D5V0F6U8LP33
6 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY
Product Summary Features
V I C
BR (min) PP (max) T (typ) Ultra Low Profile Package (0.42mm max) and Small PCB Footprint
6V 2A 0.5pF
Area (3.38mm x 1.38mm max) Suitable for Compact Portable
Electronics
Provides ESD Protection per IEC 61000-4-2 Standard:
Description
Air 15kV, Contact 12kV
6 Channels of ESD Protection
This new generation TVS is designed to protect sensitive electronics
Low Channel Input Capacitance
from the damage due to ESD. The combination of small size and high
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
ESD surge capability makes it ideal for use in portable applications
Halogen and Antimony Free. Green Device (Note 3)
such as cellular phones, digital cameras and MP3 players.
Mechanical Data
Applications
Case: X1-DFN3313-8
Cellular Handsets Case Material: Molded Plastic, Green Molding Compound.
Portable Electronics UL Flammability Classification Rating 94V-0
Computers and Peripheral Moisture Sensitivity: Level 1 per J-STD-020
Terminals: NiPdAu over Copper Leadframe. Solderable per MIL-
e4
STD-202, Method 208
Weight: TBD grams (Approximate)
Pin Description (Top View)
Ordering Information (Note 4)
Product Compliance Marking Reel size(inches) Tape width(mm) Quantity per reel
D5V0F6U8LP33-7 Standard TG7 7 8 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See
D5V0F6U8LP33
Marking Information
TG7 = Product Type Marking Code
YM = Date Code Marking
TTGF27 YM
Y = Year (ex: B = 2014)
M = Month (ex: 9 = September)
Date Code Key
Year 2014 2015 2016 2017 2018 2019 2020
Code B C D E F G H
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
Maximum Ratings (@T = +25C, unless otherwise specified.)
A
Characteristic Symbol Value Unit Conditions
Peak Pulse Current 2.0 A 8/20s (Note 7)
I
PP
Standard IEC 61000-4-2
ESD Protection Contact Discharge 12 kV
V
ESD_Contact
Standard IEC 61000-4-2
ESD Protection Air Discharge 15 kV
V
ESD_Air
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 5) P 300 mW
D
Thermal Resistance, Junction to Ambient T = +25C R 417 C/W
A JA
Operating and Storage Temperature Range -55 to +150 C
TJ, TSTG
Electrical Characteristics (@T = +25C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Conditions
Reverse Standoff Voltage V 5.5 V
RWM
Channel Leakage Current (Note 6) 100 nA
I V = 5V, Any I/O to GND
R R
Reverse breakdown voltage 6.0 V
V I = 1mA
BR R
Forward voltage 0.85 V
V I = 4mA
F F
9.5 11.5
I = 1A, t = 8/20s
PP p
Clamping Voltage, Positive Transients (Note 7) V
VC
10.5 12.5 I = 2A, t = 8/20s
PP p
V = 0V, f = 1MHz, Any I/O to
R
0.5
GND
Channel Input Capacitance (Note 8) pF
C
T
V = 2.5V, f = 1MHz, Any I/O to
R
0.4 0.65
GND
Dynamic Resistance 0.9
R I = 1A, t = 8/20s
DYN PP p
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website
at