BAV70DV SURFACE MOUNT SWITCHING DIODE ARRAY Features Mechanical Data Fast Switching Speed Case: SOT563 Ultra-Small Surface Mount Package Case Material: Molded Plastic, Green Molding Compound. UL Flammability Classification Rating 94V-0 For General Purpose Switching Applications Moisture Sensitivity: Level 1 per J-STD-020 Two BAV70 Circuits In One Package Terminals: Matte Tin Finish annealed over Copper Alloy Lead Free/RoHS Compliant (Note 1) leadframe (Lead Free Plating). Solderable per MIL-STD-202, Gree Device (Note 2) Method 208 Orientation: See Diagram Weight: 0.003 grams (approximate) SOT563 C A A 2 1 2 A A C 2 1 1 Top View Top View Bottom View Internal Schematic Ordering Information (Note 3) Part Number Case Packaging BAV70DV-7 SOT563 3000/Tape & Reel Notes: 1. No purposefully added lead. 2. Diodes Inc. sGree policy can be found on our website at BAV70DV Maximum Ratings T = 25C unless otherwise specified A Characteristic Symbol Value Unit Non-Repetitive Peak Reverse Voltage V 100 V RM V Peak Repetitive Reverse Voltage RRM Working Peak Reverse Voltage V 75 V RWM DC Blocking Voltage V R RMS Reverse Voltage 53 V V R(RMS) Forward Continuous Current (Note 4) I 300 mA FM Average Rectified Output Current (Note 4) I 150 mA O Non-Repetitive Peak Forward Surge Current t = 1.0 s 2.0 A I FSM t = 1.0s 1.0 Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 4) P 200 mW D Thermal Resistance Junction to Ambient Air (Note 4) 625 C/W R JA Operating and Storage Temperature Range T , T -65 to +150 C J STG Electrical Characteristics T = 25C unless otherwise specified A Characteristic Symbol Min Max Unit Test Condition Reverse Breakdown Voltage (Note 5) 75 V V I = 2.5A (BR)R F I = 1.0mA 0.715 F 0.855 I = 10mA F Forward Voltage V V F 1.0 I = 50mA F 1.25 I = 150mA F V = 75V 2.5 A R 50 V = 75V, T = 150 C A R J Reverse Current (Note 5) I R 30 A V = 25V, T = 150 C R J 25 nA V = 20V R Total Capacitance C 2.0 pF V = 0, f = 1.0MHz T R I = I = 10mA, F R Reverse Recovery Time t 4.0 ns rr I = 0.1 x I , R = 100 rr R L Notes: 4. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at