REVISIONS
LTR DESCRIPTION DATE (YR-MO-DA) APPROVED
A Update drawing to current requirements. Editorial changes 02-02-21 Raymond Monnin
throughout. - gap
B Add QP Semiconductor as an approved source of supply and editorial 06-06-22 Raymond Monnin
changes throughout. - tcr
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED
REV
SHEET
REV
SHEET
REV STATUS REV B B B B B B B B B B B B B
OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13
PMIC N/A PREPARED BY
Rajesh Pithadia
DEFENSE SUPPLY CENTER COLUMBUS
CHECKED BY COLUMBUS, OHIO 43218-3990
STANDARD
Kenneth S. Rice
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits
in accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-90555 01 K X
Drawing number Device type Case outline Lead finish
(see 1.2.1) (see 1.2.2) (see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function t
PD
01 C20RA10 Asynchronous PLD 35 ns
02 C20RA10 Asynchronous PLD 25 ns
03 C20RA10 Asynchronous PLD 20 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
K GDFP2-F24 or CDFP3-F24 24 Flat pack
L GDIP3-T24 or CDIP4-T24 24 Dual-in-line
3, X CQCC1-N28 28 Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings. 1/
Supply voltage to ground potential ................................................ -0.5 V dc to +7.0 V dc
DC voltage applied to outputs in high Z state ............................... -0.5 V dc to +7.0 V dc
DC input voltage ........................................................................... -3.0 V dc to +7.0 V dc
Maximum power dissipation (P ) 2/ ............................................. 1.0 W
D
Lead temperature (soldering, 10 seconds) ................................... +260C
Thermal resistance, junction-to-case ( ): ................................... See MIL-STD-1835
JC
Junction temperature (T ) ............................................................. +175C
J
Storage temperature range ........................................................... -65C to +150C
Temperature under bias ................................................................ -55C to +125C
Output current into outputs (low) ................................................... -16 mA
_______
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Must withstand the added P due to short circuit test; e.g., I .
D OS
SIZE
STANDARD
5962-90555
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
REVISION LEVEL SHEET
COLUMBUS, OHIO 43218-3990
B
2
DSCC FORM 2234
APR 97