X-On Electronics has gained recognition as a prominent supplier of ZXGD3108N8TC Gate Drivers across the USA, India, Europe, Australia, and various other global locations. ZXGD3108N8TC Gate Drivers are a product manufactured by Diodes Incorporated. We provide cost-effective solutions for Gate Drivers, ensuring timely deliveries around the world.

ZXGD3108N8TC Diodes Incorporated

ZXGD3108N8TC electronic component of Diodes Incorporated
ZXGD3108N8TC Diodes Incorporated
ZXGD3108N8TC Gate Drivers
ZXGD3108N8TC  Semiconductors

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See Product Specifications
Part No. ZXGD3108N8TC
Manufacturer: Diodes Incorporated
Category: Gate Drivers
Description: Diodes Incorporated Gate Drivers 40V Active OR-ING FET CTRL 25Vcc
Datasheet: ZXGD3108N8TC Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 2.4022 ea
Line Total: USD 2.4 
Availability - 2381
Ship by Thu. 23 Jan to Mon. 27 Jan
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
992
Ship by Mon. 27 Jan to Fri. 31 Jan
MOQ : 26
Multiples : 1
26 : USD 2.3875
400 : USD 2.2875
800 : USD 2.2
2000 : USD 2.1125
6000 : USD 2.0375

67
Ship by Mon. 03 Feb to Thu. 06 Feb
MOQ : 1
Multiples : 1
1 : USD 3.2726
10 : USD 2.8327
30 : USD 2.556
100 : USD 2.2748
500 : USD 2.1479
1000 : USD 2.0933

2381
Ship by Thu. 23 Jan to Mon. 27 Jan
MOQ : 1
Multiples : 1
1 : USD 2.4022
10 : USD 2.1606
100 : USD 1.7446
250 : USD 1.6372
500 : USD 1.4359
1000 : USD 1.1796
2500 : USD 1.0186
5000 : USD 1.0065
10000 : USD 1.0052

   
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We are delighted to provide the ZXGD3108N8TC from our Gate Drivers category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ZXGD3108N8TC and other electronic components in the Gate Drivers category and beyond.

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ZXGD3108N8 40V ACTIVE OR ING MOSFET CONT ROLLER IN SO8 Description Features ZXGD3108N8 is a 40V Active ORing MOSFET Controller designed Active ORing MOSFET Controller for High- or Low-Side PSU for driving a very low R Power MOSFET as an ideal diode. This Ideal Diode to Reduce Forward Voltage Drop DS(ON) replaces the standard rectifier to reduce the forward voltage drop and -3mV Typical Turn-Off Threshold with 2mV Tolerance overall increase the power transfer efficiency. 40V Drain Voltage Rating 25V V Rating CC The ZXGD3108N8 can be used on both high-side and low-side power <5mW Standby Power with Quiescent Supply Current <400A supply units (PSU) with rails up to 40V. It enables very low R <600ns Turn-Off Time to Minimize Reverse Current DS(ON) MOSFETs to operate as ideal diodes as the turn-off threshold is Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) only -3mV with 2mV tolerance. In the typical 12V configuration, the Halogen and Antimony free. Green Device (Note 3) standby power consumption is <5mW as the low quiescent supply current is <400A. During PSU fault condition, the ORing Controller detects the power reduction and rapidly turns off the MOSFET in <600ns to block reverse current flow and avoid the common bus voltage dropping. Applications Mechanical Data Active ORing Controller in: Case: SO-8 Case Material: Molded Plastic. Green Molding Compound. (N+1) Redundant Power Supplies UL Flammability Rating 94V-0 Telecom and Networking Moisture Sensitivity: Level 1 per J-STD-020 Data Centers and Servers Terminals: Finish Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight: 0.074 grams (Approximate) Typical Configuration for SO-8 Low-Side -ve Supply Rail V V D S -ve Vout Pin Name Pin Function -ve Rail DNC DRAIN DNC Do Not Connect DNC DRAIN VG GND Power Ground GND DNC DRAIN GATE GND GATE Gate Drive GND DNC GND V DRAIN Drain Sense CC C1 ZXGD3108 GND V Power Supply CC Vcc GATE V CC GATE Vcc GND Rail GND Top View Ordering Information (Note 4) Product Marking Reel Size (inches) Tape Width (mm) Quantity per Reel ZXGD3108N8TC ZXGD3108 13 12 2,500 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See ZXGD3108N8 Absolute Maximum Ratings (Voltage relative to GND, T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Supply Voltage V 25 V CC Drain Pin Voltage V -3 to 40 V D Gate Output Voltage V V -3 to V +3 G CC Gate Driver Peak Source Current 2 A I SOURCE Gate Driver Peak Sink Current 5 A I SINK Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit 490 (Note 5) 3.92 655 (Note 6) Power Dissipation 5.24 mW P D Linear Derating Factor mW/C 720 (Note 7) 5.76 785 (Note 8) 6.28 (Note 5) 255 (Note 6) 191 Thermal Resistance, Junction to Ambient C/W R JA (Note 7) 173 (Note 8) 159 Thermal Resistance, Junction to Lead (Note 9) 135 C/W R JL Operating and Storage Temperature Range -50 to +150 C T , T J STG ESD Ratings (Note 10) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge Human Body Model ESD HBM 2,000 V 2 Electrostatic Discharge Machine Model ESD MM 200 V B Notes: 5. For a device surface mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper, in still air conditions the device is measured when operating in a steady-state condition. 6. Same as Note (5), except pins 2 & 3 (GND) and pins 5 & 6 (VCC) are both connected to separate 5mm x 5mm 1oz copper heat-sinks. 7. Same as Note (6), except both heat-sinks are 10mm x 10mm. 8. Same as Note (6), except both heat-sinks are 15mm x 15mm. 9. Thermal resistance from junction to solder-point at the end of each lead on pins 2 & 3 (GND) and pins 5 & 6 (V ). CC 10. Refer to JEDEC specification JESD22-A114 and JESD22-A11 Thermal Derating Curve 0.8 15mm x 15mm 0.7 10mm x 10mm 0.6 0.5 5mm x 5mm 0.4 Minimum 0.3 Layout 0.2 0.1 0.0 0 20 40 60 80 100 120 140 160 Junction Temperature (C) Derating Curve 2 of 10 ZXGD3108N8 April 2017 Diodes Incorporated www.diodes.com Document Number DS36530 Rev. 3 - 2 Max Power Dissipation (W)

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Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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