X-On Electronics has gained recognition as a prominent supplier of CYBL10462-56LQXI RF System on a Chip - SoC across the USA, India, Europe, Australia, and various other global locations. CYBL10462-56LQXI RF System on a Chip - SoC are a product manufactured by Infineon. We provide cost-effective solutions for RF System on a Chip - SoC, ensuring timely deliveries around the world.

CYBL10462-56LQXI Infineon

CYBL10462-56LQXI electronic component of Infineon
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Part No.CYBL10462-56LQXI
Manufacturer: Infineon
Category: RF System on a Chip - SoC
Description: Cypress Semiconductor RF System on a Chip - SoC PRoC BLE CYBL1046x 32b 48MHz ARM Cortex
Datasheet: CYBL10462-56LQXI Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
2: USD 4.466 ea
Line Total: USD 8.93 
Availability - 9
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ: 2  Multiples: 1
Pack Size: 1
Availability Price Quantity
149
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 4
Multiples : 1
4 : USD 19.6
10 : USD 14.825
25 : USD 7.425
50 : USD 7.0375
100 : USD 6.7
250 : USD 6.3625
500 : USD 6.0375
1000 : USD 5.7375

9
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 1
Multiples : 1
1 : USD 4.6124

9
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 2
Multiples : 1
2 : USD 4.466

5548
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 64
Multiples : 1
64 : USD 7.3793
100 : USD 7.0803
500 : USD 6.7814
1000 : USD 6.4038

442
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 64
Multiples : 1
64 : USD 7.3793
100 : USD 7.0803
500 : USD 6.7814
1000 : USD 6.4038

126
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 64
Multiples : 1
64 : USD 7.3793
100 : USD 7.0803
500 : USD 6.7814
1000 : USD 6.4038

   
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We are delighted to provide the CYBL10462-56LQXI from our RF System on a Chip - SoC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the CYBL10462-56LQXI and other electronic components in the RF System on a Chip - SoC category and beyond.

