TechnicalData Sheet BERGQUIST GAP FILLER TGF 1500 Known as BERGQUIST GAP FILLER1500 October -2018 PRODUCT DESCRIPTION TYPICAL APPLICATIONS A thermally conductive, liquidgap fillermaterial . Automotive electronics (HEV, NEV, batteries) Telecommunications Technology Silicone Computer and peripherals Appearance (cured) Yellow Between any heat- generating semiconductor and a heat Appearance -Part A Yellow sink Appearance -Part B White Cure Room temperature cure or Heat cure TYPICAL PROPERTIES OF UNCURED MATERIAL Application Thermal management, Viscosity ,Highshear ,Capillary,ASTM D5099,mPas (cP) : TIM(Thermal Interface Material) 3,000/ sec ,Part A and B measured separately 25,000 Mix Ratio by weight: 1 :1 Density ,ASTM D792,g/cc 2.7 Part A:Part B Pot Life 25C ,ParallelPlate Rheometer -Working lifeas Mix Ratio by volume: 1 :1 liquid: Part A:Part B 60 minutes Solids Content, % 100 480 minutes Operating Temperature -60 to 200C ShelfLife 25C ,days 180 Range TYPICAL CURE SCHEDULE FEATURES AND BENEFITS Cure Schedule Thermal Conductivity: 1.8W/m-K 5 hours 25C Optimized shear thinning characteristics for ease of 10 minutes 100C dispensing Excellent slump resistance (stays in place) Alternate Cure Schedule Ultra-conforming, with excellent wet-out for low stress 3 days 25C interface applications 30 minutes 100C 100% solids -no cure by-products Parallelplate rheometer, estimated time to read 90% cure. Excellent low and high temperature mechanical and chemicalstability BERGQUIST GAP FILLERTGF 1500 is a two-part, high TYPICAL PROPERTIES OF CURED MATERIAL performance, thermally conductive liquid gap fillingmaterial, Physical Properties which features superior slump resistance and high shear Hardness, Shore 00,Thirty second delay value , 50 thinning characteristics for optimized consistency and control ASTM D2240 during dispensing . The mixed system will cure at room Heat Capacity ,ASTM D1269,J/g-K 1.0 temperature and can be accelerated with the addition ofheat . Flammability, UL 94 V-0 Unlike cured thermal pad materials, a liquid approach offers infinite thickness variations with littleor no stress to the Electrical Properties sensitive components during assembly . BERGQUIST GAP Dielectric Strength ,ASTM D149,V/mil 400 FILLER TGF 1500 exhibits low level natural tack DielectricConstant ,ASTM D150 1,000 Hz 6.4 characteristics and is intended for use in applications where a 10 strong structural bond is not required . Volume Resistivity ,ASTM D257,ohm-meter 110 Thermal Properties As cured, BERGQUIST GAP FILLERTGF 1500 provides a Thermal Conductivity ,ASTM D5470 ,W/(m-K) 1.8 soft, thermally conductive, form-in place elastomer that is ideal for fragileassemblies and fillingunique and intricate air voids and gaps . GENERAL INFORMATION For safe handling information on this product, consult the Safety Data Sheet, (SDS).TDS BERGQUIST GAP FILLERTGF 1500, October -2018 Not for product specifications Disclaimer The technicaldata contained herein are intended as reference Note: The information provided in this Technical Data Sheet (TDS) including the only. Please contact your localquality department for recommendations for use and application of the product are based on our assistance and recommendations on specifications for this knowledge and experience ofthe product as at the date ofthis TDS. The product product. can have a variety of different applications as well as differingapplication and working conditions in your environment that are beyond our control. Henkel is, The above cure profiles are guideline recommendations. Cure therefore, not liablefor the suitability ofour product for the production processes and conditions in respect of which you use them, as well as the intended conditions (time and temperature) may vary based on applications and results. We strongly recommend that you carry out your own customers experience and their application requirements, as prior trials to confirm such suitability ofour product. well as customer curing equipment, oven loadingand actual Any liabilityin respect ofthe information in the TechnicalData Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, oven temperatures. except ifotherwise explicitly agreed and except in relation to death or personal injury caused by our negligenceand any liabilityunder any applicablemandatory CONFIGURATIONS AVAILABLE product liabilitylaw. BERGQUIST GAP FILLERTGF 1500 is available in the In case products are delivered by Henkel Belgium NV, Henkel Electronic followingconfigurations: Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be nevertheless held liable,on whatever legalground, Cartridges Henkels liabilitywillin no event exceed the amount ofthe concerned delivery. Kits In case products are delivered by Henkel Colombiana, S.A.S.the following With or without glass beads disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our STORAGE knowledge and experience ofthe product as at the date ofthis TDS. Henkel is, therefore, not liablefor the suitability ofour product for the production processes Store product in the unopened container in a dry location. and conditions in respect of which you use them, as well as the intended Storage information may be indicated on the product container applications and results. We strongly recommend that you carry out your own labeling. prior trials to confirm such suitability ofour product. Any liabilityin respect ofthe information in the TechnicalData Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, Optimal Storage: 5 to 25C for a 6 month shelf life,in sealed except ifotherwise explicitly agreed and except in relation to death or personal containers with moisture barrier packaging. injury caused by our negligenceand any liabilityunder any applicablemandatory product liabilitylaw. In case products are delivered by Henkel Corporation, Resin Technology Conversions Group, Inc., or Henkel Canada Corporation, the following disclaimer is (C x 1.8)+ 32 =F applicable: kV/mm x 25.4 =V/mil The data contained herein are furnished for information only and are believed to mm /25.4 =inches be reliable.We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user s responsibility to N x 0.225=lb/F determine suitability for the user s purpose ofany production methods mentioned N/mm x 5.71=lb/in herein and to adopt such precautions as may be advisable for the protection of psi x 145 =N/mm property and ofpersons against any hazards that may be involved in the handling MPa =N/mm and use thereof. In lightof the foregoing,Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of Nm x 8.851 = lbin merchantability or fitness for a particular purpose, arising from sale or use Nm x 0.738=lbft of Henkel Corporations products. Henkel Corporation specifically Nmm x 0.142 =ozin disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or mPas =cP compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreignpatents or patent applications. Trademark usage: Except as otherwise noted Alltrademarks in this document are trademarks and/or registered trademarks of Henkel and its affiliatesin the U.S.and elsewhere. Reference 2 Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.2891.8000 For the most direct access to local sales and technical support visit: www.henkel.com/electronics