REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Technical changes to figures 1, 2, 3 and table I. Deleted vendor CAGE number 90-11-06 W. Heckman 27014 from 5962-8953501KX and added to 5962-8953501LX. Editorial changes throughout. B Changes IAW NOR 5962-R225-92. Replaced table I. - ltg 92-06-18 Tim Noh C Change paragraphs 3.1 and 3.5 to include QD statements. Upgrade document 02-01-30 Raymond Monnin to reflect current requirements. Correct Test circuit on Figure 5. Editorial changes throughout. - les D Update drawing to current requirements. Editorial changes throughout. - gap 09-03-18 Robert M. Heber The original first sheet of this drawing has been replaced. REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 STANDARD CHECKED BY 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89535 01 K X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54F657 Octal bi-directional transceiver with 8-bit parity generator/checker and three state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or GDFP3-F24 24 Flat L GDIP3-T24 or GDIP4-T24 24 Dual-in-line 3 CQCC1-N28 28 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage ............................................................................... -0.5 V dc minimum to +7.0 V dc maximum DC input voltage range ................................................................. -0.5 V dc minimum to +7.0 V dc maximum DC input current range .................................................................. -30 mA minimum to +5.0 mA maximum Voltage applied to output in high output state ............................... -0.5 V dc to +5.5 V dc Current applied to output in low output state: A - A ........................................................................................ 40 mA 0 7 B - B PARITY, ERROR .......................................................... 96 mA 0 7 Storage temperature range ........................................................... -65C to +150 C Maximum power dissipation (P ) per device 2/ ............................ 1.15 W D Lead temperature (soldering, 10 seconds) .................................... +260C Thermal resistance, junction-to-case ( ) .................................... See MIL-STD-1835 JC Junction temperature (T ) .............................................................. +175C J 1.4 Recommended operating conditions. Supply voltage range (V ) ........................................................... +4.5 V dc to +5.5 V dc CC Maximum input clamp current (I ) ................................................ -18 mA IC Minimum high level input voltage (V ) .......................................... 2.0 V dc IH Maximum low level input voltage (V ) ........................................... 0.8 V dc IL Case operating temperature range (T ) ........................................ -55C to +125 C C 1/ Unless otherwise specified, all voltages are referenced to ground. 2/ Must withstand the added P due to short circuit test (e.g. I ). D OS SIZE STANDARD 5962-89535 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 D 2 DSCC FORM 2234 APR 97