Technical Data Sheet BERGQUIST HI FLOW THF 1000F-AC Known as BERGQUIST HI-FLOW 225F-AC April -2020 PRODUCT DESCRIPTION TYPICAL PROPERTIES Reinforced Phase Change Thermal Interface Material . Physical Properties Carrier Thickness ,ASTM D374 ,mm 0.038 Technology Phase Change Phase Change Temperature ,ASTM D3418 ,C 55 Appearance Black Flammability Rating, UL 94 V-0 Reinforcement Carrier Aluminum Total Thickness 0.102mm Thermal Properties (1) ,ASTM D374 Thermal Conductivity ,ASTM D5470,W/(m-K) 1.0 Application Thermal management, Thermal Performance vs. Pressure Thermally conductive adhesive TO-220 Thermal Performance ,C/W : Operating Temperature 120 C 10 psi 0.87 25psi 0.68 FEATURES AND BENEFITS 50psi 0.57 2 Thermal impedance: 0.10C-in /W 25 psi 100 psi 0.5 Can be manually or automatically applied to the surfaces 200 psi 0.45 of room temperature heat sinks 2 (2) Thermal Impedance ,ASTM D5470,C-in /W : Foil reinforced, adhesive- coated 10 psi 0.12 Soft, thermally conductive 55C phase change compound 25psi 0.1 TYPICAL APPLICATIONS 50psi 0.09 Computer and peripherals 100 psi 0.08 Power conversion 200 psi 0.07 High performance computer processors Power semiconductors 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one Power modules conducting layer in a three- layer laminate. The Hi-Flow coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall BERGQUIST HIFLOW THF 1000F-ACis a high performance, conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic is not accounted for in ASTM D5470. thermal interface material for use between a computer Please contact Bergquist Product Management ifadditional specifications are required. processor and a heat sink . 2)The ASTM D5470test fixture was used and the test sample was conditioned at 70C prior to test. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, BERGQUIST HI FLOW THF 1000F-AC consists of a soft, flatness and pressure applied. thermally conductive 55Cphase change compound coated to the top surface of an aluminum carrier with a soft, thermally conductive adhesive compound coated to the bottom surface GENERAL INFORMATION to improve adhesion to the heat sink. For safe handling information on this product, consult the Safety Data Sheet, (SDS). Above the 55C phase change temperature, BERGQUIST HI FLOW THF 1000F-ACwets-out the thermal interface surfaces Not for product specifications and flows to produce low thermal impedance. BERGQUIST HI The technical data contained herein are intended as reference FLOW THF 1000F-ACrequires pressure from the assembly to only. Please contact your local quality department for cause material flow .The HI-FLOW coatings resist dripping in assistance and recommendations on specifications for this vertical orientation . product. The material includes a base carrier liner with differential CONFIGURATIONS AVAILABLE release properties to facilitatesimplicity in roll form packaging BERGQUIST HIFLOW THF 1000F-ACis supplied in: and application assembly . Please contact Bergquist Product Management for applications that are less than 0.07 square . Roll form, kiss-cut parts, and sheet formTDS BERGQUIST HIFLOW THF 1000F-AC, April -2020 Conversions (C x 1.8)+ 32 =F kV/mm x 25.4=V/mil mm /25.4=inches N x 0.225=lb/F N/mm x 5.71=lb/in psi x 145=N/mm MPa =N/mm Nm x 8.851 = lbin Nm x 0.738=lbft Nmm x 0.142=ozin mPas =cP Disclaimer Note: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. The product can have a variety of different applications as well as differing application and working conditions in your environment that are beyond our control. Henkel is, therefore, not liablefor the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liabilityin respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liabilityunder any applicable mandatory product liabilitylaw. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV,Henkel Nederland BV,Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be nevertheless heldliable,on whatever legalground, Henkels liabilitywillin no event exceed the amount of the concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S.the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. Henkel is, therefore, not liablefor the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liabilityin respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except ifotherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liabilityunder any applicable mandatory product liabilitylaw. In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: The data contained herein are furnished for information only and are believed to be reliable.We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user s responsibility to determine suitability for the user s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporations products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications. Trademark usage Except as otherwise noted, alltrademarks in this document are trademarks of Henkel Corporation in the U.S. and elsewhere. denotes a trademark registered in the U.S. Patent and Trademark Office. 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