INCH-POUND MIL-M-38510/316E 14 July 2003 SUPERSEDING MIL-M-38510/316D 10 December 1987 MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, CASCADABLE LATCHES, MONOLITHIC SILICON Inactive for new design after 18 April 1997. This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for monolithic silicon, low-power Schottky TTL, latches. Two product assurance classes and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.3). 1.2 Part number. The part number should be in accordance with MIL-PRF-38535, and as specified herein. 1.2.1 Device types. The device types should be as follows: Device type Circuit 01 4 - bit cascadable bistable latch 02 Quad cascadable S - R latch 03 8 - bit cascadable addressable latch 04 4 - bit cascadable bistable latch 05 8 - bit cascadable addressable latch 1.2.2 Device class. The device class should be the product assurance level as defined in MIL-PRF-38535. 1.2.3 Case outlines. The case outlines should be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack X CQCC2-N20 20 Square leadless chip carrier 2 CQCC1-N20 20 Square leadless chip carrier Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43216-5000, by using the self addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A FSC 5962 DISTRIBUTION STATEMENT A. Approved for public release distribution is unlimited. MIL-M-38510/316E 1.3 Absolute maximum ratings. Supply voltage range ............................................................................. -0.5 V to 7.0 V Input voltage range ................................................................................ -1.5 V at -18 mA to 5.5 V Storage temperature range .................................................................... -65 to +150C Maximum power dissipation (P ) 1/ D Device types 01 and 04 .................................................................... 66 mW Device type 02 ................................................................................. 38.5 mW Device type 03 ................................................................................. 198 mW Lead temperature (soldering, 10 seconds) ............................................. 300C Thermal resistance, junction to case ( ): JC Cases E, F, X, and 2 ............................................................................ (See MIL-STD-1835) Junction temperature (T ) 2/................................................................... +175C J 1.4 Recommended operating conditions. Supply voltage (V ) .............................................................................. 4.5 V minimum to 5.5 V maximum CC Minimum high level input voltage (V ) ................................................... 2.0 V IH Maximum low level input voltage (V ) .................................................... 0.7 V IL Normalized fanout (each output) ............................................................ 10 maximum Case operating temperature range (T ) ................................................. -55C to +125C C Setup time, t : (SETUP) Data to enable: Device types 01 and 04 ............................................................. 20 ns minimum Data to enable : Device type 03 ........................................................................... 17 ns minimum Device type 05 ........................................................................... 24 ns minumum Address to enable : Device type 03 ........................................................................... 15 ns minimum Device type 05 ........................................................................... 0 ns minimum Input hold time, t : (HOLD) Data to enable: Device type 01 and 04 ............................................................... o ns minimum Data to enable : Device type 03 ........................................................................... 5 ns minimum Device type 05 ........................................................................... 0 ns minimum Address to enable : Device type 03 ........................................................................... 15 ns minimum Device type 05 ........................................................................... 0 ns minimum NOTE: Refers to rising or falling edge of the enable pulse. 1/ Must withstand the added P due to short-circuit test (e.g., I ). D OS 2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with MIL-PRF-38535. 2