Ericsson Internal Limited Internal EEE TABLE OF CONTEPRODUCT SPECIFICATION NTS 1 (1)1 (3) PrPreparepareedd ( (aallsso so subjubjecectt r reesponsisponsibbllee i iff othotheerr)) NNoo MPM/BY/P HMPM/BY/P Henrienrikk Sund Sundh h 1/1301 BM00152-EN/LZR 642 4 Uen T146313 Technical SpeciTechnical SpeciTechnical Speci cationcationcation ApprApprovoved Ced Checked hecked DDate ate RReevv RRefereferencence e EN/LZT 146 EN/LZT 146 EN/LZT 146 313331313 R1 R1 R1A BB AugAugFebruary 200 20077 2006 PPPMMMEEE 400040004000 series series series MPM/BY/M Krister Lundberg 20062006-02-02--21 20 A A Ericsson Power Modules AB Ericsson Power Modules AB Ericsson Power Modules AB POLPOLPOL regulatorregulatorregulator, Input , Input , Input 2.952.952.95---3.653.653.65 V, Output V, Output V, Output 666 A/ A/ A/151155 W W W Key Features 6A output current 2.95-3.65V input voltage range Output voltages from 0.8V up to 2.5V Industry standard POLA compatible 22.1 x 12.57 x 8.51 mm (0.87 x 0.5 x 0.335 in.) High efficiency, up to. 94% Auto Track sequencing pin More than 4.5 million hours MTBF General Characteristics Operating temperature: -40C to 85C Input under voltage protection Start up into a pre-biased output safe Output short-circuit protection On/Off inhibit control Wide output voltage adjust function Safety Approvals Design for Environment Highly automated manufacturing ensures quality ISO 9001/14001 certified supplier Meets requirements in high- temperature lead-free soldering processes. Contents General Information .............................................................2 Safety Specification .............................................................3 Absolute Maximum Ratings .............................................................4 Product Program Ordering No. 0.8-2.5 V/6 A PME 4118T ............................................ 1.0 V/6 A Electrical Specification ............................................................. 5 1.2 V/6 A Electrical Specification ............................................................. 8 1.5 V/6 A Electrical Specification ...........................................................11 1.8 V/6 A Electrical Specification ...........................................................14 2.5 V/6 A Electrical Specification ...........................................................17 EMC Specification ........................................................... 20 Operating Information ...........................................................20 Thermal Consideration ...........................................................22 Connections ...........................................................23 Mechanical Information ...........................................................24 Soldering Information ...........................................................26 Delivery Information ...........................................................28 Product Qualification Specification ...........................................................29 Ericsson Internal EE PRODUCT SPECIFICATION 2 (3) Prepared (also subject responsible if other) No. MPM/BY/P Henrik Sundh 1/1301 BMR 642 4 Uen 2 Technical SpeciTechnical Speci cationcation Approved Checked Date Rev Reference EN/LZT 146 EN/LZT 146 331313 R1 R1A B AugFebruary 2007 2006 PPMMEE 40004000 series series MPM/BY/M Krister Lundberg 2006-02-20 A Ericsson Power Modules AB Ericsson Power Modules AB POLPOL regulatorregulator, Input , Input 2.952.95--3.653.65 V, Output V, Output 66 A/ A/1515 W W General Information - Lead in solder for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network Ordering Information management for telecommunication See Contents for individual product ordering numbers. (Note: the products are manufactured in lead-free soldering processes and the lead present is only Option Suffix located in the terminal plating finishes on some Through hole pin P PME4118TP components) SMD pin S PME4118TS SMD pin, leadfree reflow temperature capable R PME4118TSR Quality Statement The products are designed and manufactured in an industrial environment where quality systems and methods Reliability like ISO 9000, 6 (sigma), and SPC are intensively in use to The Mean Time Between Failure (MTBF) is calculated at full boost the continuous improvements strategy. Infant output power and an operating ambient temperature (T ) of A mortality or early failures in the products are screened out +40C. Different methods could be used to calculate the and they are subjected to an ATE-based final test. predicted MTBF and failure rate which may give different Conservative design rules, design reviews and product results. Ericsson Power Modules currently uses Telcordia qualifications, plus the high competence of an engaged SR332. work force, contribute to the high quality of our products. - Predicted MTBF for the series is: Warranty - 4.49 million hours according to Telcordia SR332, issue Warranty period and conditions are defined in Ericsson 1, Black box technique. Power Modules General Terms and Conditions of Sale. Telcordia SR332 is a commonly used standard method Limitation of Liability intended for reliability calculations in IT&T equipment. The parts count procedure used in this method was originally Ericsson power Modules does not make any other modelled on the methods from warranties, expressed or implied including any warranty of MIL-HDBK-217F, Reliability Predictions of Electronic merchantability or fitness for a particular purpose Equipment. (including, but not limited to, use in life support It assumes that no reliability data is available on the actual applications, where malfunctions of product can cause units and devices for which the predictions are to be made, injury to a persons health or life). i.e. all predictions are based on generic reliability parameters. Compatibility with RoHS requirements The products are compatible with the relevant clauses and requirements of the RoHS directive 2002/95/EC and have a maximum concentration value of 0.1% by weight in homogeneous materials for lead in other applications other than lead in solder, lead in high melting temperature type solder, lead in glass of electronics components, lead in electronic ceramic parts and lead as an alloying element in copper containing up to 4% lead by weight, mercury, hexavalent chromium, PBB and PBDE and of 0.01% by weight in homogeneous materials for cadmium. Exemptions in the RoHS directive utilized in the products: - Lead as an alloying element in copper alloy containing up to 4% lead by weight (used in connection pins made of Brass) - Lead in high melting temperature type solder (used to solder the die in semiconductor packages) - Lead in glass of electronics components and in electronic ceramic parts (e.g. fill material in chip resistors)