TechnicalDataSheet BERGQUIST GAP PAD TGP HC1000 Known as BERGQUIST GAP PAD HC1000 October -2018 PRODUCT DESCRIPTION TYPICAL PROPERTIES OF CURED MATERIAL Gel-LikeModulus Gap FillingMaterial. Young s modulus is calculatedusing 0.01in/min,steprateof strainwitha sample size 0.79inch. Technology Silicone Physical Properties Appearance Gray Hardness, Shore 00 25 ReinforcementCarrier Fiberglass ,Thirtysecond delay value Thickness 0.254 to0.508mm ,ASTM D374 ,ASTM D2240 ,Bulkrubber InherentSurface Tack 2 (1 sided ) HeatCapacity,ASTM E1269,J/g-K 1.0 Application Thermal management, Density,Bulkrubber ,ASTM D792,g/cc 1.6 TIM(Thermal InterfaceMaterial) Flammability, UL94 V-0 Operating Temperature-60 to200C Young s Modulus,ASTM D575 kPa 275 Range (psi) (40 ) Electrical Properties FEATURES AND BENEFITS DielectricBreakdown Voltage ,ASTM D149,VAC >5,000 Thermal Conductivity:1.0W/m-K DielectricConstant,ASTM D150,1,000Hz 5.5 HighlyConformable, low hardness 11 Volume Resistivity,ASTM D257,ohm-meter 110 Gel-likemodulus Fiberglass reinforced for puncture,shear and tear Thermal Properties resistance Thermal Conductivity,ASTM D5470 ,W/(m-K) 1.0 Thermal Impedance ,0.020 inch 2 BERGQUIST GAP PAD TGP HC1000 is an extremely ASTM D5470 ,C-in /W: conformable, low-modulus polymer thatactsas a thermal 10% Deflection 1.3 interface and electricalinsulator between electronic 20% Deflection 1.0 components and heatsinks .The gel-likemodulus allows this 30% Deflection 0.96 materialtofillairgaps toenhance thethermalperformance of electronicsystems . The recorded value includes interfacialthermalresistance. These values are provided for reference only. Actual BERGQUIST GAP PAD TGP HC1000 is offered with applicationperformance is directlyrelatedtothesurface removable protectivelinerson bothsides of thematerial. roughness, flatnessand pressure applied. TYPICAL APPLICATIONS GENERAL INFORMATION Computerand peripherals For safe handling information on this product, consult the Telecommunications Safety Data Sheet, (SDS). Heatinterfacestoframes,chassis or otherheatspreading devices Not for product specifications RDRAM memory modules /chipscalepackages The technicaldatacontained herein are intended as reference CDROM /DVD cooling only. Please contactyour local quality departmentfor Areas where irregularsurfaces need tomake a thermal assistance and recommendations on specificationsfor this interfacetoa heatsink product. DDR SDRAM memory modules FBDIMMmodulesTDS BERGQUIST GAP PAD TGP HC1000, October -2018 exceptifotherwise explicitlyagreed and exceptin relationtodeathor personal CONFIGURATIONS AVAILABLE injury caused by our negligenceand any liabilityunder any applicablemandatory BERGQUIST GAP PAD TGP HC1000 is available in the productliabilitylaw. following configurations: In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is Sheetform applicable: The datacontained herein are furnished for informationonly and are believed to Die-Cutparts be reliable.We cannot assume responsibilityfor theresultsobtained by others Rollform over whose methods we have no control.Itis theuser s responsibility to determinesuitabilityfor theuser s purpose of any productionmethods mentioned herein and toadoptsuch precautionsas may be advisable for theprotectionof Naturaltackbothsides withfiberglass. property and of persons againstany hazards thatmay be involved in thehandling and use thereof.In lightof theforegoing,Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of STORAGE merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporations products. Henkel Corporation specifically Store product in theunopened container in a dry location. disclaims any liability for consequential or incidental damages of any kind, Storageinformationmay be indicatedon theproductcontainer including lost profits. The discussion herein of various processes or labeling. compositions is nottobe interpretedas representationthatthey are free from domination of patentsowned by others or as a license under any Henkel OptimalStorage:25C (3), 50% RH (10) for a 12 months Corporation patentsthatmay cover such processes or compositions. We recommend thateach prospective user testhis proposed applicationbefore shelf life.Materialremoved from containers may be repetitiveuse,using thisdataas a guide.This productmay be covered by one or contaminatedduring use. Do notreturnproducttotheoriginal more UnitedStatesor foreignpatentsor patentapplications. container.Henkel Corporationcannot assume responsibilityfor Trademark usage: Exceptas otherwise noted Alltrademarks in thisdocument product which has been contaminated or stored under are trademarks and/or registeredtrademarks of Henkel and itsaffiliatesin the U.S.and elsewhere. conditions otherthanthosepreviously indicated.Ifadditional informationis required, please contactyour localTechnical Service Centeror CustomerService Representative. Reference 1 Conversions (C x 1.8)+ 32 =F kV/mm x 25.4 =V/mil mm /25.4 =inches N x 0.225=lb N/mm x 5.71=lb/in psi x 145 =N/mm MPa =N/mm Nm x 8.851 = lbin Nm x 0.738=lbft Nmm x 0.142 =ozin mPas =cP Disclaimer Note: The informationprovided in thisTechnical DataSheet(TDS) including the recommendations for use and applicationof theproduct are based on our knowledge and experience of theproductas atthedateof thisTDS. The product can have a variety of differentapplicationsas well as differingapplicationand working conditions in your environment thatare beyond our control.Henkel is, therefore,notliablefor thesuitabilityof our productfor theproductionprocesses and conditions in respectof which you use them,as well as theintended applicationsand results.We strongly recommend thatyou carry outyour own prior trialstoconfirm such suitabilityof our product. Any liabilityin respectof theinformationin theTechnicalDataSheetor any other writtenor oral recommendation(s) regarding theconcerned productis excluded, exceptifotherwise explicitlyagreed and exceptin relationtodeathor personal injury caused by our negligenceand any liabilityunder any applicablemandatory productliabilitylaw. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be nevertheless held liable,on whatever legalground, Henkels liabilitywillin no event exceed theamountof theconcerned delivery. In case products are delivered by Henkel Colombiana, S.A.S.the following disclaimer is applicable: The informationprovided in thisTechnical DataSheet(TDS) including the recommendations for use and applicationof theproduct are based on our knowledge and experience of theproductas atthedateof thisTDS. Henkel is, therefore,notliablefor thesuitabilityof our productfor theproductionprocesses and conditions in respectof which you use them,as well as theintended applicationsand results.We strongly recommend thatyou carry outyour own prior trialstoconfirm such suitabilityof our product. Any liabilityin respectof theinformationin theTechnicalDataSheetor any other writtenor oral recommendation(s) regarding theconcerned productis excluded, Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.3898.4800 For the most direct access to local sales and technical support visit: www.henkel.com/electronics