TechnicalData Sheet BERGQUIST GAP FILLER TGF 1100SF Known as BERGQUIST GAP FILLER1100SF June -2019 PRODUCT DESCRIPTION Silicone-sensitive optic components Thermally Conductive, Silicone-Free Gap FillingMaterial. Dielectricfor bare-leaded devices Technology Siliconefree TYPICAL PROPERTIES OF UNCURED MATERIAL Appearance (cured) Orange The viscosity ofthe BERGQUIST GAP FILLERTGF 1100SF Appearance -Part A Yellow material is temperature dependent. The table below provides the multiplication factor to obtain viscosity at various Appearance -Part B Red temperatures. To obtain the viscosity at a given temperature, Cure Room temperature cure or Cure at look up the multiplication factor at that temperature and elevated temperatures multiply the corresponding viscosity at 25C. Application Thermal management, TIM(Thermal Interface Material) Mix Ratio by weight: 1 :1 TYPICAL UNCURED PROPERTIES Part A:Part B Part A Properties Mix Ratio by volume: 1 :1 Viscosity 20 C 1.43 Part A:Part B Viscosity 25 C 1.0 Solids Content, % 100 Viscosity 35 C 0.58 Operating Temperature -60 to 125C Viscosity 45 C 0.39 Range Viscosity 50 C 0.32 FEATURES AND BENEFITS Part B Properties Thermal Conductivity: 1.1W/m-K Viscosity 20 C 1.57 No siliconeoutgassing or extraction Viscosity 25 C 1.0 Ultra-conforming, designed for fragileand low-stress Viscosity 35 C 0.5 applications Viscosity 45 C 0.3 Ambient and accelerated cure schedules Viscosity 50 C 0.24 100% solids -no cure by-products Mixed Properties Mixed Viscosity, Brookfield RV ,Helipath,25 C, mPas BERGQUIST GAP FILLER TGF 1100SF is a high (cP) : performance, thermally conductive liquid gap fillingmaterial Spindle TF,speed 2 rpm 450,000 whichexhibits low modulus properties then cures to a soft,flexibleeastomer, helpingreduce thermal cycling stresses Density ,ASTM D792,g/cc 2.0 during operation and virtually eliminating stress during Pot Life 25 C (time to double viscosity), minutes : assembly oflow-stress applications . GAP FILLERTGF 1100SF-15 (Fast cure) 15 GAP FILLERTGF 1100SF-240 (Slow cure) 240 The mixed system willcure at ambient . BERGQUIST GAP ShelfLife 25C ,days 180 FILLERTGF 1100SF offers infinitethickness variations with littleor no stress to the sensitive components during or followingassembly .BERGQUIST GAP FILLERTGF 1100SF is not intended for use in thermal interface applications requiring TYPICAL CURE SCHEDULE a mechanical structural bond . BERGQUIST GAP FILLERTGF 1100SF is available with different curing characteristics to better suit your process. BERGQUIST GAP FILLERTGF 1100SF-15 reacts and cures TYPICAL APPLICATIONS faster than BERGQUIST GAP FILLERTGF 1100SF-240. Hard disk assemblies Silicone-sensitive electronics BERGQUIST GAP FILLERTGF 1100SF-240 has a longer Fillingvarious gaps between heat-generating devices to work lifecompared to BERGQUIST GAP FILLERTGF heat sink and housing 1100SF-15. Mechanicalswitching relayTDS BERGQUIST GAP FILLERTGF 1100SF, June -2019 The followinglists both work and cure time for the two Application: versions: Mixed and dispensed using dual tube cartridge packs with static mixers and a manual or pneumatic gun Typical Work Life Mixed and dispensed using industry standard highvolume mixing and dispensing document GAP FILLERTGF 1100SF-15,minutes 15 Application ofheat may be used to reduce viscosity GAP FILLERTGF 1100SF-240 ,minutes 240 STORAGE Typical Cure Time Store product in the unopened container in a dry location. GAP FILLERTGF 1100SF-15: Storage information may be indicated on the product container 25 C ,hours 3 labeling. 100C ,minutes 20 Optimal Storage: 5 to 25C for a 6 month shelf life,in sealed GAP FILLERTGF 1100SF-240 : containers with moisture barrier packaging. 25 C ,hours 24 100C ,minutes 120 Conversions (C x 1.8)+ 32 =F Parallelplate rheometer, estimated time to read 90% cure. kV/mm x 25.4 =V/mil mm /25.4 =inches N x 0.225=lb/F N/mm x 5.71=lb/in TYPICAL PROPERTIES OF CURED MATERIAL psi x 145 =N/mm Physical Properties MPa =N/mm Hardness, Shore 00,Thirty second delay value , 60 Nm x 8.851 = lbin ASTM D2240 Nm x 0.738=lbft Heat Capacity ,ASTM E1269,J/g-K 0.9 Nmm x 0.142 =ozin Flammability, UL 94 V-0 mPas =cP Electrical Properties Dielectric Strength ,ASTM D149,V/mil 400 DielectricConstant ,ASTM D150 1,000 Hz 5.0 10 Volume Resistivity ,ASTM D257,ohm-cm 110 Thermal Properties Thermal Conductivity ,ASTM D5470 ,W/(m-K) 1.1 GENERAL INFORMATION For safe handling information on this product, consult the Safety Data Sheet, (SDS). Not for product specifications The technicaldata contained herein are intended as reference only. Please contact your localquality department for assistance and recommendations on specifications for this product. The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers experience and their application requirements, as well as customer curing equipment, oven loadingand actual oven temperatures. CONFIGURATIONS AVAILABLE BERGQUIST GAP FILLERTGF 1100SF is availablein the followingconfigurations: Cartridges Kits Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.3898.4800 For the most direct access to local sales and technical support visit: www.henkel.com/electronics