Technical DataSheet BERGQUIST GAP PAD TGP 2000 Known as BERGQUIST GAP PAD 2000S40 October -2018 PRODUCT DESCRIPTION TYPICAL PROPERTIES OF CURED MATERIAL Highly Conformable, Thermally Conductive, Reinforced Young s modulus is calculated using 0.01in/min,step rate of S-Class Gap FillingMaterial. strainwith a sample size 0.79inch. Physical Properties Technology Silicone Hardness, Shore 00 30 Appearance Gray ,Thirty second delay value Reinforcement Carrier Fiberglass ,ASTM D2240 ,Bulkrubber Thickness 0.508 to 3.175mm ,ASTM D374 Heat Capacity ,ASTM E1269,J/g-K 0.6 InherentSurface Tack 2 (1 sided ) Density ,Bulkrubber ,ASTM D792,g/cc 2.9 Application Thermal management, Flammability, UL94 V-0 TIM(Thermal Interface Material) Young s Modulus ,ASTM D575 kPa 310 Operating Temperature -60 to 200C (psi) ( 45 ) Range Electrical Properties FEATURES AND BENEFITS Dielectric Breakdown Voltage ,ASTM D149,VAC >5,000 Thermal Conductivity: 2.0W/m-K Dielectric Constant ,ASTM D150 ,1,000Hz 6.0 11 Low S-Class thermal resistance at very low pressures Volume Resistivity ,ASTM D257 ,ohm-meter 110 Highly Conformable, low hardness Thermal Properties Designed for low-stress applications Thermal Conductivity ,ASTM D5470 ,W/(m-K) 2.0 Fiberglass reinforced for puncture, shear and tear Thermal Impedance ,0.040 inch resistance 2 ASTM D5470 ,C-in /W : 10% Deflection 0.97 BERGQUIST GAP PAD TGP 2000 is recommended for 20% Deflection 0.89 low-stress applications that require a mid to highthermally 30% Deflection 0.8 conductive interface material .The highlyconformable nature of the material allows the pad to fillinair voids and air gaps The recorded value includes interfacialthermal resistance. between PC boards and heat sinks or metal chassis with These values are provided for reference only. Actual stepped topography, rough surfaces and high stack-up application performance is directly related to the surface tolerances . roughness, flatness and pressure applied. BERGQUIST GAP PAD TGP 2000 is offered with inherent natural tack on both sides of the material allowing for stick- in-place characteristics during application assembly . The GENERAL INFORMATION material is supplied with protective liners on both sides .The top For safe handling information on this product, consult the side has reduced tack for ease of handling. Safety Data Sheet, (SDS). Not for product specifications TYPICAL APPLICATIONS The technical data contained herein are intended as reference Power electronics DC/DC 1/4,1/2,fullbricks, etc. only. Please contact your local quality department for Mass storage devices assistance and recommendations on specifications for this product. Graphics card /processor /ASIC Wireline /wireless communications hardware Automotive engine /transmission controlsTDS BERGQUIST GAP PAD TGP 2000, October -2018 injury caused by our negligence and any liabilityunder any applicable mandatory CONFIGURATIONS AVAILABLE product liabilitylaw. BERGQUIST GAP PAD TGP 2000 is available inthe following In case products are delivered by Henkel Corporation, Resin Technology configurations: Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: Sheet form The data contained herein are furnishedfor informationonly and are believed to be reliable. We cannot assume responsibility for the results obtained by others Die-Cutparts over whose methods we have no control. Itis the user s responsibility to determine suitabilityfor the user s purpose of any production methods mentioned Naturaltack both sides with fiberglass. herein and to adopt such precautions as may be advisable for the protection of property and of persons againstany hazards thatmay be involved inthe handling and use thereof. Inlightof the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of STORAGE merchantability or fitness for a particular purpose, arising from sale or use Store product in the unopened container in a dry location. of Henkel Corporations products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, Storage informationmay be indicated on the product container including lost profits. The discussion herein of various processes or labeling. compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Optimal Storage: 25 C (3), 50 % RH (10) for a 12 months Corporation patents that may cover such processes or compositions. We shelf life. Material removed from containers may be recommend that each prospective user test his proposed application before repetitive use, usingthisdata as a guide.Thisproduct may be covered by one or contaminated during use. Do not return product to the original more United States or foreign patents or patent applications. container. Henkel Corporation cannot assume responsibility for Trademark usage: Except as otherwise noted Alltrademarks inthisdocument product which has been contaminated or stored under are trademarks and/or registered trademarks of Henkel and its affiliatesinthe conditions other thanthose previously indicated.Ifadditional U.S.and elsewhere. information is required, please contact your local Technical Service Center or Customer Service Representative. Reference 1 Conversions (C x 1.8)+ 32 = F kV/mm x 25.4 = V/mil mm /25.4 = inches Nx 0.225 = lb N/mm x 5.71 = lb/in psi x 145 = N/mm MPa = N/mm Nm x 8.851 = lbin Nm x 0.738= lbft Nmm x 0.142 = ozin mPas = cP Disclaimer Note: The information provided in this Technical Data Sheet (TDS) includingthe recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of thisTDS.The product can have a variety of different applications as well as differingapplication and working conditions inyour environment thatare beyond our control. Henkel is, therefore, not liablefor the suitabilityof our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trialsto confirm such suitabilityof our product. Any liabilityinrespect of the informationinthe Technical DataSheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except ifotherwise explicitly agreed and except inrelation to death or personal injury caused by our negligence and any liabilityunder any applicable mandatory product liabilitylaw. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: Incase Henkel would be nevertheless held liable,on whatever legal ground, Henkels liabilitywill inno event exceed the amount of the concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S.the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) includingthe recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of thisTDS. Henkel is, therefore, not liablefor the suitabilityof our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trialsto confirm such suitabilityof our product. Any liabilityinrespect of the informationinthe Technical DataSheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except ifotherwise explicitly agreed and except inrelation to death or personal Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.3898.4800 For the most direct access to local sales and technical support visit: www.henkel.com/electronics