0603ESDA-TR ESD Suppressor PolySurg TR Series Applications Computers and peripherals HDTV Equipment DVD Players A/V Equipment Satellite radio Cell phones PDAs Digital still cameras Digital camcorders MP3 / Multimedia players Set Top Boxes External Storage DSL Modems High speed data ports - USB 2.0/3.0 - IEEE 1394 - High speed ethernet - DVI - Infiniband - HDMI Packaging Surface Mount Device 5,000 pieces in paper tape on 7 inch diameter (178mm) reel. Ordering Information Description The PolySurg 0603ESDA-TR ESD Suppressors protect valuable high-speed data circuits from ESD damage without distorting data signals as a result of its ultra-low (0.15pF maximum) capacitance. Features Catalog Number Description 0603/1608 footprint surface mount device Ideal ESD protection for high frequency, low voltage applications. 5,000 pieces in paper tape on 7 inch diameter 0603ESDA-TR1 Provides ESD protection with fast response time (<1ns) allowing (178mm) reel. equipment to pass IEC 61000-4-2 testing Very low leakage current Ultra low capacitance (0.15pF maximum) Device Marking Bi-directional PolySurg ESD Suppressors are marked on the tape and reel Specifications packages, not individually. Since the product is bi-directional and Performance Characteristics Units Min Typ Max symmetrical, no orientation marking is required. Continuous operating voltage Vdc - - 24 Design Consideration 2 Clamping voltage V - 35 60 The location in the circuit for the TR series has to be carefully 3 determined. For better performance, the device should be placed Trigger voltage V - 125 - as close to the signal input as possible and ahead of any other 4 ESD Threat voltage capability kV - 8 15 component. Due to the high current associated with an ESD Capacitance ( 1KHz ~ 1.8GHz) pF - - 0.15 event, it is recommended to use a 0-stub pad design (pad Leakage current ( 12Vdc) nA 0.01 <0.1 - directly on the signal/data line and second pad directly on com- 2 mon ground). Peak current A - 30 45 Processing Recommendations Operating temperature C -56 +25 +105 2 1 ESD pulse withstand pulses 20 >500 - The TR series currently has a convex profile on the top surface of the part. This profile is a result of the construction of the deice. 1. Some shifting in characteristics may occur when tested over several hundred ESD pulses at They can be processed using standard pick-and-place equip- very rapid rate of 1 pulse per second or faster. ment. The placement and processing techniques for these 2. Per IEC 61000-4-2, 30A 8kV, level 4, clamp measurement made 30ns after initiation of pulse, all tests in contact discharge mode. devices are similar to those used for chip resistors and chip 3. Trigger measurement made using Transmission Line Pulse (TLP) method. capacitors. 4. PolySURG devices are capable of withstanding up to a 15kV, 45A ESD pulse. Device ratings are given at 8kV per Note 1, unless otherwise specified. 1009 BU-SB09936 Page 1 of 2 Data Sheet 4082Environmental Specifications: Moisture Resistance per EIA/IS-722 Paragraph 4.4.2. This standard is based upon MIL-STD-202G Method 103B but with temperature and relative humidity at +85C and 85% RH respectively. Test condition A (240Hr) per MIL-STD-202G. Thermal shock: MIL-STD-202, Method 107G, -55C to 125C, 30 min. cycle, 10 cycles. Vibration: MIL-STD-202F, Method 201A,(10 to 55 to 10 Hz, 1 min. cycle, 2 hrs each in X-Y-Z). Chemical resistance: ASTM D-543, 4 hrs 40C, 3 solutions (H2O, detergent solution, defluxer). Operating temperature characteristics, measurement at +25C, +105C and -56C. Full load voltage: 14.4Vdc, 18Vdc & 24Vdc for 1000 hrs, 25C. Solder leach resistance and terminal adhesion: Per EIA-576. Solderability: MIL-STD-202, Method 208 (95% coverage). Dimensions - mm (in) Soldering Recommendations R Compatible with lead and lead-free solder reflow processes Peak reflow temperatures and durations: - IR Reflow = 260C max for 10 sec. max. T H - Wave Solder = 260C max. for 10 sec. max. Recommended IR Reflow Profile: L W EIA Size L W H T R 1.600.10 0.800.10 0.500.10 0.300.20 0.700.10 0603ESDA (0.0630.004) (0.0310.004) (0.0200.004) (0.0120.008) (0.0280.004) Tape and Reel Specifications - mm (in) Recommended Pad Layout - in (mm) 4.00.1 (per IPC-SM-782 ) (.157.004) 2.00.05 B (.079.002) 2.00.75 3.50.05 (.079.030) (.138.002) A 8.00.30 (.315.012) 0.60 min (0.023 min) 60.01.5 1.750.1 2.00.5 (2.362.059) 4.00.1 (.069.004) (.080.020) 1.1 ref (.157.004) 1.50.10 (.059.004) (0.043 ref) 178.02.0 210.8 (7.008.080) (.827.032) Dimension 0603 1.900.20 A 1.0 max (.0750.008) 13.00.5 9.01.5 (0.039 max) (.512.020) 1.100.20 (.354.059) B (.0430.008) The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information con- tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life sup- port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2009 Cooper Bussmann St. Louis, MO 63178 www.cooperbussmann.com 1009 BU-SB09936 Page 2 of 2 Data Sheet 4082