Technical Data Sheet BERGQUIST GAP FILLER TGF 3600 Known as BERGQUIST GAP FILLER3500S35 October -2018 PRODUCT DESCRIPTION TYPICAL PROPERTIES OF UNCURED MATERIAL A thermally conductive, liquid gap fillermaterial . Mixed Viscosity, Brookfield -RV , -Helipath ,ASTM D2196, 25 C, mPas (cP) : Technology Silicone Spindle TF ,Speed 20 rpm 150,000 Appearance (cured) Blue Density ,ASTM D792,g/cc 3.0 Appearance -Part A White Pot life 25 C ,time for viscosity to double , 60 Appearance -Part B Blue minutes Cure Room temperature cure or Heat cure ShelfLife 25C ,days 150 Application Thermal management, TIM (Thermal Interface Material) TYPICAL CURE SCHEDULE Mix Ratio by weight: 1 :1 Cure Schedule Part A:Part B 15 hours 25C Mix Ratio by volume: 1 :1 30 minutes 100C Part A:Part B Operating Temperature -60 to 200C Rheometer -time to read 90% cure. Range FEATURES AND BENEFITS TYPICAL PROPERTIES OF CURED MATERIAL Thermal Conductivity: 3.6W/m-K Physical Properties Thixotropic nature makes it easy to dispense Hardness, Shore 00,Thirty second delay value , 35 Two-part formulation for easy storage ASTM D2240 Ultra- conforming, designed for fragile and low-stress Flammability, UL 94 V-0 applications Ambient and accelerated cure schedules Electrical Properties BERGQUIST GAP FILLERTGF 3600 is a two-component Dielectric Strength ,ASTM D149,V/mil 275 liquid gap fillingmaterial, cured at either room or elevated DielectricConstant ,ASTM D150 1,000 Hz 8.0 temperature, featuring ultra- high thermal performance and 09 Volume Resistivity ,ASTM D257,ohm-meter 110 superior softness .Prior to curing, the material maintains good thixotropic characteristics as well as low viscosity . Thermal Properties Thermal Conductivity ,ASTM D5470,W/(m-K) 3.6 The result is a gel-likeliquid material designed to fillair gaps and voids yet flow when acted upon by an external force (e.g. dispensing or assembly process) .The material is an excellent solution for interfacing fragilecomponents with high topography GENERAL INFORMATION and/or stack- up tolerances to a universal heat sink or housing . For safe handling information on this product, consult the Safety Data Sheet, (SDS). Once cured, it remains a low modulus elastomer designed to Not for product specifications assist in relieving CTE stresses during thermal cycling yet The technical data contained herein are intended as reference maintain enough modulus to prevent pump-out from the only. Please contact your local quality department for interface . BERGQUIST GAP FILLERTGF 3600 will lightly assistance and recommendations on specifications for this adhere to surfaces, thus improving surface area contact . product. BERGQUIST GAP FILLERTGF 3600is not designed to be a structural adhesive . The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on TYPICAL APPLICATIONS customers experience and their application requirements, as Automotive electronics (HEV, NEV, batteries) well as customer curing equipment, oven loading and actual PCBA to housing oven temperatures. Discrete components to housing Fiber optic telecommunications equipmentTDS BERGQUIST GAP FILLERTGF 3600, October -2018 merchantability or fitness for a particular purpose, arising from sale or use CONFIGURATIONS AVAILABLE of Henkel Corporations products. Henkel Corporation specifically BERGQUIST GAP FILLERTGF 3600 is available in the disclaims any liability for consequential or incidental damages of any kind, following configurations: including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Cartridges Corporation patents that may cover such processes or compositions. We Kits recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications. STORAGE Trademark usage: Except as otherwise noted Alltrademarks in this document Store product in the unopened container in a dry location. are trademarks and/or registered trademarks of Henkel and its affiliates in the U.S.and elsewhere. Storage information may be indicated on the product container labeling. Reference 2 Optimal Storage: 5 to 25C for a 5 month shelf life,in sealed containers with moisture barrier packaging. Conversions (C x 1.8)+ 32 =F kV/mm x 25.4 =V/mil mm /25.4 =inches N x 0.225=lb/F N/mm x 5.71=lb/in psi x 145 =N/mm MPa =N/mm Nm x 8.851 = lbin Nm x 0.738=lbft Nmm x 0.142 =ozin mPas =cP Disclaimer Note: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience ofthe product as at the date ofthis TDS. The product can have a variety of different applications as well as differing application and working conditions in your environment that are beyond our control. Henkel is, therefore, not liablefor the suitability ofour product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability ofour product. Any liability in respect ofthe information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except ifotherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be nevertheless held liable,on whatever legal ground, Henkels liability will in no event exceed the amount ofthe concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S.the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience ofthe product as at the date ofthis TDS. Henkel is, therefore, not liablefor the suitability ofour product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability ofour product. Any liability in respect ofthe information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except ifotherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: The data contained herein are furnished for information only and are believed to be reliable.We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user s responsibility to determine suitability for the user s purpose ofany production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and ofpersons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.2891.8000 For the most direct access to local sales and technical support visit: www.henkel.com/electronics