X-On Electronics has gained recognition as a prominent supplier of GB2X100MPS12-227 Discrete Semiconductor Modules across the USA, India, Europe, Australia, and various other global locations. GB2X100MPS12-227 Discrete Semiconductor Modules are a product manufactured by GeneSiC Semiconductor. We provide cost-effective solutions for Discrete Semiconductor Modules, ensuring timely deliveries around the world.

GB2X100MPS12-227 GeneSiC Semiconductor

GB2X100MPS12-227 electronic component of GeneSiC Semiconductor
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Part No.GB2X100MPS12-227
Manufacturer: GeneSiC Semiconductor
Category: Discrete Semiconductor Modules
Description: Discrete Semiconductor Modules 1200V 200A SOT-227 SiC Schottky MPS
Datasheet: GB2X100MPS12-227 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 134.552 ea
Line Total: USD 134.55 
Availability - 2
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 134.552
10 : USD 129.525

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Vf - Forward Voltage
Vr - Reverse Voltage
Mounting Style
Package / Case
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Technology
Configuration
Brand
If - Forward Current
Ifsm - Forward Surge Current
Ir - Reverse Current
Pd - Power Dissipation
Product Type
Factory Pack Quantity :
Subcategory
Vrrm - Repetitive Reverse Voltage
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We are delighted to provide the GB2X100MPS12-227 from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the GB2X100MPS12-227 and other electronic components in the Discrete Semiconductor Modules category and beyond.

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GB2X100MPS12-227 TM 1200V 200A SiC Schoktt y MPS Diode Silicon Carbide Schoktt y Diode V = 1200 V RRM IF (T = 117C) = 200 A * C Q = 1068 nC * C Features Package Low V for High Temperature Opera tion F A A Enhanced Surge and Avalanche Robustness Superior Figure of Merit Q /I C F Low Thermal Resistance RoHS Low Reverse Leakage Current Temperature Independent Fast Switching Positi ve Temperature Coe c ient of V F High dV/dt Ruggedness SOT-227 REACH K K Advantages Applicaoti ns Improved System E c iency EV Fast Chargers High System Reliability Solar Inverters Op timal Price Performance Train Auxiliary Power Supplies Reduced Cooling Requirements High frequency Converters Increased System Power Density Motor Drives Zero Reverse Recovery Current Induc tion Heating and Welding Easy to Parallel without Thermal Runaway Uninterruptible Power Supply (UPS) Enables Extremely Fast Switching Pulsed Power Absolute Maximum Rangti s (At T = 25C Unless Otherwise Stated) C Parameter Symbol Conditions Values Unit Note Repetitive Peak Reverse Voltage (Per Leg) V 1200 V RRM TC = 75C, D = 1 139 / 278 Continuous Forward Current (Per Leg / Per Device) IF TC = 100C, D = 1 117 / 234 A Fig. 4 T = 117C, D = 1 100 / 200 C T = 25C, t = 10 ms 1000 Non-Repetitive Peak Forward Surge Current, Half Sine C P IF,SM A Wave (Per Leg) T = 150C, t = 10 ms 800 C P Repetitive Peak Forward Surge Current, Half Sine Wave TC = 25C, tP = 10 ms 600 I A F,RM (Per Leg) TC = 150C, tP = 10 ms 420 Non-Repetitive Peak Forward Surge Current (Per Leg) I T = 25C, t = 10 s 5000 A F,MAX C P 2 2 2 i t Value (Per Leg) i dt T = 25C, t = 10 ms 5000 A s C P Non-Repetitive Avalanche Energy (Per Leg) EAS L = 0.4 mH, IAS = 100 A 1797 mJ Diode Ruggedness (Per Leg) dV/dt V = 0 ~ 960 V 200 V/ns R Power Dissipation (Per Leg / Per Device) P T = 25C 493 / 986 W Fig. 3 TOT C Operating and Storage Temperature Tj , Tstg -55 to 175 C * Per Device Rev 21/Mar Latest Version at: www.genesicsemi.com/sic-schottky-mps/GB2X100MPS12-227/GB2X100MPS12-227.pdf Page 1 of 7GB2X100MPS12-227 TM 1200V 200A SiC Schoktt y MPS Diode Electrical Characteriscti s (Per Leg) Values Parameter Symbol Conditions Unit Note Min. Typ. Max. I = 100 A, T = 25C 1.5 1.8 F j Diode Forward Voltage V V Fig. 1 F I = 100 A, T = 175C 1.9 F j V = 1200 V, T = 25C 8 40 R j Reverse Current I A Fig. 2 R V = 1200 V, T = 175C 108 R j VR = 400 V 368 Total Capacitive Charge Q nC Fig. 7 C VR = 800 V 534 IF IF,MAX dI /dt = 200 A/s F V = 400 V R Switching Time tS < 10 ns V = 800 V R VR = 1 V, f = 1MHz 6092 Total Capacitance C pF Fig. 6 VR = 800 V, f = 1MHz 356 Thermal/Package Characteriscti s Values Parameter Symbol Conditions Unit Note Min. Typ. Max. Thermal Resistance, Junction - Case R 0.3 C/W Fig. 9 thJC (Per Leg) Weight WT 28.0 g Mounting Torque T Screws to Heatsink 1.5 Nm M Terminal Connection Torque T M4 Screws 1.3 Nm C t = 1s (50/60 Hz) 3000 Isolation Voltage(RMS) V V ISO t = 60s (50/60 Hz) 2500 d Terminal to Terminal 10.5 Ctt Creepage Distance on Surface mm d Terminal to Backside 8.5 Ctb d Terminal to Terminal 3.2 Stt Striking Distance Through Air mm d Terminal to Backside 6.8 Stb Rev 21/Mar Latest Version at: www.genesicsemi.com/sic-schottky-mps/GB2X100MPS12-227/GB2X100MPS12-227.pdf Page 2 of 7

Tariff Desc

8541.30.00 20 No - Thyristors, diacs and triacs, other than photo- sensitive devices Free
GENESIC SEMICONDUCTOR INC.
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