X-On Electronics has gained recognition as a prominent supplier of conga-TS170/CSP-HP-B Heat Sinks across the USA, India, Europe, Australia, and various other global locations. conga-TS170/CSP-HP-B Heat Sinks are a product manufactured by Congatec. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

conga-TS170/CSP-HP-B Congatec

conga-TS170/CSP-HP-B electronic component of Congatec
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Part No.conga-TS170/CSP-HP-B
Manufacturer: Congatec
Category: Heat Sinks
Description: Heat Sinks Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Datasheet: conga-TS170/CSP-HP-B Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 2.8106 ea
Line Total: USD 2.81 
Availability - 2
Ship by Tue. 26 Nov to Mon. 02 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2
Ship by Tue. 26 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 2.8106

2
Ship by Tue. 26 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 14.7739

   
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We are delighted to provide the conga-TS170/CSP-HP-B from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the conga-TS170/CSP-HP-B and other electronic components in the Heat Sinks category and beyond.

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SERVER-CLASS EMBEDDED PERFORMANCE conga-TS170 th - 6 Generation Intel Core processor - Intel Gen9 HD Graphics with HEVC (H.265) support up to Intel Iris Pro Graphics P580 - ECC memory support - Up to 32 GByte dual channel DDR4 memory - Intel Xeon processors for data center applications Formfactor COM Express Basic, (95 x 125 mm), Type 6 Connector Pinout TM CPU Intel Xeon E3-1578LV5 Quad Core 2.0 / 3.4 GHz 8 MB Cache 45W TDP, 35W cTDP Iris Pro P580 Graphics 0.35-1.0 GHz TM Intel Xeon E3-1558LV5 Quad Core 1.9 / 3.3 GHz 8 MB Cache 45W TDP, 35W cTDP Iris Pro P555 Graphics 0.35-1.0 GHz TM Intel Xeon E3-1515MV5 Quad Core 2.8 / 3.7 GHz 8 MB Cache 45W TDP, 35W cTDP Iris Pro P580 Graphics 0.35-1.0 GHz Intel Xeon E3-1505MV5 Quad Core 2.8 / 3.7 GHz 8 MB Cache 45W TDP, 35W cTDP HD P530 Graphics 0.35-1.05 GHz Intel Xeon E3-1505LV5 Quad Core 2.0 / 2.8 GHz 8 MB Cache 25W TDP HD P530 Graphics 0.35-1.0 GHz TM Intel Core i7-6820EQ Quad Core 2.8 / 3.5 GHz 8 MB Cache 45W TDP HD 530 Graphics 0.35-1.0 GHz TM Intel Core i7-6822EQ Quad Core 2.0 / 2.8 GHz 8 MB Cache 25W TDP HD 530 Graphics 0.35-1.0 GHz TM Intel Core i5-6440EQ Quad Core 2.7 / 3.7 GHz 6 MB Cache 45W TDP HD 530 Graphics 0.35-1.0 GHz TM Intel Core i5-6442EQ Quad Core 1.9 / 2.7 GHz 6 MB Cache 25W TDP HD 530 Graphics 0.35-1.0 GHz TM Intel Core i3-6100E Dual Core 2.7 GHz 3 MB Cache 35W TDP HD 530 Graphics 0.35-0.95 GHz TM Intel Core i3-6102E Dual Core 1.9 GHz 3 MB Cache 25W TDP HD 530 Graphics 0.35-0.95 GHz Intel Celeron G3900E Dual Core 2.4 GHz 2 MB Cache 35W TDP HD 530 Graphics 0.542-0.792 GHz Intel Celeron G3902E Dual Core 1.6 GHz 2 MB Cache 25W TDP HD 510 Graphics 0.35-0.95 GHz Intel Turbo Boost Technology Intel Hyper-Threading Technology (Intel HT Technology) Intel Advanced Vector Extensions 2.0 (Intel AVX2) Intel Advanced Encryption Standard New Instructions (Intel AES-NI) Integrated dual channel memory controller up to 34,1 GByte/sec. memory bandwidth Integrated Intel Gen9 HD Graphics with frequency up to 1GHz Intel Clear Video HD Technology Intel