X-On Electronics has gained recognition as a prominent supplier of CONGA-TS67/I7-2655LE Computer-On-Modules - COM across the USA, India, Europe, Australia, and various other global locations. CONGA-TS67/I7-2655LE Computer-On-Modules - COM are a product manufactured by Congatec. We provide cost-effective solutions for Computer-On-Modules - COM, ensuring timely deliveries around the world.

CONGA-TS67/I7-2655LE Congatec

CONGA-TS67/I7-2655LE electronic component of Congatec
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Part No.CONGA-TS67/I7-2655LE
Manufacturer: Congatec
Category: Computer-On-Modules - COM
Description: Computer-On-Modules - COM COM Express Type 6 Basic module with Intel Core i7-2655LE Dual Core Processor with 2.0GHz, 4MB L2 cache and 1333MT/s dual channel DDR3 memory interface.
Datasheet: CONGA-TS67/I7-2655LE Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 1382.42
5 : USD 1381.0419
10 : USD 1363.3359
25 : USD 1329.25
N/A

Obsolete
   
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Product Category
RoHS - XON
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Memory Size
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Mxhts
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We are delighted to provide the CONGA-TS67/I7-2655LE from our Computer-On-Modules - COM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the CONGA-TS67/I7-2655LE and other electronic components in the Computer-On-Modules - COM category and beyond.

