PKF series
PKF series
General information
SMD and through hole versions with
ultra-low component height 8.0 mm
(0.315 in.)
Up to 87% efficiency at full load
Safety requirements in accordance
with EN60950
MTTF >10 million hours at +50C case
temperature (+40C ambient)
Low EMI
Patents
US: D357901 DE: M94022763
The MacroDens PKF family of true component with present and future application needs, including
level on-board DC/DC power modules are intended non temperature controlled environments. The
as distributed power sources in decentralized power mechanical design offers surface mount and through-
systems. Utilization of thick film technology and a hole versions, delivered in ready-to-use tubes, trays or
high degree of silicon integration has made it possible tape & reel packages, and compatibility with semi and
to achieve a MTTF of more than 10 million hours. fully aqueous cleaning processes. The PKF series is
The high reliability and the very low heights of these manufactured in highly automated production lines
DC/DC power modules makes them particularly using SMT, laser trimming, 100% burn-in and ATE
suited for Information Technology and Telecom final inspection.
(IT&T) applications, with board spacing down to Ericsson Microelectronics AB has been an ISO 9001
15 mm or 0.6 in. They are optimized for an certified supplier since 1991. For a complete product
operational ambient temperature range in compliance program please reference the back cover.
Environmental Characteristics
Characteristics Test procedure & conditions
Frequency 10500 Hz
Vibration JESD 22-B103 Amplitude 0.75 mm
(Sinusoidal) (IEC 68-2-6 F
c) Acceleration 10 g
Number of cycles 10 in each axis
Frequency 10500 Hz
Acceleration density
Random MIL-STD-883
2
spectrum 0.5 g /Hz
vibration Method 2026
Duration 10 min in 3 directions
(IEC 68-2-34 E
d)
Reproducability medium (IEC 62-36)
Shock
JESD 22-A104 Peak acceleration 200 g
(Half sinus)
Shock duration 3 ms
(IEC 68-2-14 N
a)
JESD 22-A101 Temperature 85C
Temperature
(IEC 68-2-3 C Humidity 85% RH
a
change
with bias) Duration 1000 hours
Accelerated JESD 22-B104 Temperature
40C+125C
damp heat (IEC 68-2-27 E Number of cycles
a) 500
Aggressive Duration 96 h
JESD 22-A-A107
35C
environment Temperature
(IEC 68-2-11 K )
a
JESD 22-B106 Temperature, solder
Resistance to 260C
1) 2)
(IEC 68-2-20 T 1A) Duration 10...13 s
soldering temp b
High temp Temperature
125C
JESD22-A10
Duration
Storage life
1000hrs
Lead Integrity JESD22-B105 Number of cycles 2
JESD22-B102
Solderability
Temperature 85C
Maximum load
Operational
Input voltage on 9min
life test
Input voltage off 3min
Duration 1000hrs
Moisture reflow
J-STD-020 Level 1
Senitive classification
1)
Applies to through-hole versions
2)
For surfacemount versions please see soldering profile page 4.
2 EN/LZT 146 57 R1A Ericsson Microelectronics AB, March 2001