5962-8755101RA E2v

REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Changes IAW NOR 5962-R087-93. tjr 93-02-25 Monica L. Poelking C Add case outline Z. Update boilerplate to MIL-PRF-38535 requirements. jak 01-08-27 Thomas M. Hess D Update boilerplate to MIL-PRF-38535 requirements. - LTG 08-04-16 Thomas M. Hess Current CAGE CODE is 67268 REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Greg A. Pitz DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87551 01 L A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AC241 Octal buffer/line driver with three-state outputs 02 54AC11241 Octal buffer/line driver with three-state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line R GDIP1-T20 or CDIP4-T24 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack Z GDFP1-G20 20 Flat pack with gull wing 2 CQCC1-N20 20 Square leadless chip carrier 3 CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range (V ) .................................................................................. -0.5 V dc to +6.0 V dc 1/ CC DC Input voltage range (V )................................................................................ -0.5 V dc to V + 0.5 V dc 1/ IN CC DC Output voltage range (V ) ............................................................................. -0.5 V dc to V + 0.5 V dc 1/ IN CC Clamp diode current............................................................................................. 20 mA DC output current (per pin) .................................................................................. 50 mA DC V or GND current........................................................................................ 100 mA CC Storage temperature range (T ) ....................................................................... -65C to +150C STG Maximum power dissipation (P ) ......................................................................... 500 mW D Lead temperature (soldering, 10 seconds)........................................................... +260C Thermal resistance, junction-to-case ( ) ........................................................... See MIL-STD-1835 JC Junction temperature (T ) .................................................................................... +175C 2/ J 1/ Unless otherwise specified, all voltages are referenced to GND. 2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. SIZE STANDARD 5962-87551 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 D 2 DSCC FORM 2234 APR 97