WS488 SAC305 Water Soluble Solder Paste Features: - Excellent Wetting - Superior Slump Resistance - Aqueous Wash with Water - Extended Cleaning Window - 8 Hour + Stencil Life - Large Process Window Description: AIMs WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8+ hours of stencil life. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications. Easily cleaned in tap water, this all purpose water soluble product was created to meet the industrys demand for a consistently reliable water soluble product. Printing: - Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16 mm ( to inch) is normally sufficient to begin). - Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and workable properties. - WS488 provides the necessary tack time and force for todays high speed placement equipment, which will enhance product performance and reliability. RECOMMENDED INITIAL PRINTER SETTINGS BELOW ARE DEPENDENT ON PCB AND PAD DESIGN PARAMETER RECOMMENDED INITIAL SETTINGS PARAMETER RECOMMENDED INITIAL SETTINGS Squeegee Pressure 0.10-0.30 kg/cm (.6 - 1.7 lbs/In.) of blade PCB Separation Distance 0.75-2.0 mm (.030-.080) Squeegee Speed 12-150 mm/sec (.5-6/sec) PCB Separation Speed Slow Snap-off Distance On Contact 0.00 mm (0.00) Reflow Profile: Two unique profile families are depicted below both can be used in ramp-spike or ramp-soak-spike applications, and they each have similar reflow temperatures. The two profiles differ in where they reach their respective peak temperatures, as well as the time above liquidus (TAL). The shorter profile of the two would apply to smaller assemblies, where as the longer profile would apply to larger assemblies, such as backplanes or high-density boards. The shaded area defines the process window. Oven efficiency, board size/mass, component type and density all influence the final profile for a given assembly. These profiles are starting points, and processing boards with thermal- couples attached is recommended to optimize the process. RATE OF RAMP PROGRESS TO PEAK TIME ABOVE COOLDOWN PROFILE RISE 2C / TO THROUGH TEMP 230C- 217C (425F) 4 C / SEC LENGTH SEC MAX 150C 150C-175C 245C (445F- AMBIENT (302F) (302F-347F) 474F) TO COOL DOWN Short Profiles 75 Sec 30-60 Sec 45-75 Sec 30-60 Sec 45 15 Sec 2.75-3.5 Min Long Profiles 90 Sec 60-90 Sec 45-75 Sec 60-90 Sec 45 15 Sec 4.5-5.0 Min THE RECOMMENDED REFLOW PROFILE FOR WS488 IS PROVIDED AS A GUIDELINE. OPTIMAL PROFILE MAY DIFFER DUE TO OVEN TYPE, ASSEMBLY LAYOUT, OR OTHER PROCESS VARIABLES. CONTACT AIM TECHNICAL SUPPORT IF YOU REQUIRE ADDITIONAL PROFILING ASSISTANCE. THE REFLOW PROFILE FOR THE SAC305 PASTES USING A VAPOR PHASE REFLOW OVEN: PEAK TEMPERATURE RANGE I S 230C 245C. Compatible Products: - Electropure Solder Bar - WS Tacky Flux - WS715 WS375 Spray Flux - WS482 Cored Wire - Epoxy 4089 Chip Bonding Epoxy - 200AX Stencil Cleaner Cleaning: WS488 can be cleaned easily with normal tap water. Deionized water is recommended for the final rinse. A temperature of 38C (100F) - 66C (150F) is sufficient for removing residues. An in-line or other pressurized spray cleaning system is suggested, but is not required. Handling and Storage: - WS488 has a refrigerated shelf life of 1 year at 4C (40F) - 12C (55F). - Allow the solder paste to warm naturally to ambient temperature (8 hrs.) prior to breaking the seal for use. - Mix the product lightly and thoroughly for 1 to 2 minutes to ensure even distribution of any separated material. - Do not store new and used paste in the same container, and reseal any opened containers while not in use. - Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal. Safety: - Use with adequate ventilation and proper personal protective equipment. - Refer to the accompanying Material Safety Data Sheet for any specific emergency information. - Do not dispose of any lead-containing materials in non-approved containers. Physical Properties: ITEM SPECIFICATION Appearance Gray, Smooth, Creamy Alloy SAC305 Melting Point 217C Particle Size T3, T4, T5 General Metal Loading 88.5% (T3) Viscosity Print/Dispense Versions Available Packaging Available in all industry standard packaging.