5962-8870501KA E2v

REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate to MIL-PRF-38535 requirements. Editorial changes 03-06-10 Thomas M. Hess throughout. - jak REV SHEET REV SHEET REV STATUS REV A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY DEFENSE SUPPLY CENTER COLUMBUS Christopher A. Raush COLUMBUS, OHIO 43216 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88705 01 K A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT821 10-bit D-type flip-flop with three state outputs, TTL compatible inputs 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 Flat pack L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (V ) ................................................................................. -0.5 V dc to +6.0 V dc maximum CC DC input voltage range (V ) ............................................................................... -0.5 V dc to V + 0.5 V dc IN CC DC output voltage range (V )........................................................................... -0.5 V dc to V + 0.5 V dc OUT CC DC clamp current (I ) (I ).................................................................................. 20 mA IK OK DC output current (I )....................................................................................... 50 mA OUT DC V or GND current (I or I ).................................................................... 100 mA CC CC GND Storage temperature range (T )....................................................................... -65C to +150C STG Maximum power dissipation (P )........................................................................ 500 mW D Lead temperature (soldering, 10 seconds) ......................................................... +300C Thermal resistance, junction-to-case ( ) .......................................................... See MIL-STD-1835 JC Junction temperature (T ).................................................................................... +175C 3/ J 1.4 Recommended operating conditions. 1/ Supply voltage range (V ) ................................................................................. +4.5 V dc minimum to 5.5 V dc maximum CC Input voltage range (V ) ..................................................................................... 0.0 V dc to V IN CC Output voltage range (V )................................................................................ 0.0 V dc to V OUT CC Case operating temperature range (T ) .............................................................. -55C to +125C C Input rise and fall rate ( t/ V): V = 4.5 V or V = 5.5 V.................................................................................0 to 8 ns/V CC CC 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. SIZE STANDARD 5962-88705 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET A 2 DSCC FORM 2234 APR 97