X-On Electronics has gained recognition as a prominent supplier of GPA2000-0.040-02-93 Thermal Interface Products across the USA, India, Europe, Australia, and various other global locations. GPA2000-0.040-02-93 Thermal Interface Products are a product manufactured by Henkel. We provide cost-effective solutions for Thermal Interface Products, ensuring timely deliveries around the world.

GPA2000-0.040-02-93 Henkel

GPA2000-0.040-02-93 electronic component of Henkel
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Part No.GPA2000-0.040-02-93
Manufacturer: Henkel
Category: Thermal Interface Products
Description: Thermal Interface Products High Performance, Thermally Conductive Gap Filling Material, Gap Pad A2000, 0.040" Thickness
Datasheet: GPA2000-0.040-02-93 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 6.9907 ea
Line Total: USD 6.99

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 02 Aug to Tue. 06 Aug
MOQ : 1
Multiples : 1
1 : USD 4.6352
10 : USD 3.8325
50 : USD 3.465
100 : USD 3.1106
500 : USD 2.6334
1000 : USD 2.0916
2000 : USD 1.9278
5000 : USD 1.9152

   
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We are delighted to provide the GPA2000-0.040-02-93 from our Thermal Interface Products category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the GPA2000-0.040-02-93 and other electronic components in the Thermal Interface Products category and beyond.

