Gap Pad 1500S30
Highly Conformable,Thermally Conductive, Reinforced S-Class Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF GAP PAD 1500S30
Thermal conductivity: 1.3 W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Light Pink Light Pink Visual
Highly conformable / low hardness
Reinforcement Carrier Fiberglass Fiberglass ASTM D374
Decreased strain on fragile components
Thickness (inch) / (mm) 0.020 to 0.125 0.508 to 3.175 ASTM D374
Inherent Surface Tack (1or 2 sided) 2 2
Fiberglass reinforced for puncture, shear
Density (g/cc) 1.8 1.8 ASTM D792
and tear resistance
Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269
Quick rebound to original shape
1
Hardness (Bulk Rubber) (Shore 00) 30 30 ASTM D2240
2
Young's Modulus (psi) / (kPa) 16 110 ASTM D575
Gap Pad 1500S30 is a highly compliant
Continuous Use Temp (F) / (C) -76 to 392 -60 to 200
Gap Pad material that is ideal for fragile
ELECTRICAL
component leads.The material is fiberglass
Dielectric Breakdown Voltage (Vac) >6000 >6000 ASTM D149
reinforced for improved puncture resistance
Dielectric Constant (1000 Hz) 5.0 5.0 ASTM D150
and handling characteristics. Gap Pad
11 11
Volume Resistivity (Ohm-meter) 10 10 ASTM D257
1500S30 maintains a conformable, yet elastic
Flame Rating V-O V-O U.L. 94
nature that provides excellent interfacing and
THERMAL
wet-out characteristics, even to surfaces with
Thermal Conductivity (W/m-K) 1.3 1.3 ASTM D5470
high roughness or uneven topography.
THERMAL PERFORMANCE vs. PRESSURE
Gap Pad 1500S30 features an inherent tack
Pressure (psi) 10 25 50
on both sides of the material, eliminating the
TO-220 Thermal Performance (C/W) (20 mil) 2.50 2.26 1.94
need for thermally impeding adhesive layers.
2
Thermal Impedance (C-in /W) (3) 0.93 0.71 0.57
Note: Resultant thickness is defined as the final gap
TO-220 Thermal Performance (C/W) (40 mil) 3.07 2.57 2.16
thickness of the application.
2
Thermal Impedance (C-in /W) (3) 1.23 1.00 0.78
Typical Applications:
1) Thirty second delay value Shore 00 hardness scale. 2)Youngs Modulus, calculated using 0.01 in/min. step rate of strain with a sample
2
size of 0.79 inch . For more information on Gap Pad modulus, refer to Bergquist Application Note #116. 3) The ASTM D5470 test fix-
Any heat-generating component and
ture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual applica-
tion performance is directly related to the surface roughness, flatness and pressure applied.
a heat sink
Computers and peripherals
Configurations Available:
Telecommunications
Sheet form and die-cut parts
Between any heat-generating
Building a Part Number Standard Options
semiconductor and a heat sink
GP1500S30 0.020 02 0816
Shielding devices
Thickness vs. Thermal Resistance
Gap Pad 1500S30
0816 = Standard sheet size 8" x 16", or
140
120
02 = Natural tack, both sides
100
80
0.020", 0.040", 0.060"
60
0.080", 0.100", 0.125"
40
GP1500S30 = Gap Pad 1500S30 Material
20
0
0.62 1.25 1.87 2.5 3.12 3.9
2
Thermal Resistance (C-in /W)
Gap Pad : U.S. Patent 5,679,457 and others
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
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WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers and manufacturers only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
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for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
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Resultant Thickness (mils)