HALOGEN Four-Channel ESD Suppressor HF Pb PolySurg 42510ESDA-TR1 FREE Applications Applied to a high speed signal interface, the 42510ESDA protects: Digital video equipment Mobile phone GPS Antenna Bluetooth communication equipment antenna circuit IEEE-1394 DVI HDMI Part Numbering System: 4 2510 ESDA- TR1 Surface Mount Device Four channel SIN 1 chip 2.5x1.0mm footprint size Description ESDA ESD Suppressor The Cooper Bussmann PolySurg 42510ESDA four-channel array ESD Tape and reel packaging code suppressor protects sensitive electronic circuits from the threat of Packaging electrostatic discharge (ESD) without distorting data signals. This protection is Supplied in tape and reel packaging, 5000 parts per seven inch a result of its ultra-low capacitance (0.1pF typical) that is well suited for HDMI (178mm) reel per EIA Standard 481-1 ESD protection applications. Ordering Information Features Halogen free, lead free and RoHS compliant for global applications Catalog Number Description Ultra-low capacitance (0.1pF typical) ideally suited for protecting high 42510ESDA-TR1 5000 suppressors in paper tape on a 7 inch speed data applications (178mm) reel Provides ESD protection with fast response time (<1ns) allowing equipment to pass the IEC 61000-4-2 Level 4 test Four (4) channel array Zero signal distortion Low leakage current (<0.01A typical) Electrical Specifications Environmental Specifications Characteristic Value/Range Characteristic Value Load Humidity +85C/90%RH with rated voltage for 1000 hrs Rated Voltage (max) 12V Thermal Shock -40C to +85C, 30 minute cycle, 5 cycles Leakage Current (max 12Vdc) 0.01A J-STD-020 Standard: Level 2 Moisture Resistance Test Trigger Voltage (V ) 300V Typical t (1 year floor life under 30C/65%RH conditions Clamping Voltage (V ) 30V Typical Operating Temperature Range -40C to +85C (-40F to 185F) c Storage Temperature Range -55C to +125C (-67F to +257F) Capacitance (Cp) 1MHz* 0.1pF Typical Response Time <1ns ESD Voltage Capability, IEC 61000-4-2 8kV Contact Discharge Mode ESD Voltage Capability, IEC 61000-4-2 15kV Air Discharge Mode ESD Withstand Pulses 100 Times Minimal * Note, Capacitance measured with 1V rms 0810 BU-SB10816 Page 1 of 2 Data Sheet 4378Circuit Schematic Soldering Recommendations Compatible with lead and lead-free solder reflow processes Hand soldering - soldering tip should not directly touch part - 280C max for 3 sec. max Peak reflow temperatures and durations: - IR Reflow = 260C max for 20 sec. max - Wave Solder = 260C max for 10 sec. max HDMI Application Recommended IR Reflow Profile Dimensions - mm Design Considerations W Follow the soldering recommendations to avoid deforming product B Do not use high temperature, high humidity or corrosive atmospheres L (sulfide and chloride gas) that could damage the solderability Moisture Sensitivity Level (MSL) according to J-STD-020 standard: T Level 2 (Floor Life 1 year under <30C/65%RH conditions) Solderability requirement according to IPC/JEDEC J-STD-002C, E D C Test D, Test B1 Use Sn/Ag/Cu (96.5/3.0/0.5) or equivalent solder and activated flux 5 BC D E L T W 0.2 0.3 0.2 0.5 2.5 0.5 1.0 or equivalent. 0.1 0.05 0.05 0.05 0.1 0.1 0.1 Recommended Pad Layout - mm Tape and Reel Packaging Specifications - mm ) ( & : % / 7 R S 7 D S H Unit: mm AB C D E F L W GP P XX YY Z 1 1 1 0.2 0.5 1 0.2 0.3 0.6 1.4 1.4 8.00 3.50 1.75 2.00 4.00 1.50 2.90 1.40 Note: Print solder 0.01~0.015mm thick. 0.30 0.05 0.10 0.05 0.10 0.10 0.20 0.20 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information con- tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life sup- port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2010 Cooper Bussmann www.cooperbussmann.com 0810 BU-SB10816 Page 2 of 2 Data Sheet 4378