REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED 92-11-13 M. A. Frye A Add footnote 5 to section 1.4. Add footnote 3 to table I. Add vendor CAGE number 34335, 6Y440. Add device type 06. Editorial changes throughout. 94-01-21 M. A. Frye B Changes in accordance with NOR 5962-R108-94 95-02-14 M. A. Frye C Changes in accordance with NOR 5962-R070-95 97-02-25 Ray Monnin D Updated boilerplate. Add device type 07. Add vendor CAGE number 0HGZ7. 07-10-22 Robert Heber E Boilerplate update, part of 5 year review. ksr THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV E E E E E E E E SHEET 15 16 17 18 19 20 21 22 REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Rick Officer DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88669 01 X A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 2048 X 9 FIFO 80 ns 02 2048 X 9 FIFO 65 ns 03 2048 X 9 FIFO 50 ns 04 2048 X 9 FIFO 40 ns 05 2048 X 9 FIFO 30 ns 06 2048 X 9 FIFO 20 ns 07 2048 X 9 FIFO 25 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line package Y CDIP3-T28 or GDIP4-T28 28 Dual-in-line package Z CQCC1-N32 32 Rectangular leadless chip carrier U GDFP2-F28 28 Flat package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range ............................................................................. -0.5 V dc to +7.0 V dc DC voltage applied to outputs in high-Z state ........................................ -0.5 V dc to +7.0 V dc DC input voltage range .......................................................................... -0.5 V dc to +7.0 V dc 2/ DC output current .................................................................................. 20 mA Maximum power dissipation 3/.............................................................. 1.0 W Lead temperature (soldering, 10 seconds)............................................. +260C Thermal resistance, junction-to-case ( ): ........................................... See MIL-STD-1835 JC Junction temperature (T ) 4/ ................................................................. +150C J Storage temperature range.................................................................... -65C to +150C Temperature under bias......................................................................... -55C to +125C 1/ Generic numbers are listed on the Standard Microcircuit Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103. 2/ 1.5 V undershoots are allowed for 10 ns once per cycle. 3/ Must withstand the added P due to short circuit test (e.g., I ). D OS 4/ Maximum junction temperature may be increased to +175C during burn-in and steady-state life. SIZE STANDARD 5962-88669 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 E 2 DSCC FORM 2234 APR 97