INCH-POUND MIL-M-38510/10D 16 February 2005 SUPERSEDING MIL-M-38510/10C 3 March 1986 MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, BIPOLAR, TTL, DECODERS MONOLITHIC SILICON Inactive for new design after 7 September 1995. This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535 1. SCOPE 1.1 Scope. This specification covers the detail requirements for monolithic silicon, TTL, microcircuit decoders. Two product assurance classes and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.4). 1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535. 1.2.1 Device types. The device types are as follows: Device type Circuit 01 BCD-to-decimal decoder 02 Excess-3-to-decimal decoder 03 Excess-3-gray-to-decimal decoder 04 BCD-to-decimal decoder/driver (30 volt, open collector output) 05 BCD-to-decimal decoder/driver (15 volt, open collector output) 06 BCD-to-seven segment decoder/driver (30 volt, open collector output) 07 BCD-to-seven segment decoder/driver (15 volt, open collector output) 08 BCD-to-seven segment decoder/driver 09 BCD-to-seven segment decoder/driver (5.5 volt, open collector output) 1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535. 1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style A GDFP5-F14 or CDFP6-F14 14 Flat pack B GDFP4-F14 14 Flat pack C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43218-3990, or emailed to bipolar dscc.dla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at MIL-M-38510/10D 1.3 Absolute maximum ratings. Supply voltage range .............................................................................. -0.5 V dc to +7.0 V dc Input voltage range ................................................................................. -1.5 V dc at -12 mA to +5.5 V dc Storage temperature range .................................................................... -65 to +150C Maximum power dissipation (P ): 1/ D Device types 01, 02 and 03 .............................................................. 226 mW Device types 04 and 05 .................................................................... 341 mW Device types 06, 07, 08 and 09 ........................................................ 467 mW Lead temperature (soldering, 10 seconds) ....................................... +300C Thermal resistance, junction to case ( ): JC Cases A, B, C, D, E and F ................................................................ (See MIL-STD-1835) Junction temperature (T ) 2/ ................................................................... 175C J Maximum current into any output (output off): Device types 04, 05, 06, 07 and 09 .................................................. 1 mA 1.4 Recommended operating conditions. Supply voltage (V ) ............................................................................... 4.5 V dc minimum to 5.5 V dc CC maximum Minimum high level input voltage (V ) ................................................... 2.0 V dc IH Maximum low level input voltage (V ) .................................................... 0.8 V dc IL Sink current capability by device type: Device types 01, 02, 03 .................................................................... 16 mA Device types 04, 05 .......................................................................... 20 mA Device types 06, 07 Outputs A - G ............................................................................. 40 mA BI/RBO node .............................................................................. 8 mA Device type 08 Outputs A - G ............................................................................. 6.4 mA BI/RBO node .............................................................................. 8 mA Device type 09 .................................................................................. 10 mA Case operating temperature range (T ) ................................................. -55 to +125C C 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 1/ Must withstand the added P due to short-circuit test (e.g., I ). D OS 2/ Maximum junction temperature should not be exceeded except in accordance with allowable short duration burn-in screening condition in accordance with MIL-PRF-38535. 2