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CYBL10X6X Family Datasheet Programmable Radio-on-Chip With Bluetooth Low Energy (PRoC BLE) General Description PRoC BLE is a 32-bit, 48-MHz ARM Cortex -M0 BLE solution with CapSense , 12-bit ADC, four timer, counter, pulse-width 2 modulators (TCPWM), thirty-six GPIOs, two serial communication blocks (SCBs), LCD, and I S. PRoC BLE includes a royalty-free BLE stack compatible with Bluetooth 4.1 and provides a complete, programmable, and flexible solution for HID, remote controls, toys, beacons, and wireless chargers. In addition to these applications, PRoC BLE provides a simple, low-cost way to add BLE connectivity to any system. Features Four dedicated 16-bit TCPWMs Bluetooth Smart Connectivity Additional four 8-bit or two 16-bit PWMs Bluetooth 4.1 single-mode device Programmable LVD from 1.8 V to 4.5 V 2.4-GHz BLE radio and baseband with integrated balun 2 I S Master interface TX output power: 18 dBm to +3 dBm Received signal strength indicator (RSSI) with 1-dB resolution Clock, Reset, and Supply RX sensitivity: 89 dBm Wide supply-voltage range: 1.9 V to 5.5 V TX current: 15.6 mA at 0 dBm 3-MHz to 48-MHz internal main oscillator (IMO) with 2% accuracy RX current: 16.4 mA 24-MHz external clock oscillator (ECO) without load capaci- ARM Cortex-M0 CPU Core tance 32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit 32-kHz WCO multiply, operating at up to 48 MHz Programmable GPIOs 128-KB flash memory 36 GPIOs configurable as open drain high/low, 16-KB SRAM memory pull-up/pull-down, HI-Z, or strong output Emulated EEPROM using flash memory Any GPIO pin can be CapSense, LCD, or analog, with flexible Watchdog timer with dedicated internal low-speed oscillator pin routing (ILO) Programming and Debug Ultra-Low-Power 2-pin SWD 1.3-A Deep-Sleep mode with watch crystal oscillator (WCO) In-system flash programming support on 150-nA Hibernate mode current with SRAM retention Temperature and Packaging 60-nA Stop mode current with GPIO wakeup Operating temperature range: 40 C to +105 C Available in 56-pin QFN (7 mm 7 mm) and 68-ball WLCSP CapSense Touch Sensing with Two-Finger Gestures (3.52 mm 3.91 mm) packages Up to 36 capacitive sensors for buttons, sliders, and touchpads PSoC Creator Design Environment Two-finger gestures: scroll, inertial scroll, pinch, stretch, and edge-swipe Easy-to-use IDE to configure, develop, program, and test a BLE application Cypress Capacitive Sigma-Delta (CSD) provides best-in-class SNR (> 5:1) and liquid tolerance Option to export the design to Keil, IAR, or Eclipse Automatic hardware-tuning algorithm (SmartSense) Bluetooth Low Energy Protocol Stack Peripherals Bluetooth Low Energy protocol stack supporting generic access profile (GAP) Central, Peripheral, Observer, or Broad- 12-bit, 1-Msps SAR ADC with internal reference, caster roles sample-and-hold (S/H), and channel sequencer Switches between Central and Peripheral roles on-the-go Ultra-low-power LCD segment drive for 128 segments with Standard Bluetooth Low Energy profiles and services for operation in Deep-Sleep mode interoperability 2 Two serial communication blocks (SCBs) supporting I C Custom profile and service for specific use cases (Master/Slave), SPI (Master/Slave), or UART Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 001-90478 Rev. *K Revised August 19, 2015 This datasheet has been downloaded from PRoC BLE: CYBL10X6X Family Datasheet Contents Blocks and Functionality ................................................. 3 Digital Peripherals ..................................................... 26 CPU Subsystem .......................................................... 4 Memory ..................................................................... 29 BLE Subsystem........................................................... 4 System Resources .................................................... 29 System Resources Subsystem ................................... 4 Ordering Information...................................................... 33 Peripheral Blocks ........................................................ 6 Part Numbering Conventions .................................... 34 Pinouts .............................................................................. 8 Packaging........................................................................ 35 Power............................................................................... 13 Acronyms........................................................................ 38 Low-Power Modes..................................................... 13 Document Conventions ................................................. 40 Development Support .................................................... 15 Units of Measure ....................................................... 40 Documentation .......................................................... 15 Revision History ............................................................. 41 Online ........................................................................ 15 Sales, Solutions, and Legal Information ...................... 42 Tools.......................................................................... 15 Worldwide Sales and Design Support....................... 42 Kits ............................................................................15 Products .................................................................... 42 Electrical Specifications ................................................ 16 PSoC Solutions ...................................................... 42 Absolute Maximum Ratings ...................................... 16 Cypress Developer Community................................. 42 BLE Subsystem......................................................... 16 Technical Support ..................................................... 42 Device-Level Specifications ...................................... 19 Analog Peripherals .................................................... 24 Document Number: 001-90478 Rev. *K Page 2 of 42

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Cypress
Cypress / Spansion
CYPRESS SEMI
Cypress Semicon
Cypress Semiconductor
Cypress Semiconductor Corp
INF
INFINEON
Infineon IR
INFINEON (CYPRESS)
Infineon (IRF)
Infineon / Cypress
Infineon / IR
INFINEON TECH ICs
Infineon Technologies
INFINEON TECHNOLOGIES AG
Infineon Technologies Americas Corp.
Infinite Power Solutions
INTERNATIONAL RECTIF
INTERNATIONAL RECTIFIER
International Rectifier HiRel Products
INTL RECTIFIER
IR
IRH
Ramtron
Ramtron / Cypress Semiconductor
Ramtron International Corp
SP9
SPANSION
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