DT1446-04V 4 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY Product Summary Features IEC 61000-4-2 (ESD): Air 19kV, Contact 16kV V I C BR (min) PP (max) T (typ) 6V 4.7A 0.55pF Low Channel Input Capacitance of 0.55pF Typical ESD Protection for four I/Os and one V CC Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Description Halogen and Antimony Free. Green Device (Note 3) The DT1446-04V is a high performance device suitable for protecting four high speed I/Os and one V . These devices are assembled in CC Mechanical Data SOT563 package. They have high ESD surge capability and low Case: SOT563 capacitance. Case Material: Molded Plastic, Green Molding Compound. UL Flammability Classification Rating 94V-0 Applications Moisture Sensitivity: Level 1 per J-STD-020 Typically Used for High Speed Ports such as USB 2.0, Terminals: Matte Tin Finish annealed over Copper leadframe IEEE1394, HDMI, Laptop and Personal Computers, e3 (Lead Free Plating) Solderable per MIL-STD-202, Method208 Flat Panel Displays, Video Graphics Displays, SIM Ports Weight: 0.003 grams (approximate) SOT563 Top View Bottom View Device Schematic Ordering Information (Note 4) Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel DT1446-04V-7 Standard BE4 7 8 3,000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See DT1446-04V Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Conditions Peak Pulse Current ,per IEC 61000-4-5 I 4.7 A I/O to V , 8/20s PP I/O SS Operating Voltage (DC) V V to V DC 6 V CC SS VESD I/O 16 kV I/O to VSS, per IEC 61000-4-2 ESD Protection Contact Discharge V V 30 kV Vcc to V , per IEC 61000-4-2 ESD CC SS V 19 kV I/O to V , per IEC 61000-4-2 ESD I/O SS ESD Protection Air Discharge, per IEC 61000-4-2 V V 30 kV V to V , per IEC 61000-4-2 ESD CC CC SS Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation Typical (Note 5) P 380 mW D Thermal Resistance, Junction to Ambient Typical (Note 5) R 327 C/W JA Operating and Storage Temperature Range T , T -55 to +150 C J STG Electrical Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Min Typ Max Unit Test Conditions Reverse Working Voltage 5.5 V VRWM V to V CC SS Reverse Current (Note 6) 5.0 A I V V V = 5V, V to V R( CC to SS) R CC SS Reverse Current (Note 6) I V 1.0 A V = 5V, any I/O to V R(IO to SS) R SS Reverse Breakdown Voltage VBR 6.0 9.0 V I = 1mA, V to V R CC SS Forward Clamping Voltage V 0.8 1.0 V I = 15mA, V to V F F SS CC Reverse Clamping Voltage (Note 7) V 8.5 V I = 4.7A, I/O to V , 8/20s C I/O PP SS VESD V 10 V TLP, 20A, tp = 100 ns, V to V CC CC SS ESD Clamping Voltage VESD I/O 12 V TLP, 20A, tp = 100 ns, I/O to V SS R V 0.2 to V DIF CC TLP, 20A, tp = 100 ns, VCC SS Dynamic Resistance 0.3 R TLP, 20A, tp = 100 ns, I/O to V DIF I/O SS Channel Input Capacitance 0.55 0.65 pF C V V = 2.5V, V = 5V, f = 1MHz I/O to SS R CC Channel Input Capacitance 0.65 pF C V V = 2.5V, V = floating, f = 1MHz I/O to SS R CC Variation of Channel Input V = 5V, V = 0V, I/O = 2.5V, f =1MHz, CC SS C -C 0.03 pF I/OMAX I/OMIN Capacitance T=25 C , C -C I/OMAX I/OMIN V = floating , V = 0V, I/O = 2.5V, Variation of Channel Input CC SS C -C 0.05 pF I/OMAX I/OMIN Capacitance f =1MHz, T = +25C , C -C I/OMAX I/OMIN Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at