X-On Electronics has gained recognition as a prominent supplier of conga-XAF/HSP-T Heat Sinks across the USA, India, Europe, Australia, and various other global locations. conga-XAF/HSP-T Heat Sinks are a product manufactured by Congatec. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

conga-XAF/HSP-T Congatec

conga-XAF/HSP-T electronic component of Congatec
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Part No.conga-XAF/HSP-T
Manufacturer: Congatec
Category: Heat Sinks
Description: Heat Sinks HEATSPREADER FOR EAF / XAF 2.5mm
Datasheet: conga-XAF/HSP-T Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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Availability Price Quantity
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MOQ : 1
Multiples : 1
1 : USD 24.6374
10 : USD 24.6374
25 : USD 24.3004
N/A

Obsolete
   
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RoHS - XON
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We are delighted to provide the conga-XAF/HSP-T from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the conga-XAF/HSP-T and other electronic components in the Heat Sinks category and beyond.

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HIGH GRAPHICS PERFORMANCE WITH LOW POWER CONSUMPTION conga-XAF - Based on AMD Embedded G-Series Processors - Best price/performance ratio - High performance graphics Formfactor ETX Spec 2.7. without ISA Support XTX Extensions CPU AMD G-T56N 1.6 GHz Dual Core L1 cache 64KB L2 cache 512kB x2 TDP 18 W AMD G-T52R 1.5 GHz Single Core L1 cache 64KB L2 cache 512kB TDP 18 W AMD G-T40R 1.0 GHz Single Core L1 cache 64KB L2 cache 512kB TDP 5.5 W AMD G-T40E 1.0 GHz Dual Core L1 cache 64KB L2 cache 512kB x2 TDP 6.5 W AMD Embedded G-Series Processors DRAM Single channel up to one 4 GB DDR3 SO-DIMM memory (up to 1066 MHz) Chipset AMD A55E Controller Hub Ethernet 10/100M Fast Ethernet Realtek RTL8105E I/O Interfaces 4x PCI ExpressTM x1 lanes 4x Serial ATA 2x EIDE (up to UDMA-66/100) 6x USB 2.0 PCI Bus (Rev. 2.3 compliant / 33 MHz) 2x Express Card LPC Bus IC (Fast Mode / 400 kHz Multi Maser) Floppy LPT 2x COM PS/2 Sound High Definition Audio Interface and Analog MIC Line In Line Out by on-module HDA codec Graphics Integrated High Performance Video DirectX 11 graphics with UVD 3.0 Integrated VGA DAC Dual Simultaneous Display Support no PEG support LVDS 2x24 Bit 800x600 to 1920X1200 60Hz VESA standard or JEDIA data mapping Automatic Panel Detection via EDID/EPI DisplayPort 1x DisplayPort 1.1a shared with HDMI port resolutions up to 2560x1600 - 18W APU 1920x1200 - 9W APU HDMI or DVI 1x HDMI 1.3 Port shared with DisplayPort resolutions up to 1920x1080 / 1920x1200 for DVI mode CRT 400 MHz RAMDAC resolutions up to 2560x1600 - 18W APU 1920x1200 9W APU congatec Board Controller Multi Stage Watchdog non-volatile User Data Storage Manufacturing and Board Information Board Statistics BIOS Setup Data Backup IC bus (fast mode / 400 kHz / multi-master) Power Loss Controll Embedded BIOS Features AMI-Aptio UEFI BIOS with congatec Embedded BIOS features Security The conga-XAF can be optionally equipped with a discrete Trusted Platform Module (TPM). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e-commerce will benefit also with improved authentication integrity and confidence levels. Power Management ACPI 3.0 with battery support Operating Systems Microsoft Windows8 Microsoft Windows7 Microsoft Windows XP Microsoft Windows embedded Standard Microsoft Windows CE 6.0 Windows Embedded Compact 7 Linux Power Consumption Typ. application: 9 .. 18 W. see manual for full details CMOS Battery Backup Temperature Operating: 0 .. +60C Storage: -20 .. +80C Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond. Size 95 x 114 mm (3.7 x 4.5) www.congatec.comconga-XAF Block diagram x2 x1 Mic HDA Line In P Line Out Realtek C ALC262 I TPM L SPI SPI B P Flash AMD u C WD Fan A55E CH s Trig Ctrl. 3x PCIe x1 B RTC Congatec u BC SPI UMI x4 Board s Controller STM32F100R8 AMD APU AMD G-T56N 4x PCIe x1 or AMD G-T48N or AMD G-T40N or AMD G-T40E or AMD G-T52R or AMD G-T44R or AMD G-T40R Memory Bus DP0 (800-1066MHz) DDR3-SODIMM Socket DP0 PCIe PCIe PCIe to PATA to PATA to LAN JMB368 RTL 8105E JMB368 Super I/O Analogix W83627DHG ANX3110 HWM I2C PIDE SIDE LAN COM 1/2, LPT, CRT LVDS PS2 Mouse & Keyboard x4 x3 www.congatec.com X6 FFC DP/HDMI 2x USB 2.0 4x USB 2.0 Watchdog 4x PCIe x1 4x SATA DP1

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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