Technical Data Sheet LOCTITE TCF 1000 Known as THERMSTRATE October -2015 PRODUCT DESCRIPTION 100 psi C-cm/W 0.129 LOCTITE TCF 1000 provides the following product characteristics: (C-in/W) (0.02) Technology Phase Change ALH Appearance White Substrate Type Aluminum Operating Temperature up to 150C Thickness : Range Substrate mm 0.051 Application Thermal management (inches) (0.002) Typical Assembly DC-DCconverters Compound Thickness ,Nominal, each side mm 0.025 Applications Solid state relays (inches) (0.001) Power transistors Total mm 0.101 Power modules (inches) (0.004) IGBT Thermal Impedance ,ASTM-D- 5470 RF components 20 psi C-cm/W 0.374 Used between any non-isolated (C-in/W) (0.058) heat dissipating component and a 100 psi C-cm/W 0.232 heat sink or chassis (C-in/W) (0.036) : LOCTITE TCF 1000 phase- change thermal interface material is 20 psi C-cm/W 0.374 suitable for use between a heat sink and a variety of heat generating (C-in/W) (0.058) components .This product is supplied as a dry compound coated onto an aluminum substrate . 100 psi C-cm/W 0.232 (C-in/W) (0.036) The compound is designed to flow at the phase change temperature, conforming to the surface features of the heat sink and component . Upon flow, and in conjunction with component mounting pressure, air is expelled from the interface, reducing thermal impedance, performing PHYSICAL PROPERTIES as a highly efficientthermal transfer material . Phase Change Temperature, C 60 Viscosity above phase change temperature Thixotropic LOCTITE TCF 1000 is a superior replacement for messy thermal greases and similar interface compounds . MATERIAL PROPERTIES PRODUCT PERFORMANCE Thermal Impedance vs. Mounting Pressure LOCTITE TCF 1000 is supplied in a range of substrate The performance of any phase- change thermal interface material thicknesses to match surface finish and flatness considerations will be improved by increasing the mounting pressure at the in the interface area. Data for the two most common interface . The graph below shows the thermal impedance values thicknesses is supplied below. generated on an platform .The test block dimensions are 2 x 2 , the finish is 64microinches and the flatness is 0.002 in/in. The power AL level is 80 watts . Substrate Type Aluminum Thickness : Thermal Impedence vs. Mounting Pressure Graph Substrate mm 0.051 (inches) (0.002) Compound Thickness ,Nominal, each side mm 0.013 (inches) (0.0005) Total mm 0.076 (inches) (0.003) Thermal Impedance ,ASTM-D- 5470 20 psi C-cm/W 0.194 (C-in/W) (0.03) 100 psi C-cm/W 0.129 (C-in/W) (0.02) : 20 psi C-cm/W 0.194 (C-in/W) (0.03)TDS LOCTITE TCF 1000, October -2015 Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative Not for product specifications The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product. Conversions (C x 1.8)+ 32 =F kV/mm x 25.4 =V/mil mm /25.4 =inches N x 0.225=lb/F N/mm x 5.71=lb/in psi x 145 =N/mm MPa =N/mm Nm x 8.851 = lbin Nm x 0.738=lbft Nmm x 0.142 =ozin GENERAL INFORMATION mPas =cP For safe handling information on this product, consult the Safety Data Sheet, (SDS). SURFACE CONDITIONS Different versions of LOCTITE TCF 1000 have been developed to address the variables associated with a wide range of applications. As a general recommendation, we suggest: Surface Finishes 64 microinches or better 1.6 microns or better Surface Flatness 0.002 inches/inch or better 0.002 cm/cm or better DIRECTIONS FOR USE 1. LOCTITE TCF 1000 is completely re-workable. No foreign residue remains after disassembly. A replacement pad can be installed without further cleaning. 2. Ifa clean surface is required, any presence of a compound can be easily removed with mineral spirits. 3. LOCTITE TCF 1000 is not sensitive to mounting orientation due to its thixotropic rheology. 4. This product does not contain silicones and will not migrate from the interface area. AVAILABILITY Pre-tooled pads are available for many commonly used electronic devices. LOCTITE TCF 1000 may be available as single diecut pads, multi- pad sheets, or on continuous rolls for high volume production. LOCTITE TCF 1000 is also available with adhesive edge strips for ease of assembly. In this case, the pad will be oversized so that the adhesive is outside the thermal path. This enables the adhesive to be provided without compromising the thermal performance of the portion of the pad in the contact area of the thermal path. STORAGE: Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling. Optimal Storage: 23 C. Storage greater than 40 C can adversely affect product properties. Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.2891.8000 For the most direct access to local sales and technical support visit: www.henkel.com/electronics