DA16200 Final Ultra Low Power Wi-Fi SoC General Description The DA16200 is a highly integrated ultra-low power Wi-Fi system on a chip(SoC), which contains an 802.11b/g/n radio(PHY), a baseband processor, a media access controller(MAC), on-chip memory, and a host networking application processor, all on a single silicon die. The SoC enables full offload capabilities, running the entire networking stack on chip so that no external network processor, CPU, or microcontroller is required, while many other SoCs optionally use a microcontroller. DA16200 is a synthesis of breakthrough ultra-low power technologies which enables extremely low power operation in the SoC. DA16200 shuts down every micro element of the chip that is not in use, which allows a near zero level of power consumption when not actively transmitting or receiving data. Such low power operation can extend the battery life as long as a year or more depending on the application. DA16200 also enables ultra-low power transmitting and receiving modes when the SoC needs to be awake to exchange information with other devices. Advanced algorithms enable staying asleep until the exact moment required to wake up to transmit or receive. The SoC is built from the ground up for the Internet of Things (IoT) and is ideal for door locks, thermostats, sensors, pet trackers, asset trackers, sprinkler systems, connected lighting, video cameras, video door bells, wearables and other IoT devices. Key Features Highly integrated ultra-low power Wi-Fi Provides dynamic auto switching system on chip function Full offload: SoC runs full networking OS Supports various interfaces and TCP/IP stack eMMC/SD expanded memory Wi-Fi processor SDIO Host/Slave function IEEE 802.11b/g/n, 11, 20 MHz QSPI for external flash control channel bandwidth, 2.4 GHz Three UARTs IEEE 802.11s Wi-Fi mesh SPI Master/Slave interface On-chip PA, LNA, and RF switch I2C Master/Slave interface Wi-Fi security: WPA/WPA2- I2S for digital audio streaming Enterprise/Personal, WPA2 SI, WPA3 4-channel PWM SAE, and OWE Individually programmable, multiplexed Vendor EAP types: EAP- GPIO pins TTLS/MSCHAPv2, PEAPv0/EAP- MSCHAPv2, PEAPv1, EAP-FAST, and JTAG and SWD EAP-TLS Wi-Fi Alliance certifications: Operating modes: Station, SoftAP, and Wi-Fi CERTIFIED b, g, n Wi-Fi Direct Modes (GO, GC, GO WPA - Enterprise, Personal fixed) WPA2 - Enterprise, Personal WPS-PIN/PBC for easy Wi-Fi provisioning WPA3 - Enterprise, Personal Connection manager for autonomous Wi-Fi Direct and fast Wi-Fi connections Wi-Fi Enhanced Open Bluetooth coexistence WMM Antenna switching diversity WMM - Power Save Built-in 4-channel auxiliary ADC for sensor Wi-Fi Protected Setup interfaces 12-bit SAR ADC: single-ended four channels Datasheet Revision 3.1 15-May-2020 CFR0011-120-00 1 of 90 2020Dialog Semiconductor DA16200 Final Ultra Low Power Wi-Fi SoC Direct code execution from the external CPU core subsystem serial flash memory (XIP) Arm Cortex-M4F core w/ clock Hardware accelerators frequency of 30~160 MHz General HW CRC engine ROM: 256 kB SRAM: 512 kB HW zeroing function for fast booting Pseudo random number OTP: 8 kB generator(PRNG) Power management unit Complete software stack On-Chip RTC Comprehensive networking software Wake-up control of fast booting or full stack booting with minimal initialization time Provides TCP/IP stack: in the form of Integrated DC-DC and LDOs network socket APIs Supports three ultra-low power sleep Advanced security modes Secure booting Clock source Secure debugging using JTAG/SWD 40 MHz crystal ( 20 ppm) for master and UART ports clock (initial + temp + aging) Secure asset storage 32.768 kHz crystal ( 250 ppm) for RTC clock Built-in hardware crypto engines for advanced security Integrated 32 kHz RC oscillator TLS/DTLS security protocol functions Supply Crypto engine for key deliberate Single operating voltage: 2.1V to 3.6V generic security functions: (typical: 3.3V) AES(128,192,256), DES/3DES, Digital I/O Supply Voltage: 1.8V / 3.3V SHA1/224/256, RSA, DH, ECC, Black-out and brown-out detector CHACHA, and TRNG Package type 6 mm 6 mm, 0.4 mm pitch, 48-Pin, QFN 3.8 mm 3.8 mm, 0.4 mm pitch, 72- Pin, fcCSP Operating temperature range -40C to 85C Datasheet Revision 3.1 15-May-2020 CFR0011-120-00 2 of 90 2020Dialog Semiconductor