HSE-B20254-035H-01 CUI Devices

Additional Resources: Product Page 3D Model date 02/11/2020 page 1 of 4 SERIES: HSE-BX-035H-01 DESCRIPTION: HEAT SINK FEATURES TO-220 package placement pins for secure PCB attachment round hole for component attchment multiple available cut lengths 1 thermal resistance power MODEL 1 dissipation length 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSE-B20254-035H-01 25.4 14.42 14.36 4.42 3.40 5.20 HSE-B20381-035H-01 38.1 10.71 10.51 2.67 2.43 7.00 Note: 1. See performance curves for full thermal resistance details. 2. Custom cut to length options available. Thermal data not available on custom lengths. PERFORMANCE CURVES HSE-B20254-035H-01 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 14.36 4.42 3.40 2 29.79 9.28 6.91 50 3 44.19 14.08 10.17 40 4 59.02 18.94 13.61 30 5 72.18 23.94 17.23 6 84.41 28.75 20.85 20 7 96.74 33.59 24.38 10 8 107.41 38.56 27.85 0 9 118.81 43.41 31.51 01 23 45 6789 10 10 128.70 48.60 34.77 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices SERIES: HSE-BX-035H-01 DESCRIPTION: HEAT SINK date 02/11/2020 page 2 of 4 PERFORMANCE CURVES (CONTINUED) HSE-B20381-035H-01 100 Heatsink Temperature Rise Above Without Airflow 90 Ambient (T = Ths - Ta) (C) 200 LFM Power Natural 400 LFM 80 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 1 10.51 2.67 2.43 60 2 21.88 6.30 4.81 50 3 34.26 9.73 7.11 40 4 45.39 13.18 9.69 5 55.46 16.67 12.13 30 6 66.53 20.13 14.51 20 7 75.57 23.53 17.05 8 83.77 27.06 19.52 10 9 90.80 30.38 22.06 0 01 23 45 67 89 10 10 97.95 33.80 24.44 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)