Virtualization Technology (Intel VT) Intel Trusted Execution Technology (Intel TXT) Intel Secure Key DRAM 2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32GByte dual channel, Intel Xeon and Intel Core i3 with ECC support Chipset Mobile Intel 100 Series Chipset Ethernet Intel i219-LM GbE LAN Controller with AMT 11 support I/O Interfaces 8x PCI Express gen. 3.0 lanes 4x Serial ATA Gen 3 4x USB 3.0 (XHCI) 8x USB 2.0 (XHCI) 1x PEG x16 Gen 3 LPC bus (no DMA) IC bus (fast mode, 400 kHz, multi-master) 2x UART Sound Digital High Definition Audio Interface with support for multiple audio codecs Graphics Intel Gen9 HD Graphics Engine with OpenCL 2.0, OpenGL 4.3 and DirectX12 (for Windows 10) support up to three independent displays High performance hardware MPEG-2 decoding WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support 40 MBit/s HEVC, VP8, VP9 and VDENC encoding LVDS Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface VESA and openLDI colour mappings resolutions up to 1920x1200 (eDP optional) Automatic Panel Detection via EDID/EPI Digital Display Interface (DDI) 3x DDI (TMDS/DisplayPort 1.2) with support for Multi-Stream Transport (MST) resolutions up to 4k VGA congatec Board Controller Multi Stage Watchdog non-volatile User Data Storage Manufacturing and Board Information Board Statistics BIOS Setup Data Backup IC bus (fast mode, 400 kHz, multi-master) Power Loss Control Embedded BIOS Features AMI Aptio UEFI 2.x firmware 8/16 MByte serial SPI firmware flash Security The conga-TS170 can be optionally equipped with a discrete Trusted Platform Module (TPM 1.2 / 2.0). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels. Power Management ACPI 4.0 with battery support Operating Systems Microsoft Windows 10 Microsoft Windows 10 IoT Enterprise Microsoft Windows 7 Linux Microsoft Windows embedded Standard Power Consumption See Users Guide for full details Temperature Operating: 0 .. +60C Storage: -20 .. +80C Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond. Size 95 x 125 mm (3.74 x 4.92) www.congatec.comconga-TS170 Block diagram th 6 Gen. Intel Core processor Aux Channel CPU Platform COM Express COM Express TXT Turbo Boost 2.0 Technology Type 6 Type 6 HT Technology AMT 11.0 AES-NI VT A-B Connector AVX2 SSE 4.2 TSX C-D Connector DP to VGA Integrated Intel HD Graphics DDI3 * Display Interface DDI2 DDI1 DisplayPort++ up to 4K resolution PCIe Gen. 3 PEG x16 VGA Hardware Graphics Accelerators LVDS/eDP eDP to LVDS eDP LVDS/eDP 3D Vector Graphics Bridge 2D DXVA2 Video Codecs APIs PECI XDP MPEG-2 OpenCL 2.1 2x SO-DIMM (X1/X2) H.265 OpenGL 4.4 Dual Channel DDR4 WMV9 DirectX 12 Multimedia Features ASRC SM Bus DMI Gen3 PECI HDA HDA I/F Mobile Intel 100 Series PCH-H USB 3.0 Port 0 - 3 USB 2.0 USB Port 0..7 PCIe Gen. 3 PCIe Gen. 3 PCIe lane 0 - 5 PCIe lane 6 - 7 Ethernet 10/100/1000 MGMNT Ethernet Intel i219LM I/O Interfaces SPI SPI Flash 0 PCIe LPC Bus HDA congatec System (TX BC) Management congatec custom SPI SATA 6G SATA USB 2.0 USB 3.0 Controller SATA Port 0 - 3 LPC LPC Bus TPM SM Bus UART0/1 SER0/1 GPIOs/SDIO LID /SLEEP FAN control I2C Bus See manual for restrictions. * www.congatec.com

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7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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