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HIGH PERFORMANCE conga-TS67 - COM Express Type 6 - Based on 2nd Generation Intel Core low-power processors - Soldered CPUs for higher shock resistance - High end graphics performance - Intel Turbo Boost Technology 2.0 Formfactor COM Express Basic (95 x 125 mm) Type 6 Connector Layout CPU Intel Celeron 807UE 1x 1.0GHz 1MB L3 cache 1333MT/s TDP 10 W Intel Celeron 827E 1x 1.4GHz 1.5MB L3 cache 1333MT/s TDP 17 W Intel Celeron 847E 2x 1.1GHz 2MB L2 cache 1333MT/s TDP 17 W Intel Core i3-2340UE 2x 1.3GHz 3MB L2 cache 1333MT/s TDP 17 W Intel Core i7-2610UE 2x 1.5GHz 3MB L2 cache 1333MT/s TDP 17 W Intel Core i7-2655LE 2x 2.2GHz 4MB L2 cache 1333MT/s TDP 25 W Intel Turbo Boost Technology 2.0 Intel Hyper-Threading Technology Integrated dual channel memory controller up to 25.6 GByte/sec. memory bandwidth Integrated Intel HD Graphics 3000 with dynamic frequency up to 1.2GHz Intel Clear Video HD Technology DRAM 2 Sockets SO-DIMM DDR3 up to 1600MT/s and 16 GByte Chipset Mobile Intel 6 Series Chipset: Intel QM67 / Intel HM65 (Intel Celeron version) Ethernet Intel 82579 GbE LAN Controller with AMT 7.0 support I/O Interfaces 7x PCI Express GEN. 2.0 lanes 1x PEG 2x Serial ATA with 6 Gb/s 2x Serial ATA with 3 Gb/s (AHCI) RAID 0/1/5/10 support (QM67 only) 2x ExpressCard 8x USB 2.0 (EHCI) LPC bus IC bus (fast mode / 400 kHz / multi-master) Sound Digital High Definition Audio Interface with support for multiple audio codecs Graphics Intel Flexible Display Interface (FDI) OpenGL 3.0 and DirectX10.1 support Two independent pipelines for full dual view support optional High performance hardware MPEG-2 decoding WMV9 (VC-1) and H.264 (AVC) support Blu-ray support 40 MBit/s hardware motion compensation LVDS Dual channel LVDS transmitter Supports flat panels 2x24 Bit interface VESA mappings resolutions up to 1920x1200 Automatic Panel Detection via EDID/EPI Digital Display Interface 1x SDVO / DisplayPort 1.1 / TMDS (DVI / HDMI) 2x DisplayPort 1.1 / TMDS (DVI HDMI) CRT Interface 350 MHz RAMDAC resolutions up to QXGA (2048x1536) congatec Board Controller Multi Stage Watchdog non-volatile User Data Storage Manufacturing and Board Information Board Statistics BIOS Setup Data Backup IC bus (fast mode / 400 kHz / multi-master) Power Loss Control Embedded BIOS Features AMI Aptio UEFI 2.x firmware 8 MByte serial SPI firmware flash High Accessible Program (HAP) Security The conga-TS67 can be optionally equipped with a discrete Trusted Platform Module (TPM). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e-commerce will benefit also with improved authentication integrity and confidence levels. Power Management ACPI 4.0 with battery support Operating Systems Microsoft Windows 8 Microsoft Windows 7 Linux Microsoft Windows embedded Standard Power Consumption Typ. application: tbd. see manual for full details CMOS Battery Backup Temperature Operating: 0 .. +60C Storage: -20 .. +80C Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond. Size 95 x 125 mm (3.74 x 4.92) www.congatec.comconga-TS67 Block diagram A-B Hardware Monitoring TPM and Fan Control Circuitry Intel (optional) 82579LM GB Ethernet PHY Processor BIOS (Flash) CORE CORE RTC Board Controller CORE CORE STMicroelectronics SPI STM32 Mobile Intel QM67 2nd Generation Intel Core i7 8 PCIe Lanes Express Chipset Intel Core i5 Intel BD82QM67 PCH Intel Core i3 (Intel BD82HM65 PCH for Intel Celeron BC SPI Intel Celeron equipped modules) Memory Graphics Controller CORE Memory Types (1066 or 1333 or 1600MTs) DDR3-SODIMM Socket (top) 16 GByte Max. Total (Celeron 807UE DDR3-SODIMM supports one socket (top) Socket (bottom) 8 GByte max. total) C-D conga-TS67 Order Information Article PN Description conga-TS67/i7-2655LE 046401 Intel Core i7-2655LE dual core processor with 2.2GHz 4MB L3 cache and 1333MT/s dual channel DDR3 memory interface conga-TS67/i7-2610UE 046402 Intel Core i7-2610UE dual core processor with 1.5GHz 3MB L3 cache and 1333MT/s dual channel DDR3 memory interface conga-TS67/i3-2340UE 046403 Intel Core i3-2340UE dual core processor with 1.3GHz 3MB L3 cache and 1333MT/s dual channel DDR3 memory interface conga-TS67/847E 046404 Intel Celeron 847E dual core processor with 1.1GHz 2MB L3 cache and 1333MT/s dual channel DDR3 memory interface conga-TS67/827E 046405 Intel Celeron 827E single core processor with 1.4GHz 1.5MB L3 cache and 1333MT/s dual channel DDR3 memory interface conga-TS67/807UE 046406 Intel Celeron 807UE single core processor with 1.0GHz 1MB L3 cache 1333MT/s single channel DDR3 memory interface and no PEG Port conga-TS67/HSP-HP-B 046450 Standard heatspreader for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes. All standoffs are with 2.7mm bore hole conga-TS67/HSP-HP-T 046451 Standard heatspreader for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes. All standoffs are M2.5mm thread conga-TS67/CSP-HP-B 046452 Standard passive cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole conga-TS67/CSP-HP-T 046453 Standard passive cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread conga-TS67/CSA-HP-B 046454 Standard active cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes 15mm silver fins 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole conga-TS67/CSA-HP-T 046455 Standard active cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes 15mm silver fins 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread DDR3L-SODIMM-1600 (2GB) 068755 DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 2GB RAM DDR3L-SODIMM-1600 (4GB) 068756 DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM DDR3L-SODIMM-1600 (8GB) 068757 DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM Accessories conga-TEVAL 065800 Evaluation carrier board for Type 6 COM-Express-modules conga-LDVI/EPI 011115 LVDS to DVI converter board for digital flat panels with onboard EEPROM COM-Express-carrier- 400007 Connector for COM-Express carrier boards height 5mm packing unit 4 pieces board-Socket-5 COM-Express-carrier- 400004 Connector for COM-Express carrier boards height 8mm packing unit 4 pieces board-Socket-8 2016 congatec AG. All rights reserved. All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. July 12, 2015 KS www.congatec.com DMI x4 (Direct Media Interface) Intel FDI (Flexible Display Interface) Watchdog I2C Power Management and Control Signals 1x x1 PCIe Link Gbit Ethernet 7 PCIe Lanes LPC Bus SDVO / HDMI / DP GPIs/GPOs HDMI / DP 4x SATA HDMI / DP 8x USB 2.0 High Definition Audio (HDA) I/F SM Bus LCD I/F (LVDS) VGA PEG x16 Fan Control

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