Technical Data Sheet BERGQUIST GAP PAD TGP 800VOS Known as BERGQUIST GAP PAD VO Soft November -2018 PRODUCT DESCRIPTION Electrical Properties Highly Conformable, Thermally Conductive Material for Filling Dielectric Breakdown Voltage ,ASTM D149,VAC >6,000 Air Gaps . Dielectric Constant ,ASTM D150 ,1,000Hz 5.5 11 Volume Resistivity ,ASTM D257 ,ohm-meter 110 Technology Silicone Appearance Mauve/Pink Thermal Properties Reinforcement Carrier Sil-Pad Thermal Conductivity ,ASTM D5470 ,W/(m-K) 0.8 (2) Thickness 0.508 to 5.08 Thermal Impedance ,0.040 2 ASTM D374 ASTM D5470 ,C-in /W : Inherent Surface Tack 1(1 side) 10% Deflection 2.48 Application Thermal management, 20% Deflection 2.29 TIM(Thermal Interface Material) 30% Deflection 2.11 Operating Temperature -60 to 200C Range (1) Youngs Modulus, calculated using 0.01in/min.step rate of strain with a sample size of 0.79inch FEATURES AND BENEFITS (2) The ASTM D5470 test fixture was utilized. The recorded values include the interfacial Thermal Conductivity: 0.8W/m-K thermal resistance. The values are provided for reference only. Actual application performance isdirectly related to the surface roughness, flatnessand pressure applied Conformable, low hardness Enhanced puncture, shear and tear resistance Electrically isolating GENERAL INFORMATION For safe handling information on this product, consult the BERGQUIST GAP PAD TGP 800VOS is recommended for Safety Data Sheet, (SDS). applications that require a minimum amount of pressure on components .BERGQUIST GAP PAD TGP 800VOS isa highly conformable, low-modulus, filled-siliconepolymer on a rubber- Not for product specifications coated fiberglasscarrier . The material can be used as an The technical data contained herein are intended as reference interface where one side isincontact with a leaded device . only. Please contact your local quality department for assistance and recommendations on specifications for this TYPICAL APPLICATIONS product. Telecommunications Computer and peripherals CONFIGURATIONS AVAILABLE Power conversion BERGQUIST GAP PAD TGP 800VOS isavailable inthe Between heat-generating semiconductors or magnetic following configurations: components and a heat sink Sheet form and die-cut parts Areas where heat needs to be transferred to a frame chassisor other type of heat spreader TYPICAL PROPERTIES OF CURED MATERIAL STORAGE Physical Properties Store product in the unopened container in a dry location. Storage information may be indicated on the product container Hardness, Shore 00,Thirty second delay value , 25 labeling. ASTM D2240,Bulk rubber Heat Capacity ,ASTM E1269,J/g-K 1.0 Optimal Storage: 25 C (3), 50 % RH (10) for a 12 months Density ,Bulk rubber ,ASTM D792,g/cc 1.6 shelf life. Material removed from containers may be Flammability, UL 94 V-0 contaminated during use. Do not return product to the original (1) Young s Modulus ,ASTM D575 kPa 275 container. Henkel Corporation cannot assume responsibility for (psi) (40) product which has been contaminated or stored under conditions other than those previously indicated. Ifadditional information is required, please contact your local Technical Service Center or Customer Service Representative.TDS BERGQUIST GAP PAD TGP 800VOS , November -2018 Conversions (C x 1.8)+ 32 = F kV/mm x 25.4 = V/mil mm /25.4 = inches Nx 0.225 = lb N/mm x 5.71 = lb/in psi x 145 = N/mm MPa = N/mm Nm x 8.851 = lbin Nm x 0.738= lbft Nmm x 0.142= ozin mPas = cP Disclaimer Note: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of thisTDS.The product can have a variety of different applications as well as differingapplication and working conditions inyour environment that are beyond our control. Henkel is, therefore, not liablefor the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trialsto confirm such suitability of our product. Any liabilityinrespect of the information inthe Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product isexcluded, except ifotherwise explicitly agreed and except inrelation to death or personal injury caused by our negligence and any liabilityunder any applicable mandatory product liabilitylaw. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: Incase Henkel would be nevertheless held liable,on whatever legal ground, Henkels liabilitywill inno event exceed the amount of the concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S.the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of thisTDS. Henkel is, therefore, not liablefor the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trialsto confirm such suitability of our product. Any liabilityinrespect of the information inthe Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product isexcluded, except ifotherwise explicitly agreed and except inrelation to death or personal injury caused by our negligence and any liabilityunder any applicable mandatory product liabilitylaw. In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user s responsibility to determine suitability for the user s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons againstany hazards that may be involved inthe handling and use thereof. Inlight of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporations products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions isnot to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test hisproposed application before repetitive use, using thisdata as a guide. Thisproduct may be covered by one or more United States or foreign patents or patent applications. Trademark usage: Except as otherwise noted Alltrademarks inthisdocument are trademarks and/or registered trademarks of Henkel and its affiliatesinthe U.S.and elsewhere. Reference 1 Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.3898.4800 For the most direct access to local sales and technical support visit: www.henkel.com/electronics