SECURE, CONNECTED SYSTEM-ON-MODULE DIGI CONNECTCORE 8X Intelligent and connected embedded system-on-module based on the NXP i.MX 8X with scalable dual/quad-core performance for industrial IoT applications Digi ConnectCore 8X delivers a secure and cost-effective BLOCK DIAGRAM connected system-on-module platform that measures in at PMIC eMMC LPDDR4 802.11ac 2x2 Bluetooth 5 just 40 mm x 45 mm. The Digi SMTplus surface mount form factor allows you to choose simplified design integration Digi Microcontroller Assist Secure Element leveraging proven and easy-to-use edge-castellated SMT CORE COMPLEX CORE COMPLEX CONNECTIVITY technology, or a versatile LGA option for ultimate design 2 5 x UART 24 x ARM Cortex-M4F 1 x I C Cortex-A35 16 KB I-cache 1 x UART flexibility with access to virtually all interfaces. 2 32 KB I-cache 8 x I C 16 KB D-cache 6 x GPIO 32 KB D-cache 4 x SPI 256 KB SRAM 1 x TPM Timer Built on the NXP i.MX 8X application processor, the module 512 KB L2 cache with ECC 2 x Gbit is the intelligent communication engine for todays secure MEMORY Ethernet AVB MULTIMEDIA LPDDR4 1200 MHz (no ECC) connected devices. Digi ConnectCore 8X can help jump-start 3.3 V/1.8 V GPIO GPU 2 x SDIO3.0/eMMC5.1 1 x 2- or 4-Shader, PCIe 3.0 with L1 the development of streaming video/audio devices, voice OpenGL ES 3.0 or 3.1 Substate1-lane RAW NAND-BCH62 3.1, Vulkan VX (wired only) Extensions 2 x Quad/1 x Octal SPI control and general human-machine interface solutions. 1 x USB3 OTG VPU w/PHY With a multitude of high performance interconnecting Video: h.265 dec 4k, SECURITY h.264 enc/dec 1080p 1 x USB2 OTG HAB, SRTC, SJTAG, TrustZone options, including 1x USB 3.0 port, dual Gigabit Ethernet, w/PHY AUDIO DSP CORE AES256, RSA4096, SHA-256 PCIe 3.0, and pre-certified dual-band 2x2 MU-MIMO WLAN, 3 x CAN/CAN FD Tensilica HiFi 4 3DES, ARC4, MD-5 64 KB 32 KB I 48 KB D Digi ConnectCore 8X is ideal for developing a wide range of TSM Flashless SHE, ECC MOST 25/50 512 KB SRAM Tamper, Inline Enc Engine embedded and IoT applications. 4 x 4 Keypad SYSTEM CONTROL DISPLAY AND CAMERA I/O 4 x PWM 2 x MIPI-DSI/LVDS Power Control, Clocks, Reset Combo PHY 1 x 12-bit ADC BootROMs 1 x Parallel Display 2 x ASRC, SPDIF 2 PMIC interface (dedicated I C) 1 x Parallel CSI Domain Resource Partitioning 4 x SAI, ESAI, MQS 1 x MIPI CSI BENEFITS Industrial i.MX 8X quad/dual-core SOM and SBC platform family (See table for Dual SOM differences) Digi SMTplus form factor (40 mm x 45 mm) for ultimate reliability and design freedom Power management with both hardware and software support for low-power designs Multi-display and camera capabilities with hardware acceleration Pre-certified dual-band 802.11a/b/g/n/ac 2x2 and Bluetooth 5 connectivity RELATED PRODUCTS Seamless cellular modem and Digi XBee 3 integration Cloud and edge-compute services integration Built-in device security with Digi TrustFence Yocto Project Linux and Android support ConnectCore ConnectCore ConnectCore Digi XBee ConnecCore 8X 6+ 6UL 8X SBC PRO Modules KitsDigi ConnectCore 8X Quad Digi ConnectCore 8X Dual SPECIFICATIONS NXP i.MX8QuadXPlus NXP i.MX8DualXZ 4x Cortex-A35 cores 1.2 GHz 2x Cortex-A35 cores 1.2 GHz APPLICATION PROCESSOR 1x Cortex-M4F 266 MHz core for real-time processing 1x Tensilica Hi-Fi 4 DSP MEMORY Up to 64 GB eMMC, up to 4 GB of LPDDR4 