X-On Electronics has gained recognition as a prominent supplier of HF300G-0.005-AC-10/250 Thermal Interface Products across the USA, India, Europe, Australia, and various other global locations. HF300G-0.005-AC-10/250 Thermal Interface Products are a product manufactured by Henkel. We provide cost-effective solutions for Thermal Interface Products, ensuring timely deliveries around the world.

HF300G-0.005-AC-10/250 Henkel

HF300G-0.005-AC-10/250 electronic component of Henkel
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Part No.HF300G-0.005-AC-10/250
Manufacturer: Henkel
Category: Thermal Interface Products
Description: Thermal Interface Products Fiberglass-Reinforced, Phase Change Thermal Interface Material, 0.005" Thickness, Adhesive - One Side, 10 Inch x 250 Foot Roll, Hi-Flow THF 1600G Series / Also Known as Bergquist Hi-Flow 300G Series, IDH 2190493
Datasheet: HF300G-0.005-AC-10/250 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1842.0517 ea
Line Total: USD 1842.05 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 29 Nov to Tue. 03 Dec
MOQ : 1
Multiples : 1
1 : USD 1842.0517
10 : USD 1752.8742
50 : USD 1684.1864
100 : USD 1598.7164
500 : USD 1543.646
1000 : USD 1541.3244
2000 : USD 1541.3244
5000 : USD 1541.3244
10000 : USD 1541.3244

   
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We are delighted to provide the HF300G-0.005-AC-10/250 from our Thermal Interface Products category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HF300G-0.005-AC-10/250 and other electronic components in the Thermal Interface Products category and beyond.

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TechnicalData Sheet BERGQUIST HI FLOW THF 1600G Known as BERGQUIST HI-FLOW300G April -2020 PRODUCT DESCRIPTION Thermal Performance vs. Pressure Fiberglass-Reinforced, Phase Change Thermal Interface TO-220 Thermal Performance ,C/W : Material. 10 psi 0.96 25 psi 0.92 Technology Phase Change 50 psi 0.88 Appearance Green 100 psi 0.85 Reinforcement Carrier Fiberglass 200 psi 0.84 Total Thickness 0.127mm 2 (2) Thermal Impedance ,ASTM D5470,C-in/W : ,ASTM D374 10 psi 0.27 Application Thermal management, 25 psi 0.2 Thermally conductive adhesive 50 psi 0.16 Operating Temperature 100 C 100 psi 0.15 200 psi 0.14 FEATURES AND BENEFITS 2 Thermal impedance: 0.2C-in/W 25 psi Willnot drip or run likegrease 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three- layer laminate. The Hi-Flow coatings are phase change Phase changecompound coated on a fiberglass carrier compounds. These layers willrespond to heat and pressure induced stresses. The overall conductivity of the material inpost-phase change,thin filmproducts is highlydependent upon TYPICAL APPLICATIONS the heat and pressure applied. This characteristic is not accounted for inASTM D5470. Please contact Bergquist Product Management ifadditionalspecifications are required. Computer and peripherals 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70C prior to test. The recorded value includes interfacialthermal resistance. These values are provided As a thermal interface where bare die is exposed and for reference only. Actual application performance is directly related to the surface roughness, needs to be heat sinked flatness and pressure applied. BERGQUIST HI FLOW THF 1600Gconsists of a thermally conductive 55C phase change compound coated on a GENERAL INFORMATION fiberglass web . BERGQUIST HI FLOW THF 1600G is For safe handling information on this product, consult the Safety designed as a thermal interface material between a computer Data Sheet, (SDS). processor and a heat sink . Above the phase changetemperature, BERGQUIST HIFLOW Not for product specifications The technicaldata contained herein are intended as reference THF 1600Gwets-out the thermal interface surfaces and flows only. Please contact your local quality department for to produce low thermal impedance . The material requires assistance and recommendations on specifications for this pressure of the assembly to cause flow . BERGQUIST HI product. FLOW THF 1600Gwillnot drip or run likegrease . APPLICATION METHODS TYPICAL PROPERTIES Physical Properties 1. Hand-apply to 40- 50C heat sink. The heat sink is heated inan oven or by a heat gun to between 40- 50C allowing the Elongation ,45 to warp and fill,ASTM D882A,% 40 BERGQUIST HIFLOW THF 1600Gpad to be applied likean TensileStrength ,ASTM D882A,MPa 3 adhesive pad. The heat sink is then cooled to room Phase Change Temperature ,ASTM D3418,C 55 temperature and packaged. Flammability Rating, UL 94 V-0 2. Hand-apply to 20- 35C heat sink. BERGQUIST HIFLOW Electrical Properties THF 1600Gcanbe applied to a room temperature heat sink DielectricBreakdown Voltage ,ASTM D149,Vac 300 with the assistance of a foam roller. The pad is positioned on DielectricConstant ,ASTM D150 1,000 Hz 3.5 the heat sink and a hand roller is used to apply pressure of 30 8 psi. Volume Resistivity ,ASTM D257,ohm-meter 110 Thermal Properties 3. Automated equipment with 30 psi pressure. A pick-and- (1) place automated dispensing unit can be used to apply Thermal Conductivity ,ASTM D5470,W/(m-K) 1.6 BERGQUIST HI FLOW THF 1600Gto a room temperature heat sink. The placement head should have a soft siliconeTDS BERGQUIST HIFLOW THF 1600G, April -2020 more United States or foreign patents or patent applications. rubber pad, and apply 30 psi pressure to the pad on transfer Trademark usage to the 20- 35C heat sink. Except as otherwise noted, alltrademarks inthis document are trademarks of Henkel Corporation inthe U.S. and elsewhere. denotes a trademark registered inthe U.S. Patent and Trademark Office. CONFIGURATIONS AVAILABLE BERGQUIST HIFLOW THF 1600G are supplied in: Reference 2 Sheet form, roll form and die-cut parts With or without pressure- sensitive adhesive Conversions (C x 1.8)+ 32 =F kV/mm x 25.4 =V/mil mm /25.4 =inches N x 0.225=lb/F N/mm x 5.71=lb/in psi x 145 =N/mm MPa =N/mm Nm x 8.851 = lbin Nm x 0.738=lbft Nmm x 0.142 =ozin mPas =cP Disclaimer Note: The information provided inthis TechnicalData Sheet (TDS) includingthe recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS.The product can have a variety of different applications as well as differingapplication and working conditions inyour environment that are beyond our control. Henkel is, therefore, not liablefor the suitability of our product for the production processes and conditions inrespect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liabilityinrespect of the information in the TechnicalData Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except inrelation to death or personal injury caused by our negligenceand any liabilityunder any applicable mandatory product liabilitylaw. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV,Henkel Nederland BV,Henkel Technologies France SAS and Henkel France SA please additionally note the following: Incase Henkel would be nevertheless held liable,on whatever legalground, Henkels liabilitywillinno event exceed the amount of the concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S.the following disclaimer is applicable: The information provided inthis TechnicalData Sheet (TDS) includingthe recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. Henkel is, therefore, not liablefor the suitability of our product for the production processes and conditions inrespect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liabilityinrespect of the information inthe TechnicalData Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except ifotherwise explicitly agreed and except inrelation to death or personal injury caused by our negligenceand any liabilityunder any applicable mandatory product liabilitylaw. In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: The data contained herein are furnished for information only and are believed to be reliable.We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user s responsibility to determine suitability for the user s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved inthe handling and use thereof. In lightof the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporations products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide.This product may be covered by one or Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.2891.8000 For the most direct access to local sales and technical support visit: www.henkel.com/electronics

Tariff Desc

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
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