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TechnicalData Sheet BERGQUIST GAP PAD TGP A2000 Known as BERGQUIST GAP PAD A2000 October -2018 PRODUCT DESCRIPTION TYPICAL PROPERTIES OF CURED MATERIAL HighPerformance,ThermallyConductive Gap FillingMaterial. Young s modulus iscalculated using 0.01in/min,step rateof strainwith a samplesize 0.79inch. Technology Silicone Physical Properties Appearance Gray Hardness, Shore00 80 Reinforcement CarrierFiberglass ,Thirty second delay value Thickness 0.254 to 1.016mm ,ASTM D374 ,ASTM D2240 ,Bulk rubber InherentSurfaceTack 2 (1 sided ) Heat Capacity ,ASTM E1269,J/g-K 1.0 Application Thermalmanagement, Density ,Bulk rubber,ASTM D792,g/cc 2.9 TIM(ThermalInterfaceMaterial) Flammability, UL94 V-0 Operating Temperature-60 to 200C Young s Modulus ,ASTM D575 kPa 379 Range (psi) (55) Electrical Properties FEATURES AND BENEFITS DielectricBreakdown Voltage ,ASTM D149,VAC >4,000 ThermalConductivity: 2.0W/m-K DielectricConstant ,ASTM D150,1,000Hz 6.0 Fiberglassreinforcedfor puncture, shear and tear 11 Volume Resistivity ,ASTM D257,ohm-meter 110 resistance Electricallyisolating Thermal Properties ThermalConductivity ,ASTM D5470 ,W/(m-K) 2.0 BERGQUIST GAP PAD TGP A2000 acts as a thermal ThermalImpedance ,0.040 inch 2 interface and electricalinsulator between electronic ASTM D5470 ,C-in /W: components and heat sinks.Inthe thickness rangeof 10 to 40 10% Deflection 1.04 mil, BERGQUIST GAP PAD TGP A2000 is supplied with 20% Deflection 1.0 natural tack on both sides,allowing forexcellent compliance to 30% Deflection 0.95 the adjacent surfacesof components . The recordedvalue includes interfacialthermalresistance. The 40 milmaterialthickness issupplied with lower tack on These values are provided for referenceonly. Actual one side,allowing forburn-in processesand easy rework. application performanceis directly related to the surface roughness,flatnessand pressureapplied. TYPICAL APPLICATIONS Computer and peripherals GENERAL INFORMATION Between CPU and heat spreader For safe handling information on this product, consult the Telecommunications Safety Data Sheet, (SDS). Heat pipeassemblies RDRAM memory modules Not for product specifications CDROM /DVD cooling The technical data contained hereinareintended as reference Areaswhere heat needs to be transferredto a frame only. Please contact your local quality department for chassisorothertype of heat spreader assistance and recommendations on specificationsforthis product. DDR SDRAM memory modulesTDS BERGQUIST GAP PAD TGP A2000, October -2018 except ifotherwise explicitly agreedand except in relationto death orpersonal CONFIGURATIONS AVAILABLE injury caused by our negligenceand any liabilityunder any applicablemandatory BERGQUIST GAP PAD TGP A2000 is available in the product liabilitylaw. following configurations: In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is Sheet form applicable: The data contained hereinarefurnished forinformation only and arebelieved to Die-Cut parts be reliable.We cannot assume responsibilityforthe resultsobtained by others Rollform over whose methods we have no control. It is the user s responsibilityto determine suitability forthe user spurpose of any production methods mentioned hereinand to adopt such precautions as may be advisable forthe protection of Natural tack both sideswith fiberglass. propertyand of personsagainst any hazards that may be involved in the handling and use thereof.In lightof the foregoing,Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of STORAGE merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporations products. Henkel Corporation specifically Store product in the unopened container in a dry location. disclaims any liability for consequential or incidental damages of any kind, Storageinformationmay be indicated on the product container including lost profits. The discussion herein of various processesor labeling. compositions isnot to be interpretedas representationthat they arefreefrom domination of patents owned by others oras a licenseunder any Henkel Optimal Storage:25C (3), 50% RH (10) fora 12 months Corporationpatents that may cover such processesor compositions. We recommend that each prospective user test his proposed application before shelf life.Materialremoved from containers may be repetitiveuse, using this data as a guide. Thisproduct may be covered by one or contaminated during use. Do not returnproduct to the original moreUnited States orforeignpatents orpatent applications. container.Henkel Corporationcannot assume responsibilityfor Trademark usage: Except as otherwise noted Alltrademarksin this document product which has been contaminated or stored under aretrademarksand/or registeredtrademarksof Henkel and its affiliatesin the U.S.and elsewhere. conditions other than those previously indicated. Ifadditional information is required,pleasecontact your localTechnical ServiceCenterorCustomer ServiceRepresentative. Reference1 Conversions (C x 1.8)+ 32 =F kV/mm x 25.4 =V/mil mm /25.4 =inches N x 0.225=lb N/mm x 5.71=lb/in psi x 145 =N/mm MPa =N/mm Nm x 8.851 = lbin Nm x 0.738=lbft Nmm x 0.142 =ozin mPas =cP Disclaimer Note: The information provided in this Technical Data Sheet (TDS) including the recommendations foruse and application of the product arebased on our knowledge and experienceof the product as at the date of this TDS. The product can have a variety of differentapplicationsas well as differingapplication and working conditions in your environment that arebeyond our control.Henkel is, therefore,not liableforthe suitability of our product forthe production processes and conditions in respectof which you use them, as well as the intended applicationsand results.We strongly recommend that you carryout your own priortrialsto confirmsuch suitability of our product. Any liabilityin respectof the informationin the TechnicalData Sheet orany other written ororalrecommendation(s) regardingthe concerned product isexcluded, except ifotherwise explicitly agreedand except in relationto death orpersonal injury caused by our negligenceand any liabilityunder any applicablemandatory product liabilitylaw. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be nevertheless held liable,on whatever legalground, Henkels liabilitywillin no event exceed the amount of the concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S.the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations foruse and application of the product arebased on our knowledge and experienceof the product as at the date of this TDS. Henkel is, therefore,not liableforthe suitability of our product forthe production processes and conditions in respectof which you use them, as well as the intended applicationsand results.We strongly recommend that you carryout your own priortrialsto confirmsuch suitability of our product. Any liabilityin respectof the informationin the TechnicalData Sheet orany other written ororalrecommendation(s) regardingthe concerned product isexcluded, Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.3898.4800 For the most direct access to local sales and technical support visit: www.henkel.com/electronics

Tariff Desc

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
Bergquist Company
Henkel
Loctite
LOCTITE AMERICAS
Multicore
MULTICORE (SOLDER)
MULTICORE / LOCTITE

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