DP++ 1x LAN RJ45 2x USB 3.0 1x DC-In (external input)* (Frontpanel) congatec embedded Multi-Stage Watchdog non-volatile User Data Storage Manufacturing and Board Information Board Statistics BIOS Setup Data Backup Controller IC bus (fast mode 400 kHz multi-master) Power Loss Control Embedded BIOS AMI Aptio 2.X (UEFI) BIOS SM-BIOS BIOS Update Logo Boot Quiet Boot HDD Password Power Specification Power Supply 12V 1 x FAN RTC battery* Operating Systems Microsoft Windows 10 Microsoft Windows 10 IoT Enterprise Microsoft Windows 10 IoT Core Microsoft Windows 8 Microsoft Windows 7 Linux Microsoft Windows 7/8 embedded Standard Android Yocto MoonIsland / WindRiver IDP Operating Temperature: Commercial: 0 .. +60C Industrial: -40* + 85C Humidity Operating: Operating: 10 - 90% r. H. non cond. Size 100 x 72 mm (3.9 x 2,8) * see User-Manual for detailed informations www.congatec.comconga-PA3 Connectors I2C MIPI-CSI 2.0 GPIO USB Audio micro SD Card Buttons, LEDs mPCIe (half size) mPCIe / mSATA (half size) SATA RTC battery Backlight Power input CPU FAN LVDS DC-Input 2x USB 3.0 DP++ Ethernet conga-PA3 Block diagram SATA0 Single Channel SATA0 Onboard DDR3L Intel Bay Trail SoC Memory PCIe0 mPCIe (half-size) COMPUTE UNIT USB3 SPI Tri-gate 3D 22nm Single/Dual/Quad Core SPI Flash PCIe1 1MB L2 Cache Shared By 2 Cores MUX 1 mSATA/mPCIe * 64 Architecture Virtualization (VT-x) SDIO SATA1 Micro SD Card SSE4.2 AES-NI Thermal Mgmt. USB0 RS232 UART 3 Serial Port * 3 Transceiver * USB 3.0 Hub 2x USB3.0 SuperSpeed SoC TRANSACTION ROUTER Memory Controller Feature Connectors Single Channel Low Power 2 (I C/Watchdog) USB1,2 2x USB 2.0 Display Interfaces DisplayPort 1.2 DDI (4x GPIOs) PCIe2 embedded DP 2 Intel i211 * Ethernet (Buttons/LEDs) Multimedia Features congatec LPC Board Controller 3D OCL 1.2 DDI0 3-wire DP++ MPEG-2 OpenCL 1.2 CPU FAN H.264 OpenGL 3.0 DDI1 2x24 bit eDP to LVDS LVDS Backlight WMV9 OpenGLES 2.0 LVDS Bridge MJPEG DirectX 11 MIPI-CSI SPDIF Out MIPI-CSI 2.0 HD Audio HDA MIC ALC888S-VD INTEGRATED I/O I/O Interfaces Line Out PCIe LPC Bus GPIOs +3.3V Battery SATA USB 2.0 USB 3.0 High Definition Audio Power IN (2-Pin Connector) Over-voltage & ESD Protection Power IN (DC Power Jack) External I/O Internal I/O 1 * The mSATA/mPCIe connector supports both mPCIe and mSATA devices. The devices are detected automatically. 2 * Industrial variants are equipped with Intel i210 controller. 3 * Revision B.x and later are equipped with a multiprotocol transceiver. www.congatec.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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