Technical Data Sheet BERGQUIST GAP FILLER TGF 2000 Known as BERGQUIST GAP FILLER2000 October -2018 PRODUCT DESCRIPTION TYPICAL APPLICATIONS A thermally conductive, liquid gap fillermaterial . Automotive electronics (HEV,NEV, batteries) Telecommunications Technology Silicone Computer and peripherals Appearance (cured) Pink Thermally conductive vibration dampening Appearance -Part A Pink Between any heat- generating semiconductor and a heat Appearance -Part B White sink Cure Room temperature cure or Heat cure Application Thermal management, TYPICAL PROPERTIES OF UNCURED MATERIAL TIM(Thermal InterfaceMaterial) Mixed Viscosity, Brookfield -RV , -Helipath ,ASTM D2196, Mix Ratio by weight: 1 :1 25 C, mPas (cP) : Part A:Part B Spindle TF,speed 20 rpm 300,000 Mix Ratio by volume: 1 :1 Density ,ASTM D792,g/cc 2.9 Part A:Part B Pot Life 25C ,time forviscosity to double : Solids Content, % 100 15 minutes Operating Temperature -60 to 200C 60 minutes Range 600 minutes ShelfLife 25C ,days 180 FEATURES AND BENEFITS Thermal Conductivity: 2.0W/m-K TYPICAL CURE SCHEDULE Ultra- conforming, designed for fragileand low-stress Cure Schedule applications 1 to 2 hours 25C Ambient and accelerated cure schedules 5 minutes 100C 100% solids -no cure by-products Excellent low and high temperature mechanical and Alternative Cure Schedule 1 chemical stability 3 to 4 hours 25C 15 minutes 100C BERGQUIST GAP FILLERTGF 2000 is a high performance, thermally conductive, liquid gap fillingmaterial supplied as a Alternative Cure Schedule 2 two-component, room or elevated temperature curing system . 3 days 25C The material provides a balance of cured material properties 1 hour 100C and good compression set (memory) . The result is a soft, thermally conductive, form-in-place elastomer ideal for Rheometer -time to read 90% cure. coupling hot electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, BERGQUIST GAP FILLERTGF 2000 flows under pressure TYPICAL PROPERTIES OF CURED MATERIAL likea grease. Aftercure, it does not pump from the interfaceas a result of thermal cycling and is dry to the touch . Physical Properties Hardness, Shore 00,Thirty second delay value , 70 Unlike cured Gap Fillingmaterials, the liquid approach offers ASTM D2240 infinitethickness with little or no stress during displacement Heat Capacity ,ASTM D1269,J/g-K 1.0 and assembly . BERGQUIST GAP FILLER TGF 2000 Flammability, UL 94 V-0 eliminates the need for specific pad thickness and die-cut shapes forindividual applications . Electrical Properties Dielectric Strength ,ASTM D149,V/mil 500 BERGQUIST GAP FILLERTGF 2000 is intended foruse in thermal interfaceapplications when a strong structural bond is Dielectric Constant ,ASTM D150 1,000 Hz 7 11 not required.As cured, BERGQUIST GAP FILLERTGF 2000 Volume Resistivity ,ASTM D257,ohm-meter 110 is formulated to have pliable low-modulus, properties .TDS BERGQUIST GAP FILLERTGF 2000, October -2018 Thermal Properties Disclaimer Note: Thermal Conductivity ,ASTM D5470 ,W/(m-K) 2.0 The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. The product can have a variety of differentapplications as well as differingapplication and GENERAL INFORMATION working conditions inyour environment that are beyond our control. Henkel is, For safe handling information on this product, consult the Safety therefore,not liable forthe suitability of our product forthe production processes and conditions in respect of which you use them, as well as the intended Data Sheet, (SDS). applications and results. We strongly recommend that you carry out your own priortrials to confirm such suitability of our product. Not for product specifications Any liability inrespect of the information inthe Technical Data Sheet or any other The technical data contained hereinare intended as reference written or oral recommendation(s) regardingthe concerned product is excluded, only. Please contact your local quality department for except ifotherwise explicitly agreed and except inrelation to death or personal injury caused by our negligence and any liability under any applicable mandatory assistance and recommendations on specifications for this product liability law. product. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and The above cure profiles are guideline recommendations. Cure Henkel France SA please additionally note the following: conditions (time and temperature) may vary based on Incase Henkel would be nevertheless held liable,on whatever legal ground, Henkels liability will inno event exceed the amount of the concerned delivery. customers experience and their application requirements, as In case products are delivered by Henkel Colombiana, S.A.S.the following well as customer curing equipment, oven loading and actual disclaimer is applicable: oven temperatures. The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our CONFIGURATIONS AVAILABLE knowledge and experience of the product as at the date of this TDS. Henkel is, therefore,not liable forthe suitability of our product forthe production processes BERGQUIST GAP FILLER TGF 2000 is available in the and conditions in respect of which you use them, as well as the intended following configurations: applications and results. We strongly recommend that you carry out your own priortrials to confirm such suitability of our product. Cartridges Any liability inrespect of the information inthe Technical Data Sheet or any other written or oral recommendation(s) regardingthe concerned product is excluded, Kits except ifotherwise explicitly agreed and except inrelation to death or personal injury caused by our negligence and any liability under any applicable mandatory STORAGE product liability law. In case products are delivered by Henkel Corporation, Resin Technology Store product in the unopened container in a dry location. Group, Inc., or Henkel Canada Corporation, the following disclaimer is Storage information may be indicated on the product container applicable: labeling. The data contained hereinare furnished forinformation only and are believed to be reliable.We cannot assume responsibility forthe results obtained by others over whose methods we have no control. It is the user s responsibility to Optimal Storage: 5 to 25C fora 6 month shelf life,insealed determine suitability forthe user s purpose of any production methods mentioned containers with moisture barrierpackaging. hereinand to adopt such precautions as may be advisable forthe protection of property and of persons against any hazards that may be involved inthe handling and use thereof. Inlight of the foregoing,Henkel Corporation specifically Conversions disclaims all warranties expressed or implied, including warranties of (C x 1.8)+ 32 =F merchantability or fitness for a particular purpose, arising from sale or use kV/mm x 25.4 =V/mil of Henkel Corporations products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, mm /25.4 =inches including lost profits. The discussion herein of various processes or N x 0.225=lb/F compositions is not to be interpreted as representation that they are freefrom N/mm x 5.71=lb/in domination of patents owned by others or as a license under any Henkel psi x 145 =N/mm Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before MPa =N/mm repetitive use, using this data as a guide. This product may be covered by one or Nm x 8.851 = lbin more United States or foreignpatents or patent applications. Nm x 0.738=lbft Trademark usage: Except as otherwise noted Alltrademarks inthis document Nmm x 0.142 =ozin are trademarks and/or registered trademarks of Henkel and its affiliates in the U.S. and elsewhere. mPas =cP Reference 3 Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.2891.8000 For the most direct access to local sales and technical support visit: www.henkel.com/electronics