5962-9058201FA E2v

REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update to current requirements. Editorial changes throughout. - gap 06-07-10 Raymond Monnin REV SHEET REV SHEET REV STATUS REV A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD Thanh V. Nguyen 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-90582 01 E X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54F191 Up/down binary counter with preset and ripple clock 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 16 dual-in-line package F GDFP2-F16 16 flat package 2 CQCC1-N20 20 square chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range .................................................................. -0.5 V dc to +7.0 V dc DC input voltage range ............................................................... -0.5 V dc to +7.0 V dc Input current range ...................................................................... -30 mA to +5.0 mA Voltage applied to output in high state (with V = 0 V) .............. -0.5 V dc to V CC CC Storage temperature range ......................................................... -65C to +150C Ambient temperature range under bias ....................................... -55C to +125C Maximum power dissipation (P ) 1/............................................. 500 mW D Lead temperature (soldering, 10 seconds) .................................. +300C Thermal resistance, junction-to-case ( ) .................................. See MIL-STD-1835 JC Junction temperature (T ) ........................................................... +175C J 1/ Must withstand the added P due to short circuit test e.g., I . D OS SIZE STANDARD 5962-90582 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 A 2 DSCC FORM 2234 APR 97