Technical Data Sheet BERGQUIST GAP FILLER TGF 1000 Known as BERGQUIST GAP FILLER1000 September -2018 PRODUCT DESCRIPTION TYPICAL APPLICATIONS A thermally conductive, liquid gap fillermaterial . Automotive electronics (HEV,NEV, batteries) Computer and peripherals Technology Silicone Between any heat- generating semiconductor and a heat sink Appearance (cured) Gray Appearance -Part A Gray Telecommunications Thermally conductive vibration dampening Appearance -Part B White Cure Room temperature cure or Cure at elevated temperatures TYPICAL PROPERTIES OF UNCURED MATERIAL Application Thermal management, Mixed Viscosity, Brookfield -RV , -Helipath ,ASTM D2196, TIM(Thermal InterfaceMaterial) 25 C, mPas (cP) : Mix Ratio by weight: 1 :1 Spindle TF,speed 20 rpm 100,000 Part A:Part B Density ,ASTM D792,g/cc 1.6 Mix Ratio by volume: 1 :1 Pot Life 25 C (time to double viscosity), minutes 15 Part A:Part B ShelfLife 25C ,days 180 Solids Content, % 100 Operating Temperature -60 to 175C TYPICAL CURE SCHEDULE Range Cure Schedule 60 to 120 minutes 25C FEATURES AND BENEFITS 5 minutes 100C Thermal Conductivity: 1.0W/m-K Rheometer -time to read 90% cure. Ultra- conforming, designed for fragileand low-stress applications The above cure profiles are guideline recommendations. Cure Ambient and accelerated cure schedules conditions (time and temperature) may vary based on customers experience and their application requirements, as 100% solids -no cure by-products well as customer curing equipment, oven loading and actual Excellent low and high temperature mechanical and oven temperatures. chemical stability BERGQUIST GAP FILLER TGF 1000 is a thermally TYPICAL PROPERTIES OF CURED MATERIAL conductive, liquid gap fillingmaterial . It is supplied as a two-component, room or elevated temperature curing system . Physical Properties The material is formulated to provide a balance of cured Hardness, Shore 00,Thirty second delay value , 20 material properties highlighted by a low modulus and good ASTM D2240 compression set (memory) . The result is a soft, thermally Heat Capacity ,ASTM E1269,J/g-K 1.0 conductive, form-in-place elastomer ideal for coupling hot Flammability, UL 94 V-0 electronic components mounted on PC boards with an adjacent metal case or heat sink. Electrical Properties Beforecure, BERGQUIST GAP FILLERTGF 1000 flows under Dielectric Strength ,ASTM D149,V/mil 500 pressure likea grease. Aftercure, it does not pump from the 11 Volume Resistivity ,ASTM D257,ohm-cm 110 interface as a result of thermal cycling .Unlike thermal grease, Dielectric Constant ,ASTM D150 1,000 Hz 5.0 the cured product is dry to the touch .Unlike cured gap filling materials, the liquid approach offersinfinitethickness with little Thermal Properties or no stress during displacement and eliminates the need for Thermal Conductivity ,ASTM D5470 ,W/(m-K) 1.0 specific pad thickness and die-cut shapes for individual applications .BERGQUIST GAP FILLERTGF 1000 is intended for use in thermal interface applications when a strong structural bond is not required.TDS BERGQUIST GAP FILLERTGF 1000, September -2018 GENERAL INFORMATION Disclaimer Note: For safe handling information on this product, consult the Safety The information provided in this Technical Data Sheet (TDS) including the Data Sheet, (SDS). recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. The product Not for product specifications can have a variety of differentapplications as well as differingapplication and The technical data contained hereinare intended as reference working conditions inyour environment that are beyond our control. Henkel is, only. Please contact your local quality department for therefore,not liable forthe suitability of our product forthe production processes and conditions in respect of which you use them, as well as the intended assistance and recommendations on specifications for this applications and results. We strongly recommend that you carry out your own product. priortrials to confirm such suitability of our product. Any liability inrespect of the information inthe Technical Data Sheet or any other The above cure profiles are guideline recommendations. Cure written or oral recommendation(s) regardingthe concerned product is excluded, except ifotherwise explicitly agreed and except inrelation to death or personal conditions (time and temperature) may vary based on injury caused by our negligence and any liability under any applicable mandatory customers experience and their application requirements, as product liability law. well as customer curing equipment, oven loading and actual In case products are delivered by Henkel Belgium NV, Henkel Electronic oven temperatures. Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: CONFIGURATIONS AVAILABLE Incase Henkel would be nevertheless held liable,on whatever legal ground, Henkels liability will inno event exceed the amount of the concerned delivery. BERGQUIST GAP FILLER TGF 1000 is available in the In case products are delivered by Henkel Colombiana, S.A.S.the following following configurations: disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the Cartridges recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. Henkel is, Kits therefore,not liable forthe suitability of our product forthe production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own Application: priortrials to confirm such suitability of our product. Mixed and dispensed using dual tube cartridge packs with Any liability inrespect of the information inthe Technical Data Sheet or any other static mixers and a manual or pneumatic gun written or oral recommendation(s) regardingthe concerned product is excluded, except ifotherwise explicitly agreed and except inrelation to death or personal Mixed and dispensed using industry standard high volume injury caused by our negligence and any liability under any applicable mandatory mixing and dispensing document product liability law. In case products are delivered by Henkel Corporation, Resin Technology STORAGE Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: Store product in the unopened container in a dry location. The data contained hereinare furnished forinformation only and are believed to Storage information may be indicated on the product container be reliable.We cannot assume responsibility forthe results obtained by others labeling. over whose methods we have no control. It is the user s responsibility to determine suitability forthe user s purpose of any production methods mentioned Optimal Storage: 5 to 25C fora 6 month shelf life.Material hereinand to adopt such precautions as may be advisable forthe protection of property and of persons against any hazards that may be involved inthe handling removed from containers may be contaminated during use. Do and use thereof. Inlight of the foregoing,Henkel Corporation specifically not return product to the originalcontainer. HenkelCorporation disclaims all warranties expressed or implied, including warranties of cannot assume responsibility for product which has been merchantability or fitness for a particular purpose, arising from sale or use contaminated or stored under conditions other than those of Henkel Corporations products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, previously indicated. Ifadditional information is required, including lost profits. The discussion herein of various processes or please contact your local Technical Service Center or compositions is not to be interpreted as representation that they are freefrom Customer Service Representative. domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before Conversions repetitive use, using this data as a guide. This product may be covered by one or (C x 1.8)+ 32 =F more United States or foreignpatents or patent applications. kV/mm x 25.4 =V/mil Trademark usage: Except as otherwise noted Alltrademarks inthis document are trademarks and/or registered trademarks of Henkel and its affiliates in the mm /25.4 =inches U.S. and elsewhere. N x 0.225=lb N/mm x 5.71=lb/in psi x 145 =N/mm Reference 1 MPa =N/mm Nm x 8.851 = lbin Nm x 0.738=lbft Nmm x 0.142 =ozin mPas =cP Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.3898.4800 For the most direct access to local sales and technical support visit: www.henkel.com/electronics