Effective April 2016 Technical Data 4337 Supersedes December 2008 FP1005R High frequency, high current power inductors Applications Multi-phase and Vcore regulators Voltage Regulator Modules (VRMs) Server and desktop Central processing unit (CPU) Graphics processing unit (GPU) Application specific integrated circuit (ASIC) High power density Data networking and storage systems Graphics cards and battery power systems Portable electronics Point-of-Load modules Description High current carrying capacity Environmental Data Low core loss Storage temperature range (Component): Magnetically shielded -40 C to +125 C Frequency range up to 2 MHz Operating temperature range: -40 C to +125 C Inductance range 85 nH to 220 nH (ambient plus self-temperature rise) Current range 33 A to 90 A Solder reflow temperature: J-STD-020D compliant 10.2 mm x 7.0 mm footprint surface mount package in a 4.95 mm height HALOGEN Ferrite core material HF Pb FREE Halogen free, lead free, RoHS compliantFP1005R Technical Data 4337 Effective April 2016 High frequency, high current power inductors Product Specifications 1 2 3 4 5 OCL FLL I I I DCR (m) rms sat1 sat2 7 6 Part Number (nH) 10% (nH) minimum (A) (A) (A) 20C K-factor R1 Version FP1005R1-R08-R 85 61 53 90 64 0.39 7.7% 536 FP1005R1-R10-R 100 72 53 73 57 0.39 7.7% 536 FP1005R1-R12-R 120 86 53 60 48 0.39 7.7% 536 FP1005R1-R15-R 150 108 53 47 37 0.39 7.7% 536 FP1005R1-R22-R 220 158 53 33 26 0.39 7.7% 536 R2 Version FP1005R2-R08-R 85 61 50 90 64 0.47 6.7% 536 FP1005R2-R10-R 100 72 50 73 57 0.47 6.7% 536 FP1005R2-R12-R 120 86 50 60 48 0.47 6.7% 536 FP1005R2-R15-R 150 108 50 47 37 0.47 6.7% 536 FP1005R2-R22-R 220 158 50 33 26 0.47 6.7% 536 R3 Version FP1005R3-R08-R 85 61 45 90 64 0.55 5.4% 536 FP1005R3-R10-R 100 72 45 73 57 0.55 5.4% 536 FP1005R3-R12-R 120 86 45 60 48 0.55 5.4% 536 FP1005R3-R15-R 150 108 45 47 37 0.55 5.4% 536 FP1005R3-R22-R 220 158 45 33 26 0.55 5.4% 536 R4 Version FP1005R4-R12-R 120 86 45 60 48 0.70 10% 536 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 C 4. I 1 : Peak current for approximately 20% rolloff +25 C sat 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, Isat1, +25 C 5. I 2 : Peak current for approximately 20% rolloff +125 C sat -3 6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I * 10 . Bp-p:(Gauss), K: (K-factor from 3. I : DC current for an approximate temperature rise of 40 C without core loss. Derating is necessary for AC currents. rms table), L: (Inductance in nH), Symbol I (Peak to peak ripple current in Amps). PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the 7. Part Number Definition: FP1005Rx-Rxx-R temperature rise. It is recommended that the temperature of the part not exceed 125 C under worst case operating FP1005R= Product code and size conditions verified in the end application. x= Version indicator -Rxx= Inductance value in H, R= decimal point -R suffix = RoHS compliant Dimensions (mm) Part marking: FPT1005Rx = (x=version indicator), Rxx=inductance value in uH, (R=decimal point) wwllyy=date code, R=revision level. Tolerances are 0.25 millimeters unless stated otherwise. All soldering surfaces must be coplanar within 0.1016 millimeters. PCB tolerances are 0.1 millimeters unless stated otherwise. DCR is measured from point a to point b. Do not route traces or vias underneath the inductor. www.eaton.com/elx 2