DT1446-04S 4 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY Product Summary Features IEC 61000-4-2 (ESD): Air 19kV, Contact 16kV V I C BR (min) PP (max) T (typ) Low Channel Input Capacitance of 0.55pF Max 6V 4.7A 0.55pF ESD Protection for four I/Os and one VCC Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Description Halogen and Antimony Free. Green Device (Note 3) The DT1446-04S is a high performance device suitable for protecting four high speed I/Os and one V . These devices are assembled in CC Mechanical Data SOT363 package. They have high ESD surge capability and low Case: SOT363 capacitance. Case Material: Molded Plastic, Green Molding Compound. UL Flammability Classification Rating 94V-0 Applications Moisture Sensitivity: Level 1 per J-STD-020 (Lead Free Plating). Typically Used for High Speed Ports such as: Solderable per MIL-STD-202, Method 208 USB 2.0 Weight: 0.006 grams (approximate) IEEE1394 HDMI Laptop and Personal Computers Flat Panel Displays Video Graphics Displays SIM Ports SOT363 Top View Device Schematic Ordering Information (Note 4) Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel DT1446-04S-7 Standard BE3 7 8 3,000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See DT1446-04S Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Conditions Peak Pulse Current ,per IEC 61000-4-5 I I/O to V , 8/20s PP I/O 4.7 A SS Operating Voltage (DC) V 6 V V to V DC CC SS V 16 kV I/O to V , per IEC 61000-4-2 ESD I/O SS ESD Protection Contact Discharge V V 30 kV V to V , per IEC 61000-4-2 ESD CC CC SS V 19 kV I/O to V , per IEC 61000-4-2 ESD I/O SS ESD Protection Air Discharge, per IEC 61000-4-2 V V 30 kV V to V , per IEC 61000-4-2 ESD CC CC SS Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation Typical (Note 5) P mW D 200 Thermal Resistance, Junction to Ambient Typical (Note 5) C/W R 625 JA Operating and Storage Temperature Range T , T -55 to 150 C J STG Electrical Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Min Typ Max Unit Test Conditions Reverse Working Voltage VRWM 5.0 V V to V CC SS Reverse Current (Note 6) I V V 5.0 A V = V = 5V, V to V R( CC to SS) R RWM CC SS Reverse Current (Note 6) I V 1.0 A V = V = 5V, any I/O to V R(IO to SS) R RWM SS Reverse Breakdown Voltage VBR 6.0 9.0 V I = 1mA, V to V R CC SS Forward Clamping Voltage V 0.8 1.0 V I = 15mA, V to V F F SS CC Reverse Clamping Voltage (Note 7) 8.5 V V I =4.7A, I/O to V , 8/20s C I/O PP SS 10 V VESD V TLP, 20A, tp = 100ns, V to V CC CC SS ESD Clamping Voltage 12 V VESD I/O TLP, 20A, tp = 100ns, I/O to V SS 0.14 R V TLP, 20A, tp = 100ns, V to V DIF CC CC SS Dynamic Resistance R 0.3 TLP, 20A, tp = 100ns, I/O to V DIF I/O SS Channel Input Capacitance C V 0.55 0.65 pF V = 2.5V, V = 5V, f = 1MHz I/O to SS R CC Channel Input Capacitance C V 0.65 pF V = 2.5V, V = floating, f = 1MHz I/O to SS R CC Variation of Channel Input V = 5V, V = 0V, I/O = 2.5V, f =1MHz, CC SS C -C 0.03 pF I/OMAX I/OMIN Capacitance T = +25C , C - C I/OMAX I/OMIN Variation of Channel Input V = floating , V = 0V, I/O = 2.5V, CC SS C -C 0.05 pF I/OMAX I/OMIN Capacitance f = 1MHz, T = +25C , C - C I/OMAX I/OMIN Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at