X-On Electronics has gained recognition as a prominent supplier of DA14531-00000OG2 RF System on a Chip - SoC across the USA, India, Europe, Australia, and various other global locations. DA14531-00000OG2 RF System on a Chip - SoC are a product manufactured by Dialog Semiconductor. We provide cost-effective solutions for RF System on a Chip - SoC, ensuring timely deliveries around the world.

DA14531-00000OG2 Dialog Semiconductor

DA14531-00000OG2 electronic component of Dialog Semiconductor
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Part No.DA14531-00000OG2
Manufacturer: Dialog Semiconductor
Category: RF System on a Chip - SoC
Description: RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+ memories and peripherals 6 GPIOs in WL-CSP17 and 0.5mm ball pitch package
Datasheet: DA14531-00000OG2 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.8842 ea
Line Total: USD 1.88 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 05 Dec to Tue. 10 Dec
MOQ : 1
Multiples : 1
1 : USD 2.8262
10 : USD 2.7643
30 : USD 2.7231
100 : USD 2.68

0
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 1.8842
10 : USD 1.5871
100 : USD 1.3084
250 : USD 1.2357
500 : USD 1.0631
1000 : USD 0.9037
2500 : USD 0.8712
4000 : USD 0.87
8000 : USD 0.8374

   
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DA14531 Final Ultra Low Power Bluetooth 5.1 SoC General Description The DA14531 is an ultra-low power SoC integrating a 2.4 GHz transceiver and an Arm Cortex-M0+ microcontroller with a RAM of 48 kB and a One-Time Programmable (OTP) memory of 32 kB. It can be used as a standalone application processor or as a data pump in hosted systems. The radio transceiver, the baseband processor, and the qualified Bluetooth low energy stack is fully compliant with the Bluetooth Low Energy 15. standard. The DA14531 has dedicated hardware for the Link Layer implementation of BLE and interface controllers for enhanced connectivity capabilities. The BLE firmware includes the L2CAP service layer protocols, Security Manager (SM), Attribute Protocol (ATT), the Generic Attribute Profile (GATT), and the Generic Access Profile (GAP). All profiles published by the Bluetooth SIG as well as custom profiles are supp orted. The device is suitable for disposables, wireless sensor nodes, beacons, proximity tags and trackers, smart HID devices (stylus, keyboards, mice, and trackpads), toys, and medical and industrial applications. Key Features Compatible with Bluetooth v5.1, ETSI EN 300 Clocks 328 and EN 300 440 Class 2 (Europe), FCC 32 MHz crystal and 32 MHz RC osc. CFR47 Part 15 (US) and ARIB STD-T66 32 kHz crystal and 32/512 kHz RC osc. (Japan) 15 kHz RCX as crystal replacement Supports up to three BLE connections Programmable Reset Circuitry Typical cold boot to radio active 35 ms 2 General purpose Timers with capture and Processing power PWM capabilities 16 MHz 32-bit Arm Cortex-M0+ with Digital interfaces SWD interface GPIOs: 6 (WLCSP17), 12 (FCGQFN24) 18300 EEMBC IoTMark-BLE score 2 UARTs (one with flow control ) Dedicated Link Layer and AES-128 Encryption Processor SPI Master/Slave up to 32 MHz (Master) Software-based True Random Number I2C bus at 100 kHz and 400 kHz Generator (TRNG) 3-axis capable Quadrature Decoder Memories Keyboard controller 32 kB One-Time-Programmable (OTP) Analog interfaces 48 kB Retainable System RAM 4-channel 10-bit ADC 144 kB ROM Radio transceiver Power management Fully integrated 2.4 GHz CMOS Integrated Buck/Boost DCDC converter transceiver Buck: 1.1 V BAT HIV GH 3.3 V (min 1.8V if Single wire antenna OTP read needed) TX: 3.5 mA, RX: 2.2 mA (system currents Boost: 1.1 V BAT LOWV 1.65 V with DC-DC, V =3 V and 0 dBm) BAT HIGH Clock-less hibernation mode: Buck 270 Programmable transmit output power from nA, Boost 240 nA -19.5 dBm to +2.5 dBm Built-in temperature sensor for die -94 dBm receiver sensitivity temperature monitoring Packages: WLCSP 17 balls, 1.7 2.05, 0.5 mm pitc h FCGQFN 24 pins, 2.2 3, 0.4 mm pitc h Datasheet Revision 3.1 09-Jul-2020 CFR0011-120-00 1 of 374 2020 Dialog Semiconductor DA14531 Final Ultra Low Power Bluetooth 5.1 SoC Applications Medical applications Disposables Beacons Proximity tags and trackers Wireless sensor nodes Fitness trackers Consumer health Smartwatches Human interface devices (HID) Stylus pens Keyboards Mouse devices Trackpads Toys Industrial appliances Key Benefits Lowest power consumption Smallest system size Lowest system cost System Diagram Figure 1: System Diagram Datasheet Revision 3.1 09-Jul-2020 CFR0011-120-00 2 of 374 2020 Dialog Semiconductor

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Adesto Technologies
Dialog Semiconductor GmbH
DLG
Echelon / Adesto
Echelon Corporation
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