X-On Electronics has gained recognition as a prominent supplier of DA14681-01000U22 RF System on a Chip - SoC across the USA, India, Europe, Australia, and various other global locations. DA14681-01000U22 RF System on a Chip - SoC are a product manufactured by Dialog Semiconductor. We provide cost-effective solutions for RF System on a Chip - SoC, ensuring timely deliveries around the world.

DA14681-01000U22 Dialog Semiconductor

DA14681-01000U22 electronic component of Dialog Semiconductor
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Part No.DA14681-01000U22
Manufacturer: Dialog Semiconductor
Category: RF System on a Chip - SoC
Description: RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC with Flexpower ARM Cortex M0, crypto, PMU, memories and peripherals - 16 GPIOs in WL-CSP53 package and 0.4mm ball pitch
Datasheet: DA14681-01000U22 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 6.4218 ea
Line Total: USD 6.42 
Availability - 4833
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
4833
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 6.4218
10 : USD 5.3707
100 : USD 4.851
250 : USD 4.5391
500 : USD 4.1465
1000 : USD 3.6036
2500 : USD 3.5689
5000 : USD 3.4188
10000 : USD 3.4072

   
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We are delighted to provide the DA14681-01000U22 from our RF System on a Chip - SoC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the DA14681-01000U22 and other electronic components in the RF System on a Chip - SoC category and beyond.

