Effective June 2017 Technical Data DS4072 Supersedes March 201 3 HALOGEN TVSA HF Pb Transient voltage ESD suppressor FREE Applications Computers and peripherals Digital cameras Mobile phones DVD/Media Players MP3/Multimedia players A-V Equipment External storage DSL Modems Set top boxes 1 2 Docking systems Surface Mount Device Equivalent Circuits 04 TVSA V18 C001 Product features Product Family Lead free, halogen free and RoHS compliant for Size global applications Working DC Voltage Single-line, bi-directional device for placement Capacitance in pF* flexibility * Part numbers use R to denote decimal point for decimal values of pico farads. Silicon based chip Low capacitance to meet the needs for high speed single transient voltage protection Packaging Provides ESD protection with fast response time (<1ns) allowing equipment to pass IEC 61000-4-2 Size 0201: 15,000 pieces per reel - EIA (EIAJ) level 4 test Size 0402: 10,000 pieces per reel - EIA (EIAJ) Low profile designs for board space savings Low leakage current reduces power consumption Low clamping voltage Solid-state silicon-avalanche technology Specifications Part Stand-O Breakdown Clamping Voltage Capacitance ESD Leakage Current Number Size Voltage Voltage At I = 1A pF Air/Contact (kV) (typical) peak TVSA02V05C004 0201 5 10 17 4 15/8 < 10nA TVSA04V05C006 0402 5 10 17 6 15/8 < 10nA Stand-off Voltage - Maximum operating voltage the diode can maintain and not exceed 1uA leakage current. Breakdown Voltage - Measured at any I/O pin to ground at 1mA DC current. Clamping Voltage - Maximum peak voltage across the diode with 8/20ms waveform and 1A pulse current. Capacitance - Device capacitance measured with zero volt bias at 1MHz. ESD Air/Contact - Voltages tested to IEC 61000-4-2.TVSA Technical Data DS4072 Transient voltage ESD suppressor Effective June 2017 Dimensions - mm Recommended Pad Layout - mm (in) c W a b b C d L Size a b c d H 0.23 0.30 0.45 0.83 0201 (0.009) (0.012) (0.018) (0.033) 0.51 0.61 0.51 1.70 0402 (0.020) (0.024) (0.020) (0.067) Size LW H C 0201 0.600.05 0.300.05 0.300.05 0.200.10 0402 1.000.15 0.500.10 0.500.10 0.250.15 Soldering Recommendations Tape Packaging Specifications - mm Compatible with lead and lead-free solder reflow processes Peak reflow temperatures and durations: - IR Reflow = 260C max for 30 sec. max. - Wave Solder = 260C max. for 10 sec. max. Recommended IR Reflow Profile: 0201 Carrier Dimensions A B W E F P0 P1 P2 D0 T 0.37 0.69 8.0 1.75 3.5 4.0 2.0 2.0 1.55 0.42 0.03 0.03 0.1 0.05 0.05 0.1 0.05 0.05 0.05 0.03 Time (seconds) 0402 Carrier Dimensions 0.58 1.2 8.0 1.75 3.5 4.0 2.0 2.0 1.55 0.60 0.03 0.03 0.1 0.05 0.05 0.1 0.05 0.05 0.05 0.03 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics 2017 Eaton Eaton is a registered trademark. All Rights Reserved Printed in USA Publication No. DS4072 BU-SB13279 All other trademarks are property June 2017 of their respective owners. Temperature (C)