INCH-POUND MIL-M-38510/319C 14 July 2003 SUPERSEDING MIL-M-38510/319B 4 March 1985 MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, LOW-POWER SCHOTTKY TTL, 4 BY 4 REGISTER FILE, CASCADABLE, MONOLITHIC SILICON Inactive for new design after 18 April 1997. This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for monolithic silicon, Schottky TTL, low-power, 4 by 4 register file microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M- 38510 have been superseded by MIL-PRF-38535, (see 6.3). 1.2 Part number. The part number should be in accordance with MIL-PRF-38535, and as specified herein. 1.2.1 Device types. The device types should be as follows: Device type Circuit 01 4 by 4 register file with 3-state outputs, cascadable 02 4 by 4 register file with open collector outputs, cascadable 1.2.2 Device class. The device class should be the product assurance level as defined in MIL-PRF-38535. 1.2.3 Case outlines. The case outlines should be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43216-5000, by using the self addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A FSC 5962 Approved for public release distribution is unlimited. DISTRIBUTION STATEMENT A.MIL-M-38510/319C 1.3 Absolute maximum ratings. Supply voltage range ............................................................................. -0.5 V dc to 7.0 V dc Input voltage range ................................................................................ -1.5 V at -18 mA to 5.5 V Storage temperature range .................................................................... -65 to +150C Maximum power dissipation (P ) 1/ D Device type 01 ................................................................................. 275 mW Device type 02 ................................................................................. 220 mW Lead temperature (soldering, 10 seconds) ............................................. 300C Thermal resistance, junction to case (JC): Cases E, F, and 2 ................................................................................ (See MIL-STD-1835) Junction temperature (T ) 2/................................................................... +175C J 1.4 Recommended operating conditions. Supply voltage (V ) .............................................................................. 4.5 V minimum to 5.5 V maximum CC Minimum high level input voltage (V ) ................................................... 2.0 V IH Maximum low level input voltage (V ) .................................................... 0.7 V IL Case operating temperature range (T ) ................................................. -55C to +125C C Minimum width of write enable or read enable pulse ............................. 25 ns Minimum setup time (data) ..................................................................... 10 ns Minimum setup time (write select) .......................................................... 15 ns Minimum hold time (data) ....................................................................... 15 ns (with respect to GW) Minimum hold time (write select) ............................................................ 5 ns Minimum latch time for new data ............................................................ 25 ns 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications and Standards. The following specifications and standards form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of these documents shall be those listed in the issue of the Departments of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard for Microelectronics. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines (Unless otherwise indicated, copies of the above specifications and standards are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ Must withstand the added P due to short-circuit test (e.g., I ). D OS 2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with MIL-PRF-38535. 2