REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R039-92. sbr 91-11-13 M. A. Frye B Drawing updated to reflect current requirements. Editorial changes throughout. 01-05-21 Raymond Monnin drw C Add case outline T. - drw 03-01-21 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerby DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43216 STANDARD 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88532 01 X A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 TDC1049 9-Bit A/D converter 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style T See figure 1 68 quad flatpack U CQCC2-J68 68 J-lead chip carrier X CDIP1-T64 64 dual-in-line Y See figure 1 64 dual-in-line Z CQCC1-N68 68 square leadless chip carried 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. V to D .......................................................................................................... +0.5 V dc to -7.0 V dc EED GND VEEA to AGND.......................................................................................................... +0.5 V dc to -7.0 V dc V to V .......................................................................................................... +0.5 V dc to -0.5 V dc EEA EED A to D ......................................................................................................... +1.0 V dc to -1.0 V dc GND GND V , V , or V to A ......................................................................................... +0.5 V dc to V IN RT RB GND EE CONV or CONV to D ......................................................................................... +0.5 V dc to V GND EE V to V .............................................................................................................. +2.5 V dc to -2.5 V dc RT RB Output short circuit duration ................................................................................. Indefinite Storage temperature range................................................................................... -65C to +150C Lead temperature (soldering, 10 seconds)........................................................... +300C Power dissipation, worst case (P )....................................................................... 6.07 W D Thermal resistance, junction-to-case ( ): JC Cases U, X and Z.............................................................................................. See MIL-STD-1835 Case Y............................................................................................................... 12C/W Case T ............................................................................................................... 20C/W Junction temperature (T )..................................................................................... +175C J SIZE STANDARD 5962-88532 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43216-5000 C 2 DSCC FORM 2234 APR 97