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DA14681 FINAL Bluetooth Low Energy 4.2 SoC line batteries General description Charger (up to 5.0 V) with programmable curves The DA14681 is a flexible System-on-Chip combining High accuracy state-of-charge fuel gauge an application processor, memories, cryptography Programmable threshold for brownout detection engine, power management unit, digital and analog Digitally controlled oscillators and PLL peripherals and a Bluetooth Low Energy MAC engine 16 MHz crystal oscillator and radio transceiver. 16 MHz RC oscillator The DA14681 is based on an ARM Cortex -M0 CPU 32 kHz crystal and RC oscillator delivering up to 84 DMIPS and provides a flexible 11.7 kHz RCX oscillator memory architecture, enabling code execution from Low power PLL up to 96 MHz embedded memory (RAM, ROM) or non-volatile mem- Three general purpose timer/counters with PWM ory (OTP or external Quad-SPI FLASH). One 16-bit up/down timer/counter with PWM available in extended/deep sleep mode The advanced power management unit of the Application cryptographic engine with ECC, AES- DA14681 enables it to run from primary and secondary 256, SHA-1, SHA-256, SHA-512 and True Random batteries, as well as provide power to external devices. Number Generator The on-chip charger and state-of-charge fuel gauge Digital interfaces allow the DA14681 to natively charge rechargeable 37 (AQFN) or 21 (WLCSP) general purpose I/Os batteries over USB. with programmable voltage levels An on-chip PLL enables on-the-fly tuning of the system Quad-SPI FLASH interface clock between 32 kHz and 96 MHz to meet high pro- Two UARTs, one with hardware flow control cessing requirements. Several optimised sleep modes Two SPI+ interfaces are available to reduce power dissipation when there is Two I2C bus interfaces at 100 kHz, 400 kHz no activity. Three-axes capable Quadrature Decoder PDM + HW decimator (2 mics or 2 speakers) Features I2S/PCM master/slave interface up to 8 channels Keyboard scanner with debouncing Complies to Bluetooth v4.2, ETSI EN 300 328 and Infrared (IR) interface (PWM) EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 USB 1.1 Full Speed (FS) device interface (US) and ARIB STD-T66 (Japan) Analog interfaces Flexible processing power 8-channel 10-bit ADC with averaging capability 0 Hz up to 96 MHz 32-bit ARM Cortex-M0 with Three matched white LED drivers 4-way associative cache Temperature sensor Three optimised power modes (Extended sleep, Radio transceiver Deep sleep and Hibernation) reducing current to 2.4 GHz CMOS transceiver with integrated balun 1.4 uA 50 matched single wire antenna interface Memories 0 dBm transmit output power 64 kB One-Time-Programmable (OTP) memory -94 dBm receiver sensitivity (BLE) 128 kB Data SRAM with retention capabilities Supply current at VBAT1 (3 V): 16 kB Cache SRAM with retention capabilities TX: 3.4 mA 128 kB ROM (including boot ROM and BLE stack) RX: 3.1 mA (with ideal DC-DC converter) Power management Packages: Integrated Buck DC-DC converter (1.7 V - 4.75 V) AQFN with 60 pins, 6 mm x 6 mm Three power supply pins for external devices WLCSP with 53 balls, 3.406 mm x 3.010 mm Supports Li-Polymer, Li-Ion, coin, NiMH and alka- System diagram Datasheet Revision 3.0 28-February-2018 CFR0011-120-00-FM Rev 5 1 of 459 2018 Dialog SemiconductorDA14681 FINAL Bluetooth Low Energy 4.2 SoC 1 Block diagram 6 8.2 RUNTIME RECONFIGURATION 58 8.2.1 Cache Line reconfiguration 58 2 Package and pinout . 7 8.2.2 TAG memory word . 58 3 System overview . 19 8.2.3 Associativity reconfiguration . 58 3.1 INTERNAL BLOCKS 19 8.3 2 AND 4 WAY REPLACEMENT STRATEGY . 58 3.2 FUNCTIONAL MODES 20 8.4 CACHE RESETS . 58 3.3 SYSTEM CONFIGURATION . 20 8.5 CACHE MISS RATE MONITOR . 59 3.4 SYSTEM STARTUP PROCEDURE 23 8.6 CACHE MISS LATENCY AND POWER . 59 3.4.1 Power/Wakeup FSM . 24 9 AMBA Bus 61 3.4.2 Goto Sleep FSM 24 10 Memory Controller 63 3.4.3 BootROM sequence . 25 3.5 POWER CONTROL AND MODES . 27 11 OTP Controller 65 3.5.1 System Power Control 27 11.1 OPERATING MODES 65 3.5.2 Power domains . 28 11.2 AHB MASTER INTERFACE . 66 3.5.3 Power modes . 29 11.3 AHB SLAVE INTERFACES 66 4 Power management 31 11.4 ERROR CORRECTING CODE (ECC) . 66 11.5 BUILD-IN SELF REPAIR (BISR) 66 4.1 ARCHITECTURE 31 4.1.1 SIMO DC-DC converter . 32 12 Quad SPI Controller . 67 4.1.2 LDOs . 34 12.1 ARCHITECTURE . 67 4.1.3 Switching from DC-DC to LDOs 36 12.1.1 Interface 67 4.1.4 PMU configurations in Sleep modes . 37 12.1.2 Initialization FSM . 68 4.1.5 Wake/Power up - Sleep Timing . 37 12.1.3 SPI modes 69 4.1.6 Charger . 40 12.1.4 Access modes . 69 4.1.7 Fuel gauge . 42 12.1.5 Endianess 69 4.1.8 USB charger detection 44 12.1.6 Erase Suspend/Resume . 69 5 Reset . 47 12.1.7 QSPI FLASH Programming . 70 12.2 PROGRAMMING . 70 5.1 POR, HW AND SW RESET 47 12.2.1 Auto Mode 70 5.2 BROWN OUT DETECTION 48 12.2.2 Manual Mode 71 6 Clock generation . 49 12.2.3 Clock selection . 71 6.1 CLOCK TREE . 49 12.2.4 Received data . 71 6.2 CRYSTAL OSCILLATORS . 50 12.3 TIMING . 71 6.2.1 Frequency control (16 MHz crystal) 50 13 DMA Controller . 73 6.2.2 Automated trimming and settling notification 13.1 DMA PERIPHERALS 74 50 13.2 INPUT/OUTPUT MULTIPLEXER . 74 6.3 RC OSCILLATORS . 51 13.3 DMA CHANNEL OPERATION . 74 6.3.1 Frequency calibration 52 13.4 DMA ARBITRATION . 75 6.4 PLL . 52 13.5 FREEZING DMA CHANNELS 75 7 ARM Cortex M0 53 14 AES/Hash Engine . 76 7.1 SYSTEM TIMER (SYSTICK) 54 14.1 DESCRIPTION . 76 7.2 WAKEUP INTERRUPT CONTROLLER . 54 14.2 ARCHITECTURE . 77 7.3 REFERENCE . 54 14.2.1 AES/HASH engine 77 7.4 INTERRUPTS . 55 14.2.2 AES . 77 8 Cache Controller . 57 14.2.3 Modes . 78 8.1 CACHABLE RANGE 57 14.2.4 HASH 78 Datasheet Revision 3.0 28-February-2018 CFR0011-120-00-FM Rev 5 2 of 459 2018 Dialog Semiconductor

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Adesto Technologies
Dialog Semiconductor GmbH
DLG
Echelon / Adesto
Echelon Corporation
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