5962-89557012A E2v

REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate to MIL-PRF-38535 requirements. Editorial changes 03-06-11 Thomas M. Hess throughout. - jak B Update test condition for high level output voltage (V ) and low level output OH 10-02-12 Thomas M. Hess voltage (V ) in table I. Update boilerplate paragraphs to MIL-PRF-38535 OL requirement. - jak REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY DEFENSE SUPPLY CENTER COLUMBUS Marcia B. Kelleher COLUMBUS, OHIO 43218-3990 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89557 01 R A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT564 Octal D-type flip-flop with three state outputs, TTL compatible inputs 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (V ) .................................................................................. -0.5 V dc to + 6.0 V dc CC DC input voltage range (V ) ................................................................................ -0.5 V dc to V + 0.5 V dc IN CC DC output voltage range (V ) ........................................................................... -0.5 V dc to V + 0.5 V dc OUT CC Clamp diode current (I , I ) ............................................................................... 20 mA IK OK DC output current (per pin) (I ) ......................................................................... 50 mA OUT DC V or GND current ....................................................................................... 100 mA CC Storage temperature range (T ) ....................................................................... -65C to +150 C STG Maximum power dissipation (P ) ........................................................................ 500 mW D Lead temperature (soldering, 10 seconds) .......................................................... +260C Thermal resistance, junction-to-case ( ) ........................................................... See MIL-STD-1835 JC Junction temperature (T ) .................................................................................... +175C 3/ J 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. SIZE STANDARD 5962-89557 MICROCIRCUIT DRAWING A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET B 2 DSCC FORM 2234 APR 97