SCALABLE HIGH- PERFORMANCE SYSTEM-ON-MODULE DIGI CONNECTCORE 6 NXP i.MX6 based surface-mount module solution with scalable, single-/multi-core performance and integrated wireless The ConnectCore 6 is an ultra-compact and highly integrated BLOCK DIAGRAM system-on-module solution based on the NXP i.MX6 Cortex-A9 SYSTEM CONTROL CONNECTIVITY processor family. Secure JTAG Imaging Processing Unit MMC 4.4/SD 3.0 x3 802.11 a/b/g/n Quad ARM Cortex-A9 Core PLL, Osc. MMC 4.4/SDXC With processor speeds up to 1.2 GHz and fully pin-compatible Bluetooth Clock and Reset 32 KB I-Cache 32 KB D-Cache UART x5, 5 Mbps single-/dual-/quad-core variants, the ConnectCore 6 offers a 4.0 per Core per Core Smart DMA 2 NEON per Core PTM per Core I C x3, SPI x5 truly future-proof platform solution with scalable performance IOMUX 2 and pre-certified wireless 802.11 a/b/g/n and Bluetooth 4.0, ESAI, I S/SSI x3 1 MB L2-Cache + VFPv3 Timer x3 including Bluetooth Low Energy, connectivity. 3.3V GPIO PWM x4 MULTIMEDIA Watch Dog x2 Keypad Kinetis Its low-profile, surface-mount design maximizes integration Hardware Graphics Accelerators KL2/K20 POWER 3D 2D Vector Graphics S-ATA and PHY 3 Gbps flexibility and significantly reduces design risk in a highly MANAGEMENT USB2 OTG and PHY Power Supplies cost-effective, reliable form factor with optimized heat Video Codes Audio USB2 Host and PHY Temperature 1080p30 Enc/Dec ASRC dissipation capabilities even in the most demanding quad- Monitor USB2 HSIC Host x2 core system configurations. Imaging Processing Unit INTERNAL MIPI HSI Up to 64 GB MEMORY Resizing and Blending eMMC Flash ROM RAM The ConnectCore 6 comes with a complete Board Support S/PDIF Tx/Rx Inversion/Rotation Up to Package (BSP) for both Linux and Android platforms PCIe 2.0 (1-Lane) SECURITY Image Enhancement 4 GB DDR3 (64-bit) RNG supporting secure remote management and web services FlexCAN x2 Display and Camera Interface MLB150 + DTCP TrustZone through Digi Remote Manager . HDMI and PHY 1 Gb Ethernet + IEEE 1588 Ciphers MIPI DSI NAND Cntrl. (BCH40) Security Cntrl MIPI CSI2 24-bit RGB, LVDS (x2) LP-DDR2, DDR3/ Dialog Secure RTC BENEFITS DA9063 LV-DDR3 x32/64, 20-bit CSI PMIC 533 MHz eFuses Scalable Cortex-A9 multi-core performance Independent Cortex-M0+/Cortex-M4 Microcontroller Assist subsystem Cost-effective, reliable, low-profile surface-mount module form factor Pre-certified 802.11a/b/g/n and Bluetooth 4.0 Smart Power Management Architecture with PMIC KEY APPLICATIONS Android, Yocto Project Linux and Windows Embedded Compact software platform support Reliable design with IEC 60068 and HALT verification Designed for long-term availability ConnectCore ConnectCore ConnectCard ConnectCore 6 Digi XBee i.MX53/ 6 SBC for i.MX28 LCD Kit ZigBee Wi-i.MX53SPECIFICATIONS Digi ConnectCore 6 FEATURES NXP i.MX6Solo/DualLite/Dual/Quad with up to four Cortex-A9 cores Industrial (800/850 MHz), APPLICATION PROCESSOR Commercial (1/1.2 GHz) i.MX6 variants 32 KB I-Cache/32 KB D-Cache, up to 1 MB L2-Cache MEMORY Up to 64 GB eMMC flash, up to 2 GB DDR3 (64-bit) PMIC Dialog DA9063 Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance families Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support Separate 2D and/or Vertex GRAPHICS acceleration engines for UI support Stereoscopic image sensor support for 3D imaging SECURITY RNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP) MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, ESAI, I2S/SSI x3, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PERIPHERALS/INTERFACES PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG 26-bit address / up to 32-bit data (multiplexed and non-multiplexed modes) EXTERNAL BUS 1 Gbit Ethernet + IEEE 1588 (MII10, MII100, RMII, RGMII) ETHERNET 802.11 a/b/g/n: 2.412 - 2.484 GHz, 4.900 - 5.850 GHz 802.11 b: 1, 2, 5.5, 11 Mbps (17 dBm typical 2 dBm) 802.11 a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical 2 dBm) 802.11 n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical 2 dBm) WI-FI HT40, MCS 0-7 Security: WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i, Access Point Mode (up to 10 clients), Wi-Fi Direct Industry certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready BLUETOOTH Profiles: GAP, SPP, FTP, PAN, OPP, HID, A2DP, AVRCP, HDP Kinetis L: MKL14Z32VFT4, MKL14Z64VFT4, MKL15Z128VFT4, MKL15Z32VFT4, MKL15Z64VFT4, MKL24Z32VFT4, MKL24Z64VFT4, MKL25Z128VFT4, MKL25Z32VFT4, MKL25Z64VFT4, MKL26Z128VFT4, MKL26Z64VFT4, MKL26Z32VFT4 ON-MODULE MICROCONTROLLER Kinetis K: K10P48M50SF0, K20P48M50SF0 ASSIST Internal interconnect to i.MX6 via SPI, Kinetis interfaces available on module pads OPERATING TEMPERATURE Industrial: -40 C to 85 C / Commercial: 0 C to 70 C (depending on use-case and enclosure/system design) STORAGE TEMPERATURE -50 C to 125 C (-58 F to 257 F) Relative Humidity 5% to 90% (non-condensing) RELATIVE HUMIDITY RADIO APPROVALS US, Canada, EU, Japan, Australia/New Zealand FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EMISSIONS / IMMUNITY / SAFETY EN 55024, EN 301 489-3, Safety UL/UR (or equivalent) Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 DESIGN VERIFICATION Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT MECHANICAL DIMENSIONS LGA-400, 2 mm pitch, fully shielded (heat-spreading) 3 years PRODUCT WARRANTY DIGI.COM