MIL-M-38510/9E 8 February 2005 SUPERSEDING MIL-M-38510/9D 4 June 1980 MIL-M-0038510/9B 15 October 1973 MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, BIPOLAR TTL, SHIFT REGISTERS, MONOLITHIC SILICON Inactive for new desi gn after 7 September 1995. This specification is approved for use by all Depart- ments and Agencies of the Department of Defense. The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535 1. SCOPE 1.1 Scope. This specification covers the detail requirements for monolithic silicon, TTL, shift register microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.4). 1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535 and as specified herein. 1.2.1 Device types. The device types are as follows: Device type Circuit 01 4 bit right shift, left shift register 02 5 bit shift register 03 8 bit parallel out serial shift register 04 8 bit parallel load shift register 05 4 bit bidirectional shift register 06 4 bit parallel access shift register 1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535. 1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style A GDFP5-F14 or CDFP6-F14 14 Flat pack B GDFP4-14 14 Flat pack C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat-pack Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43218-3990, or emailed to bipolar dscc.dla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at MIL-M-38510/9E 1.3 Absolute maximum ratings. Supply voltage range (V ) ....................................................... -0.5 V dc to +7.0 V dc CC Input voltage range .................................................................... -1.5 V dc at -12 mA to +5.5 V dc Storage temperature range ....................................................... -65C to +150C Maximum power dissipation per register, P 1/ D Device type 01 .................................................................... 422 mW dc Device type 02 .................................................................... 400 mW dc Device type 03 .................................................................... 322 mW dc Device type 04 .................................................................... 372 mW dc Device type 05 .................................................................... 360 mW dc Device type 06 .................................................................... 372 mW dc Lead temperature (soldering 10 seconds) ................................. 300C Thermal resistance, junction-to-case ( )................................. (See MIL-STD-1835) JC Junction temperature (T ) 2/..................................................... 175C J 1.4 Recommended operating conditions. Supply voltage (V ) .................................................................. 4.5 V dc minimum to 5.5 V dc maximum CC Minimum high level input voltage .............................................. 2.0 V dc Maximum low level input voltage ............................................... 0.8 V dc Case operating temperature range (T ) .................................... -55C to 125C C Fan out Device types 01, 02, 04, 05, and 06 High logic level ............................................................ 20 Low logic level ............................................................. 10 Device type 03 High logic level ............................................................ 10 Low logic level ............................................................. 5 Device type 01 Low level setup time at mode control with respect to clock 1 input ........................................ 35 ns minimum High level setup time at mode control with respect to clock 2 input ........................................ 35 ns minimum Low level setup time at mode control with respect to clock 2 input ........................................ 10 ns minimum High level setup time at mode control with respect to clock 1 input ........................................ 10 ns minimum Width of clock pulse ........................................................... 20 ns minimum Setup time required at serial A, B, C, D inputs ................... 20 ns minimum Hold time required at serial A, B, C, D inputs ..................... 5 ns minimum Device type 02 Minimum clock pulse width ................................................. 35 ns maximum Minimum clear pulse width ................................................. 30 ns maximum Minimum preset pulse width ............................................... 30 ns maximum Serial input setup time ........................................................ 30 ns minimum Serial input hold time .......................................................... 0 ns minimum Device type 03 Minimum clock pulse width ................................................. 30 ns maximum Minimum clear pulse width ................................................. 50 ns maximum Serial setup time ................................................................ 15 ns minimum Serial hold time .................................................................. 10 ns maximum 1/ Must withstand the added P due to short circuit condition (e.g. I ) at one output for 5 seconds duration. D OS 2/ Maximum junction temperature should not be exceeded except in accordance with allowable short duration burn-in screening condition in accordance with MIL-PRF-38535. 2