PMIC NXP PF8100 Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode GRAPHICS RealVideo (1080p) decode and H.264 (1080p30) encode 3D video playback in HD in high-performance families 3D video playback in HD in high-performance families Superior 3D graphics performance with up to four shaders Superior 3D graphics performance with up to four shaders Digi TrustFence, TRNG, TrustZone, ciphers, security control, secure RTC, secure JTAG, eFuses (OTP) SECURITY 1x SD 3.0 card interface handles SD/SDIO/MMC protocols 1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC) (1x additional one reserved on the SOM for supporting eMMC) 5x UARTs (4x UARTs from Cortex-A35 core, 5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from 1x UART from Cortex-M4), S/PDIF Tx/Rx Cortex-M4), S/PDIF Tx/Rx 2 2 2 2 2 2 8x I C (4xI C high-speed DMA support 4x I C low-speed no DMA 8x I C (4xI C high-speed DMA support 4x I C low-speed no DMA PERIPHERALS/INTERFACES** support) support) 2 2 4x SPI, ESAI, 4x I S/SSI, 3x FlexCAN, MLB150 + DTCP, 4x SPI, ESAI, 4x I S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY USB 2.0 OTG with PHY 4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)*, 2x MIPI DSI/LVDS, 4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)*, 1x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI MIPI CSI, 8/10-bit CSI 24-bit RGB, RTC, Watchdog, Timers, JTAG 24-bit RGB, RTC, Watchdog, Timers, JTAG ETHERNET 2x 10/100/1000M Ethernet + AVB 802.11a/b/g/n/ac: 2.412 - 2.484 GHz, 4.900 - 5.850 GHz 802.11b: 1, 2, 5.5, 11 Mbps (17 dBm typical 2 dBm) 802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical 2 dBm) 802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical 2 dBm) HT40, MCS 0-7 WI-FI 802.11ac: 15, 30, 45, 60, 90, 120, 135, 150, 180, 200 Mbps (10 dBm typical 2 dBm) HT40, MCS 0-9 Note: All data rates provided above are for 1x spatial stream (double the data rate for 2x spatial streams) Security: WEP, WPA-PSK/WPA2 personal, WPA/WPA2 enterprise, 802.11i, access point mode (up to 10 clients), Wi-Fi Direct Industry certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready BLUETOOTH Bluetooth 5 Digi Microcontroller Assist ON-MODULE MICROCONTROLLER Independent Cortex-M0+ microcontroller subsystem ASSIST Supporting ultra-low power modes <3A Industrial: -40 C to 85 C (-40 F to 185 F), depending on use case and enclosure/system design OPERATING TEMPERATURE -50 C to 125 C (-58 F to 257 F) STORAGE TEMPERATURE RELATIVE HUMIDITY 5% to 90% (non-condensing) RADIO APPROVALS US, Canada, EU, Japan, Australia/New Zealand FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548, EMISSIONS/IMMUNITY/SAFETY FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3 Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 DESIGN VERIFICATION Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT 118 castellated vias, LGA-474, 1.27 mm pitch, fully shielded for radio emissions and thermal management (heat-spreading) MECHANICAL DIMENSIONS 40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in) PRODUCT WARRANTY 3-year *PCIe is only supported on wired variants. **Each single PHY can either be a 1 x 4 lane MIPI-DSI or a 1 x 1 channel LVDS interface for a total of 2 display interfaces. In combination, the two PHYs can be configured to be a single 2-channel LVDS interface. DIGI.COM