D5V0F4U6S 4 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY Features Mechanical Data IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV Case: SOT363 4 Channels of ESD Protection Case Material: Molded Plastic,Gree Molding Compound. UL Low Channel Input Capacitance of 0.5pF Typical Flammability Classification Rating 94V-0 Typically Used at High Speed Ports such as USB 2.0, USB3.0, Moisture Sensitivity: Level 1 per J-STD-020 IEEE1394, Serial ATA, DVI, HDMI, PCI Terminals: Matte Tin Finish annealed over Alloy 42 leadframe Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) (Lead Free Plating) Solderable per MIL-STD-202, Method 208 Halogen and Antimony Free. Green Device (Note 3) Weight: 0.006 grams (Approximate) V CH 4 CH 3 DD SOT363 65 4 12 3 GND CH 1 CH 2 Device Schematic Top View Ordering Information (Note 4) Product Compliance Marking Reel size(inches) Tape width(mm) Quantity per reel D5V0F4U6S-7 Standard TV8 7 8 3,000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See D5V0F4U6S Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Conditions Peak Pulse Current 3.0 A 8/20s, Figure 3 I PP Standard IEC 61000-4-2 ESD Protection Contact Discharge V 8 kV ESD Contact Standard IEC 61000-4-2 ESD Protection Air Discharge V 15 kV ESD Air Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 5) P 200 mW D Thermal Resistance, Junction to Ambient (Note 5) R 625 C/W JA Operating and Storage Temperature Range T , T -55 to +150 C J STG Electrical Characteristics ( T = +25C unless otherwise specified) A Characteristic Symbol Min Typ Max Unit Test Conditions Reverse Working Voltage 5.5 V V RWM Reverse Current (Note 6) 200 nA I V = 5.5V R R Reverse Breakdown Voltage V 6.0 V I = 1mA BR R Reverse Clamping Voltage, Positive Transients V 10 12 V I = 1A, t = 8/20 s CL PP p (Note 7) Dynamic Resistance R 1.0 I = 1A, t = 8/20s DYN R p 0.4 0.65 pF V = 2.5V, f = 1MHz R Capacitance (Note 8) C T 0.5 pF V = 0V, f = 1MHz R Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at